JPWO2021182207A1 - - Google Patents

Info

Publication number
JPWO2021182207A1
JPWO2021182207A1 JP2022505956A JP2022505956A JPWO2021182207A1 JP WO2021182207 A1 JPWO2021182207 A1 JP WO2021182207A1 JP 2022505956 A JP2022505956 A JP 2022505956A JP 2022505956 A JP2022505956 A JP 2022505956A JP WO2021182207 A1 JPWO2021182207 A1 JP WO2021182207A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022505956A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021182207A1 publication Critical patent/JPWO2021182207A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2022505956A 2020-03-13 2021-03-03 Pending JPWO2021182207A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020044609 2020-03-13
PCT/JP2021/008066 WO2021182207A1 (en) 2020-03-13 2021-03-03 Resin material and multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPWO2021182207A1 true JPWO2021182207A1 (en) 2021-09-16

Family

ID=77671628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022505956A Pending JPWO2021182207A1 (en) 2020-03-13 2021-03-03

Country Status (5)

Country Link
JP (1) JPWO2021182207A1 (en)
KR (1) KR20220152533A (en)
CN (1) CN115279808A (en)
TW (1) TW202140623A (en)
WO (1) WO2021182207A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240100370A (en) * 2021-11-18 2024-07-01 가부시끼가이샤 레조낙 Resin compositions, cured products, sheets, laminates and printed wiring boards
WO2023210038A1 (en) * 2022-04-25 2023-11-02 日本化薬株式会社 Bismaleimide compound, resin composition including same, cured object therefrom, and semiconductor element
TWI835402B (en) 2022-11-11 2024-03-11 南亞塑膠工業股份有限公司 Resin composition
JP7351396B1 (en) 2022-12-12 2023-09-27 東洋インキＳｃホールディングス株式会社 Resin compositions, laminate sheets, prepregs, cured products, substrates with cured products, and electronic devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312321A (en) * 1987-06-15 1988-12-20 Matsushita Electric Works Ltd Curable polymer composition
WO2001010964A1 (en) * 1999-08-06 2001-02-15 Pi R & D Co., Ltd. Composition for polyimide electrodeposition and method of forming patterned polyimide film with the same
JP4547988B2 (en) * 2004-05-19 2010-09-22 住友ベークライト株式会社 Resin composition and semiconductor device produced using resin composition
JP5386159B2 (en) * 2007-12-07 2014-01-15 旭化成イーマテリアルズ株式会社 Adhesive polyimide with high solder heat resistance
WO2016114286A1 (en) 2015-01-13 2016-07-21 日立化成株式会社 Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
JPWO2016171101A1 (en) * 2015-04-20 2018-02-15 宇部興産株式会社 Polyimide, curable resin composition, cured product
JP7442255B2 (en) 2016-12-06 2024-03-04 三菱瓦斯化学株式会社 Resin composition for electronic materials
US20220179310A1 (en) * 2019-04-02 2022-06-09 Nippon Kayaku Kabushiki Kaisha Bismaleimide compound, photosensitive resin composition using same, cured product thereof, and semiconductor element
JP2021025051A (en) * 2019-08-01 2021-02-22 積水化学工業株式会社 Resin material and multilayer printed wiring board
WO2021020563A1 (en) * 2019-08-01 2021-02-04 積水化学工業株式会社 Resin material and multilayer printed wiring board

Also Published As

Publication number Publication date
CN115279808A (en) 2022-11-01
WO2021182207A1 (en) 2021-09-16
KR20220152533A (en) 2022-11-16
TW202140623A (en) 2021-11-01

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Legal Events

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Effective date: 20231204