JPWO2021206115A1 - - Google Patents

Info

Publication number
JPWO2021206115A1
JPWO2021206115A1 JP2022514103A JP2022514103A JPWO2021206115A1 JP WO2021206115 A1 JPWO2021206115 A1 JP WO2021206115A1 JP 2022514103 A JP2022514103 A JP 2022514103A JP 2022514103 A JP2022514103 A JP 2022514103A JP WO2021206115 A1 JPWO2021206115 A1 JP WO2021206115A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022514103A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021206115A1 publication Critical patent/JPWO2021206115A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
JP2022514103A 2020-04-10 2021-04-07 Pending JPWO2021206115A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020070801 2020-04-10
PCT/JP2021/014718 WO2021206115A1 (en) 2020-04-10 2021-04-07 Adhesive composition, adhesive film, connected structure, and production method therefor

Publications (1)

Publication Number Publication Date
JPWO2021206115A1 true JPWO2021206115A1 (en) 2021-10-14

Family

ID=78024142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514103A Pending JPWO2021206115A1 (en) 2020-04-10 2021-04-07

Country Status (5)

Country Link
JP (1) JPWO2021206115A1 (en)
KR (1) KR20220162734A (en)
CN (1) CN115349003B (en)
TW (1) TW202140710A (en)
WO (1) WO2021206115A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367076B2 (en) 1994-10-24 2003-01-14 日立化成工業株式会社 Connection structure and connection method for electrical members
JPH08148213A (en) 1994-11-25 1996-06-07 Hitachi Chem Co Ltd Connection member and structure and method for connecting electrode using the same
JP4032439B2 (en) * 1996-05-23 2008-01-16 日立化成工業株式会社 Connection member, electrode connection structure and connection method using the connection member
US5865936A (en) * 1997-03-28 1999-02-02 National Starch And Chemical Investment Holding Corporation Rapid curing structural acrylic adhesive
JPH1150032A (en) 1997-08-04 1999-02-23 Hitachi Chem Co Ltd Connection member for circuit and circuit board
KR100673778B1 (en) * 2005-08-19 2007-01-24 제일모직주식회사 Fast curable anisotropic conductive film composition, anisotropic conductive film using the composition and method for fabricating the same
US20100139947A1 (en) 2007-05-15 2010-06-10 Hitachi Chemical Company, Ltd. Circuit-connecting material, and connection structure for circuit member
CN101849266A (en) 2007-11-12 2010-09-29 日立化成工业株式会社 Circuit connecting material and structure for connecting circuit member
JP2010077317A (en) * 2008-09-26 2010-04-08 Three M Innovative Properties Co Adhesive composition, adhesive film and usage thereof
JP2011100605A (en) 2009-11-05 2011-05-19 Hitachi Chem Co Ltd Circuit connecting material and connection structure of circuit member using the same
JP2012241063A (en) * 2011-05-17 2012-12-10 Nitto Denko Corp Adhesive sheet for producing semiconductor device
JP7153489B2 (en) * 2018-07-09 2022-10-14 信越ポリマー株式会社 Electromagnetic wave shielding film, manufacturing method thereof, and printed wiring board with electromagnetic wave shielding film

Also Published As

Publication number Publication date
KR20220162734A (en) 2022-12-08
TW202140710A (en) 2021-11-01
CN115349003A (en) 2022-11-15
CN115349003B (en) 2024-02-06
WO2021206115A1 (en) 2021-10-14

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240208