JPWO2021171416A1 - - Google Patents

Info

Publication number
JPWO2021171416A1
JPWO2021171416A1 JP2022502655A JP2022502655A JPWO2021171416A1 JP WO2021171416 A1 JPWO2021171416 A1 JP WO2021171416A1 JP 2022502655 A JP2022502655 A JP 2022502655A JP 2022502655 A JP2022502655 A JP 2022502655A JP WO2021171416 A1 JPWO2021171416 A1 JP WO2021171416A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022502655A
Other versions
JP7427074B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021171416A1 publication Critical patent/JPWO2021171416A1/ja
Application granted granted Critical
Publication of JP7427074B2 publication Critical patent/JP7427074B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022502655A 2020-02-26 2020-02-26 部品実装機の不調判定装置および不調判定方法 Active JP7427074B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/007709 WO2021171416A1 (ja) 2020-02-26 2020-02-26 部品実装機の不調判定装置および不調判定方法

Publications (2)

Publication Number Publication Date
JPWO2021171416A1 true JPWO2021171416A1 (ja) 2021-09-02
JP7427074B2 JP7427074B2 (ja) 2024-02-02

Family

ID=77492059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022502655A Active JP7427074B2 (ja) 2020-02-26 2020-02-26 部品実装機の不調判定装置および不調判定方法

Country Status (5)

Country Link
US (1) US20230084116A1 (ja)
EP (1) EP4114163A4 (ja)
JP (1) JP7427074B2 (ja)
CN (1) CN114982395B (ja)
WO (1) WO2021171416A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012186260A (ja) * 2011-03-04 2012-09-27 Panasonic Corp 部品実装システム及び部品実装方法
JP2013080746A (ja) * 2011-09-30 2013-05-02 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置の測定方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4707576B2 (ja) * 2006-02-10 2011-06-22 Ｊｕｋｉ株式会社 部品搭載装置
JP2011228377A (ja) * 2010-04-16 2011-11-10 Panasonic Corp 部品実装方法
WO2015004733A1 (ja) * 2013-07-09 2015-01-15 富士機械製造株式会社 検査制御装置、実装システム及び検査制御方法
JP6341760B2 (ja) * 2014-06-02 2018-06-13 ヤマハ発動機株式会社 検出装置、検出方法、基板搬送装置、基板処理装置
JP6674705B2 (ja) * 2015-10-06 2020-04-01 株式会社Ｆｕｊｉ 画像認識装置
JP7253679B2 (ja) 2017-09-28 2023-04-07 パナソニックＩｐマネジメント株式会社 不調検知システムおよび部品実装ラインの不調検知方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012186260A (ja) * 2011-03-04 2012-09-27 Panasonic Corp 部品実装システム及び部品実装方法
JP2013080746A (ja) * 2011-09-30 2013-05-02 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置の測定方法

Also Published As

Publication number Publication date
EP4114163A1 (en) 2023-01-04
JP7427074B2 (ja) 2024-02-02
WO2021171416A1 (ja) 2021-09-02
CN114982395A (zh) 2022-08-30
US20230084116A1 (en) 2023-03-16
CN114982395B (zh) 2023-10-27
EP4114163A4 (en) 2023-04-19

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