JPWO2021172294A1 - - Google Patents

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Publication number
JPWO2021172294A1
JPWO2021172294A1 JP2022503621A JP2022503621A JPWO2021172294A1 JP WO2021172294 A1 JPWO2021172294 A1 JP WO2021172294A1 JP 2022503621 A JP2022503621 A JP 2022503621A JP 2022503621 A JP2022503621 A JP 2022503621A JP WO2021172294 A1 JPWO2021172294 A1 JP WO2021172294A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022503621A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021172294A1 publication Critical patent/JPWO2021172294A1/ja
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/187Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates
    • C01B33/193Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates of aqueous solutions of silicates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28Compounds of silicon
    • C09C1/30Silicic acid
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28Compounds of silicon
    • C09C1/30Silicic acid
    • C09C1/3009Physical treatment, e.g. grinding; treatment with ultrasonic vibrations
    • C09C1/3027Drying, calcination
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28Compounds of silicon
    • C09C1/30Silicic acid
    • C09C1/3081Treatment with organo-silicon compounds
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/80Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/82Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/30Particle morphology extending in three dimensions
    • C01P2004/32Spheres
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/30Particle morphology extending in three dimensions
    • C01P2004/32Spheres
    • C01P2004/34Spheres hollow
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/64Nanometer sized, i.e. from 1-100 nanometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/10Solid density
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/14Pore volume
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/19Oil-absorption capacity, e.g. DBP values

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
JP2022503621A 2020-02-27 2021-02-22 Pending JPWO2021172294A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020032046 2020-02-27
JP2020161379 2020-09-25
JP2020161378 2020-09-25
PCT/JP2021/006698 WO2021172294A1 (ja) 2020-02-27 2021-02-22 中空シリカ粒子及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2021172294A1 true JPWO2021172294A1 (ja) 2021-09-02

Family

ID=77490482

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022503621A Pending JPWO2021172294A1 (ja) 2020-02-27 2021-02-22
JP2022503620A Pending JPWO2021172293A1 (ja) 2020-02-27 2021-02-22

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022503620A Pending JPWO2021172293A1 (ja) 2020-02-27 2021-02-22

Country Status (6)

Country Link
US (2) US20220411275A1 (ja)
EP (2) EP4112549A1 (ja)
JP (2) JPWO2021172294A1 (ja)
KR (2) KR20220144809A (ja)
CN (3) CN115210179B (ja)
WO (2) WO2021172293A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022103683A (ja) * 2020-12-28 2022-07-08 日揮触媒化成株式会社 シリカ系中空粒子及びその製造方法、並びに樹脂組成物
WO2023100676A1 (ja) * 2021-11-30 2023-06-08 Agc株式会社 中空シリカ粒子及びその製造方法
WO2023140378A1 (ja) * 2022-01-21 2023-07-27 花王株式会社 中空シリカ粒子の製造方法
JP2023128890A (ja) * 2022-03-04 2023-09-14 宇部エクシモ株式会社 中空無機粒子、該中空無機粒子を含む樹脂組成物、該樹脂組成物を用いた半導体用パッケージ、および前記中空無機粒子の製造方法
WO2023175994A1 (ja) * 2022-03-18 2023-09-21 株式会社アドマテックス 中空無機粒子材料及びその製造方法、無機フィラー、スラリー組成物、並びに樹脂組成物
WO2023189785A1 (ja) * 2022-03-31 2023-10-05 日揮触媒化成株式会社 中空シリカ粒子の分散液、及びその製造方法
WO2023218948A1 (ja) * 2022-05-09 2023-11-16 Agc株式会社 シリカ粒子分散液
CN116496647B (zh) * 2022-11-11 2024-01-16 无锡普天铁心股份有限公司 一种用于取向硅钢表面改性的绝缘涂液及其制备方法
CN117342569B (zh) * 2023-03-24 2024-05-10 高林 亚微米级高纯度SiO2空心微球的可控性制备方法及其产品

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1129318A (ja) 1997-05-06 1999-02-02 Nippon Millipore Kk ミクロンサイズの球状シリカ粒子とその製造法
JP4244323B2 (ja) 2004-01-26 2009-03-25 電気化学工業株式会社 球状無機質中空粉体およびその製造方法、樹脂組成物
EP1972598B1 (en) 2005-11-25 2016-06-15 JGC Catalysts and Chemicals Ltd. Hollow silica microparticle, composition for transparent coating formation containing the same, and substrate with transparent coating
JP5199569B2 (ja) 2006-06-27 2013-05-15 パナソニック株式会社 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板
JP5364277B2 (ja) * 2008-02-28 2013-12-11 花王株式会社 中空シリカ粒子
KR20110065539A (ko) 2008-09-29 2011-06-15 다우 글로벌 테크놀로지스 엘엘씨 적층된 천공된 흡음 발포체
JP5350847B2 (ja) * 2009-03-19 2013-11-27 花王株式会社 板状シリカ粒子の製造方法
JP5358273B2 (ja) * 2009-05-01 2013-12-04 電気化学工業株式会社 無機質中空粉体、その製造方法及びその用途
JP5614968B2 (ja) * 2009-10-22 2014-10-29 株式会社Adeka 疎水性コアシェルシリカ粒子、中空シリカ粒子およびこれらの製造方法
JP5513364B2 (ja) * 2010-12-24 2014-06-04 花王株式会社 中空シリカ粒子
JP5864299B2 (ja) 2012-02-24 2016-02-17 味の素株式会社 樹脂組成物
CN103937241A (zh) * 2014-05-13 2014-07-23 哈尔滨理工大学 一种基于聚酰亚胺基体纳米SiO2空心球复合材料的制备方法
JP2017071526A (ja) * 2015-10-06 2017-04-13 株式会社トクヤマシルテック 溶媒に対して良好な懸濁プロファイルを有するシリカバルーン材料。
JP6953114B2 (ja) 2016-06-21 2021-10-27 扶桑化学工業株式会社 シリカ系中空粒子、コアシェル粒子及びポリスチレン粒子、並びに、それらの製造方法
CN107176610B (zh) * 2017-05-05 2019-03-01 浙江理工大学 一种二氧化硅中空微球及其制备方法
CN116924418A (zh) * 2017-12-26 2023-10-24 Agc株式会社 中空二氧化硅颗粒的制造方法
JP6548282B1 (ja) 2018-08-31 2019-07-24 株式会社オリンピア 遊技機
JP2020161379A (ja) 2019-03-27 2020-10-01 古河電気工業株式会社 複合ケーブル
JP2020161378A (ja) 2019-03-27 2020-10-01 Fdk株式会社 蓄電デバイス及び蓄電デバイスの製造方法
CN111232993B (zh) 2020-03-06 2021-09-14 山东国瓷功能材料股份有限公司 一种5g高频用超低介电常数中空二氧化硅及其制备方法

Also Published As

Publication number Publication date
CN118062853A (zh) 2024-05-24
EP4112551A1 (en) 2023-01-04
CN115190867A (zh) 2022-10-14
US20220396490A1 (en) 2022-12-15
WO2021172293A1 (ja) 2021-09-02
CN115190867B (zh) 2024-03-01
CN115210179B (zh) 2024-03-29
EP4112549A1 (en) 2023-01-04
KR20220144808A (ko) 2022-10-27
US20220411275A1 (en) 2022-12-29
JPWO2021172293A1 (ja) 2021-09-02
CN115210179A (zh) 2022-10-18
WO2021172294A1 (ja) 2021-09-02
KR20220144809A (ko) 2022-10-27

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