JPWO2021176812A1 - - Google Patents

Info

Publication number
JPWO2021176812A1
JPWO2021176812A1 JP2022504984A JP2022504984A JPWO2021176812A1 JP WO2021176812 A1 JPWO2021176812 A1 JP WO2021176812A1 JP 2022504984 A JP2022504984 A JP 2022504984A JP 2022504984 A JP2022504984 A JP 2022504984A JP WO2021176812 A1 JPWO2021176812 A1 JP WO2021176812A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022504984A
Other versions
JP7455955B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021176812A1 publication Critical patent/JPWO2021176812A1/ja
Application granted granted Critical
Publication of JP7455955B2 publication Critical patent/JP7455955B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
JP2022504984A 2020-03-02 2020-12-22 感光性転写材料、及び回路配線の製造方法 Active JP7455955B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020034792 2020-03-02
JP2020034792 2020-03-02
PCT/JP2020/048055 WO2021176812A1 (ja) 2020-03-02 2020-12-22 感光性転写材料、及び回路配線の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021176812A1 true JPWO2021176812A1 (ja) 2021-09-10
JP7455955B2 JP7455955B2 (ja) 2024-03-26

Family

ID=77613195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022504984A Active JP7455955B2 (ja) 2020-03-02 2020-12-22 感光性転写材料、及び回路配線の製造方法

Country Status (3)

Country Link
JP (1) JP7455955B2 (ja)
TW (1) TW202136062A (ja)
WO (1) WO2021176812A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093796A (ja) * 2005-09-27 2007-04-12 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
WO2009133817A1 (ja) * 2008-04-28 2009-11-05 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
WO2009147913A1 (ja) * 2008-06-02 2009-12-10 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093796A (ja) * 2005-09-27 2007-04-12 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
WO2009133817A1 (ja) * 2008-04-28 2009-11-05 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
WO2009147913A1 (ja) * 2008-06-02 2009-12-10 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法

Also Published As

Publication number Publication date
WO2021176812A1 (ja) 2021-09-10
TW202136062A (zh) 2021-10-01
JP7455955B2 (ja) 2024-03-26

Similar Documents

Publication Publication Date Title
BR112023012656A2 (ja)
BR112021014123A2 (ja)
JPWO2022163778A1 (ja)
BR102021015500A2 (ja)
BR112022009896A2 (ja)
BR102021007058A2 (ja)
BR102020022030A2 (ja)
BR112023011738A2 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011539A2 (ja)
BR112023011610A2 (ja)
BR112023008976A2 (ja)
BR112023009656A2 (ja)
BR112023006729A2 (ja)
BR102021016176A2 (ja)
BR102021015566A2 (ja)
BR102021015450A8 (ja)
JPWO2022039027A1 (ja)
BR102021015247A2 (ja)
BR102021015220A2 (ja)
BR102021014056A2 (ja)
BR102021014044A2 (ja)
BR102021013929A2 (ja)
BR112021017747A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220706

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230509

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230629

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230721

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20231003

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231222

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20240104

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240313

R150 Certificate of patent or registration of utility model

Ref document number: 7455955

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150