JPWO2021186686A5 - - Google Patents
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- Publication number
- JPWO2021186686A5 JPWO2021186686A5 JP2022507973A JP2022507973A JPWO2021186686A5 JP WO2021186686 A5 JPWO2021186686 A5 JP WO2021186686A5 JP 2022507973 A JP2022507973 A JP 2022507973A JP 2022507973 A JP2022507973 A JP 2022507973A JP WO2021186686 A5 JPWO2021186686 A5 JP WO2021186686A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- metal structure
- mobile terminal
- main body
- generating component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 7
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- 239000012530 fluid Substances 0.000 claims 1
Claims (5)
熱を輸送する流体を封入し、前記発熱部品と接触する本体部と、前記本体部の底部の縁から突出する突出部とを有するベーパーチャンバーと、
前記本体部が挿入される貫通孔を有する板状の金属製構造体と、
前記金属製構造体の法線方向視において前記金属製構造体と重なって配置される前記突出部と前記金属製構造体とを接着する熱伝導性接着部材と、を備え、
前記本体部と前記金属製構造体との間には間隙が形成され、
前記熱伝導性接着部材は、前記突出部と前記金属製構造体との間において幅を変えて配置される、
携帯端末。 a heat-generating component;
a vapor chamber that encloses a heat-transporting fluid and has a main body that contacts the heat-generating component; and a protrusion that protrudes from a bottom edge of the main body;
a plate-shaped metal structure having a through hole into which the main body is inserted;
a thermally conductive adhesive member for bonding the metal structure and the protruding portion that overlaps the metal structure when viewed in the normal direction of the metal structure;
A gap is formed between the main body and the metal structure,
The thermally conductive adhesive member is arranged with varying widths between the protrusion and the metal structure.
mobile terminal.
前記発熱部品からの熱の伝導を抑制する部分には第１の幅よりも広い第２の幅で配置される、
請求項１に記載の携帯端末。 The thermally conductive adhesive member is arranged with a first width in a portion that promotes conduction of heat from the heat-generating component,
A second width wider than the first width is arranged in the portion that suppresses the conduction of heat from the heat-generating component,
The mobile terminal according to claim 1.
請求項１または２に記載の携帯端末。 the metal structure is in contact with an inner wall surface of a housing of the mobile terminal;
3. The mobile terminal according to claim 1 or 2.
請求項１から３のいずれか一項に記載の携帯端末。 The thermally conductive adhesive member is a double-sided tape,
The mobile terminal according to any one of claims 1 to 3.
請求項１から４のいずれか一項に記載の携帯端末。 the vapor chamber is in contact with the heat-generating component at a portion of the main body;
The mobile terminal according to any one of claims 1 to 4.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/012372 WO2021186686A1 (en) | 2020-03-19 | 2020-03-19 | Mobile terminal |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021186686A1 JPWO2021186686A1 (en) | 2021-09-23 |
| JPWO2021186686A5 true JPWO2021186686A5 (en) | 2022-12-02 |
| JP7541570B2 JP7541570B2 (en) | 2024-08-28 |
Family
ID=77771998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022507973A Active JP7541570B2 (en) | 2020-03-19 | 2020-03-19 | Mobile devices |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7541570B2 (en) |
| WO (1) | WO2021186686A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113873858B (en) * | 2021-11-30 | 2022-04-22 | 荣耀终端有限公司 | Housing and electronic device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11237193A (en) * | 1998-02-19 | 1999-08-31 | Furukawa Electric Co Ltd:The | Plate type heat pipe and mounting structure using it |
| JP5379874B2 (en) | 2012-02-24 | 2013-12-25 | 古河電気工業株式会社 | Sheet-like heat pipe and electronic device provided with sheet-like heat pipe |
| US9244504B2 (en) | 2013-09-24 | 2016-01-26 | Asia Vital Components Co., Ltd. | Heat dissipation structure for hand-held mobile device |
| JP5665948B1 (en) | 2013-11-14 | 2015-02-04 | 株式会社フジクラ | Cooling structure for portable electronic devices |
| JP5945047B1 (en) | 2015-08-19 | 2016-07-05 | 株式会社フジクラ | Thermal diffusion plate for portable electronic devices |
| JP2020193715A (en) | 2017-08-04 | 2020-12-03 | 株式会社村田製作所 | Vapor chamber |
-
2020
- 2020-03-19 JP JP2022507973A patent/JP7541570B2/en active Active
- 2020-03-19 WO PCT/JP2020/012372 patent/WO2021186686A1/en active Application Filing
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