JPWO2021210384A1 - - Google Patents

Info

Publication number
JPWO2021210384A1
JPWO2021210384A1 JP2022515281A JP2022515281A JPWO2021210384A1 JP WO2021210384 A1 JPWO2021210384 A1 JP WO2021210384A1 JP 2022515281 A JP2022515281 A JP 2022515281A JP 2022515281 A JP2022515281 A JP 2022515281A JP WO2021210384 A1 JPWO2021210384 A1 JP WO2021210384A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022515281A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021210384A1 publication Critical patent/JPWO2021210384A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2022515281A 2020-04-14 2021-03-30 Pending JPWO2021210384A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020072044 2020-04-14
JP2020162918 2020-09-29
PCT/JP2021/013469 WO2021210384A1 (ja) 2020-04-14 2021-03-30 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
JPWO2021210384A1 true JPWO2021210384A1 (ja) 2021-10-21

Family

ID=78084278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022515281A Pending JPWO2021210384A1 (ja) 2020-04-14 2021-03-30

Country Status (3)

Country Link
JP (1) JPWO2021210384A1 (ja)
TW (1) TW202146554A (ja)
WO (1) WO2021210384A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320065A (ja) * 1989-03-27 1991-01-29 Nitto Denko Corp 半導体装置
JP2015137346A (ja) * 2014-01-24 2015-07-30 サンアプロ株式会社 エポキシ樹脂硬化促進剤
JP6386907B2 (ja) * 2014-12-26 2018-09-05 株式会社ダイセル 硬化性エポキシ樹脂組成物
KR102378915B1 (ko) * 2015-01-30 2022-03-24 산아프로 가부시키가이샤 에폭시 수지 경화 촉진제
JP2017088654A (ja) * 2015-11-04 2017-05-25 サンアプロ株式会社 エポキシ樹脂硬化促進剤、及び半導体封止用エポキシ樹脂組成物
JP6939687B2 (ja) * 2018-04-16 2021-09-22 味の素株式会社 樹脂組成物
WO2020067016A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Also Published As

Publication number Publication date
TW202146554A (zh) 2021-12-16
WO2021210384A1 (ja) 2021-10-21

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