JPWO2021171858A1 - - Google Patents

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Publication number
JPWO2021171858A1
JPWO2021171858A1 JP2022503168A JP2022503168A JPWO2021171858A1 JP WO2021171858 A1 JPWO2021171858 A1 JP WO2021171858A1 JP 2022503168 A JP2022503168 A JP 2022503168A JP 2022503168 A JP2022503168 A JP 2022503168A JP WO2021171858 A1 JPWO2021171858 A1 JP WO2021171858A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022503168A
Other versions
JP7385734B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021171858A1 publication Critical patent/JPWO2021171858A1/ja
Application granted granted Critical
Publication of JP7385734B2 publication Critical patent/JP7385734B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/20—Particle morphology extending in two dimensions, e.g. plate-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Laminated Bodies (AREA)
JP2022503168A 2020-02-28 2021-01-25 中空粒子、樹脂組成物、ならびに該樹脂組成物を用いた樹脂成形体および積層体 Active JP7385734B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020033946 2020-02-28
JP2020033946 2020-02-28
PCT/JP2021/002364 WO2021171858A1 (ja) 2020-02-28 2021-01-25 中空粒子、樹脂組成物、ならびに該樹脂組成物を用いた樹脂成形体および積層体

Publications (2)

Publication Number Publication Date
JPWO2021171858A1 true JPWO2021171858A1 (ja) 2021-09-02
JP7385734B2 JP7385734B2 (ja) 2023-11-22

Family

ID=77489957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022503168A Active JP7385734B2 (ja) 2020-02-28 2021-01-25 中空粒子、樹脂組成物、ならびに該樹脂組成物を用いた樹脂成形体および積層体

Country Status (5)

Country Link
JP (1) JP7385734B2 (ja)
KR (1) KR20220132584A (ja)
CN (1) CN115175873A (ja)
TW (1) TW202200500A (ja)
WO (1) WO2021171858A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006143487A (ja) * 2004-11-16 2006-06-08 Nissan Motor Co Ltd 板状アルミナ粒子、板状アルミナ粒子の製造方法、樹脂組成物及び樹脂組成物の製造方法
KR20180086616A (ko) * 2017-01-23 2018-08-01 한국산업기술대학교산학협력단 ZnO 무기주형입자를 이용한 소듐실리케이트부터의 중공 실리카 입자 제조방법
CN108483451A (zh) * 2018-05-25 2018-09-04 苏州大学 空心结构微/纳米材料的制备方法
JP2019183005A (ja) * 2018-04-11 2019-10-24 Ａｇｃ株式会社 フッ素樹脂シート、積層体及びそれらの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4857801B2 (ja) 2005-02-16 2012-01-18 コニカミノルタオプト株式会社 反射防止フィルム、反射防止フィルムの製造方法、偏光板及び表示装置
JP2007025329A (ja) 2005-07-19 2007-02-01 Konica Minolta Opto Inc 反射防止フィルム、その製造方法、偏光板及び表示装置
JP2007056158A (ja) 2005-08-25 2007-03-08 Nagoya Institute Of Technology 樹脂組成物およびそれを用いた配線回路基板
CN102471590B (zh) * 2009-07-14 2015-05-20 花王株式会社 低介电树脂组合物
CN115850947A (zh) * 2018-05-28 2023-03-28 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片及印刷线路板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006143487A (ja) * 2004-11-16 2006-06-08 Nissan Motor Co Ltd 板状アルミナ粒子、板状アルミナ粒子の製造方法、樹脂組成物及び樹脂組成物の製造方法
KR20180086616A (ko) * 2017-01-23 2018-08-01 한국산업기술대학교산학협력단 ZnO 무기주형입자를 이용한 소듐실리케이트부터의 중공 실리카 입자 제조방법
JP2019183005A (ja) * 2018-04-11 2019-10-24 Ａｇｃ株式会社 フッ素樹脂シート、積層体及びそれらの製造方法
CN108483451A (zh) * 2018-05-25 2018-09-04 苏州大学 空心结构微/纳米材料的制备方法

Also Published As

Publication number Publication date
JP7385734B2 (ja) 2023-11-22
KR20220132584A (ko) 2022-09-30
CN115175873A (zh) 2022-10-11
TW202200500A (zh) 2022-01-01
WO2021171858A1 (ja) 2021-09-02

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