JPWO2021177261A1 - - Google Patents

Info

Publication number
JPWO2021177261A1
JPWO2021177261A1 JP2021539369A JP2021539369A JPWO2021177261A1 JP WO2021177261 A1 JPWO2021177261 A1 JP WO2021177261A1 JP 2021539369 A JP2021539369 A JP 2021539369A JP 2021539369 A JP2021539369 A JP 2021539369A JP WO2021177261 A1 JPWO2021177261 A1 JP WO2021177261A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021539369A
Other languages
Japanese (ja)
Other versions
JP6991400B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021177261A1 publication Critical patent/JPWO2021177261A1/ja
Application granted granted Critical
Publication of JP6991400B1 publication Critical patent/JP6991400B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2021539369A 2020-03-02 2021-03-02 Ground connection drawer film Active JP6991400B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020034676 2020-03-02
JP2020034676 2020-03-02
PCT/JP2021/007804 WO2021177261A1 (en) 2020-03-02 2021-03-02 Ground connection withdrawing film

Publications (2)

Publication Number Publication Date
JPWO2021177261A1 true JPWO2021177261A1 (en) 2021-09-10
JP6991400B1 JP6991400B1 (en) 2022-01-13

Family

ID=77614283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021539369A Active JP6991400B1 (en) 2020-03-02 2021-03-02 Ground connection drawer film

Country Status (5)

Country Link
JP (1) JP6991400B1 (en)
KR (1) KR20220149593A (en)
CN (1) CN115053642A (en)
TW (1) TW202202337A (en)
WO (1) WO2021177261A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2759187B2 (en) * 1995-02-01 1998-05-28 謙三 村上 Seat panel mounting method and mounting structure
JP2003086907A (en) 2001-06-29 2003-03-20 Tatsuta Electric Wire & Cable Co Ltd Shielded flexible printed wiring board
JP2009176761A (en) * 2006-12-27 2009-08-06 Hitachi Chem Co Ltd Conductive base substrate for plating, manufacturing method thereof, method for manufacturing base substrate with conductor layer pattern using the method, base substrate with conductor layer pattern, and translucent member of shielding electromagnetic wave
JP2012180583A (en) * 2011-03-03 2012-09-20 Sakai Electronic Industry Co Ltd Long metal foil with multiple pores and method for manufacturing the same
KR102302011B1 (en) * 2013-05-29 2021-09-13 타츠타 전선 주식회사 Manufacturing method for electromagnetic wave shielding film
JP6349250B2 (en) 2014-12-24 2018-06-27 タツタ電線株式会社 Shield printed wiring board
KR102267570B1 (en) * 2017-02-08 2021-06-18 타츠타 전선 주식회사 Electromagnetic shielding films, shielding printed wiring boards and electronic devices
KR101912542B1 (en) * 2017-10-25 2019-01-14 (주)크린앤사이언스 lectro Magnetic Shielding Materials Using Perforated Metal Foil and Process for Producing The Same

Also Published As

Publication number Publication date
WO2021177261A1 (en) 2021-09-10
CN115053642A (en) 2022-09-13
JP6991400B1 (en) 2022-01-13
TW202202337A (en) 2022-01-16
KR20220149593A (en) 2022-11-08

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