JPWO2021153180A1 - - Google Patents

Info

Publication number
JPWO2021153180A1
JPWO2021153180A1 JP2021574579A JP2021574579A JPWO2021153180A1 JP WO2021153180 A1 JPWO2021153180 A1 JP WO2021153180A1 JP 2021574579 A JP2021574579 A JP 2021574579A JP 2021574579 A JP2021574579 A JP 2021574579A JP WO2021153180 A1 JPWO2021153180 A1 JP WO2021153180A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021574579A
Other languages
Japanese (ja)
Other versions
JP7447154B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021153180A1 publication Critical patent/JPWO2021153180A1/ja
Application granted granted Critical
Publication of JP7447154B2 publication Critical patent/JP7447154B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/638—Removal thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021574579A 2020-01-31 2021-01-07 Method for manufacturing ceramic structures Active JP7447154B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020014571 2020-01-31
JP2020014571 2020-01-31
PCT/JP2021/000309 WO2021153180A1 (en) 2020-01-31 2021-01-07 Ceramic structure manufacturing method

Publications (2)

Publication Number Publication Date
JPWO2021153180A1 true JPWO2021153180A1 (en) 2021-08-05
JP7447154B2 JP7447154B2 (en) 2024-03-11

Family

ID=77079337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021574579A Active JP7447154B2 (en) 2020-01-31 2021-01-07 Method for manufacturing ceramic structures

Country Status (4)

Country Link
JP (1) JP7447154B2 (en)
KR (1) KR20220120656A (en)
CN (1) CN115004353A (en)
WO (1) WO2021153180A1 (en)

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1085192C (en) * 1995-11-08 2002-05-22 松下电器产业株式会社 Ceramic die mould degreasing method and device thereof
JP2001110879A (en) * 1999-06-09 2001-04-20 Ibiden Co Ltd Ceramic substrate for semiconductor manufacturing/ inspection device
JP2001089248A (en) * 1999-09-22 2001-04-03 Ngk Spark Plug Co Ltd Process for producing ceramic substrate and jig used for the same
JP2004214690A (en) * 2000-02-07 2004-07-29 Ibiden Co Ltd Ceramic substrate for semiconductor manufacturing and inspection device
JP4646461B2 (en) * 2001-08-10 2011-03-09 京セラ株式会社 Electrode built-in ceramic member and manufacturing method thereof
JP2003128470A (en) * 2001-10-23 2003-05-08 Mitsubishi Materials Corp Method of manufacturing ceramic substrate and porous ceramic plate
JP2004018325A (en) * 2002-06-18 2004-01-22 Ngk Insulators Ltd Method of producing sintered compact, sintered compact, member for sintering, method of producing ceramic multilayered substrate and ceramic multilayered substrate
JP4328891B2 (en) * 2002-09-30 2009-09-09 Ｄｏｗａメタルテック株式会社 Metal-ceramic composite member mold and manufacturing method
JP4721658B2 (en) * 2004-05-26 2011-07-13 京セラ株式会社 Wafer support member
JP2007232352A (en) * 2005-12-27 2007-09-13 Ibiden Co Ltd Degreasing tool, ceramic molding degreasing method, and method of manufacturing honeycomb structure
JP2008120653A (en) 2006-11-15 2008-05-29 Denso Corp Placing table for firing ceramic honeycomb-formed body
JP4970210B2 (en) * 2007-10-12 2012-07-04 株式会社トクヤマ Ceramic molded body holder
WO2009110400A1 (en) * 2008-03-05 2009-09-11 日本碍子株式会社 Kiln tool plate for firing ceramic
WO2011064854A1 (en) * 2009-11-25 2011-06-03 イビデン株式会社 Process for producing fired ceramic and process for producing honeycomb structure
JP5423632B2 (en) * 2010-01-29 2014-02-19 住友大阪セメント株式会社 Electrostatic chuck device
JP5971629B2 (en) * 2012-04-25 2016-08-17 パナソニックＩｐマネジメント株式会社 Microfluidic device
JP6215668B2 (en) * 2012-11-30 2017-10-18 京セラ株式会社 Ceramic sintered body, flow path member using the same, semiconductor inspection apparatus and semiconductor manufacturing apparatus
JP6119430B2 (en) * 2013-05-31 2017-04-26 住友大阪セメント株式会社 Electrostatic chuck device
US10068783B2 (en) 2013-08-26 2018-09-04 Kyocera Corporation Sample holder
JP2016038194A (en) * 2014-08-12 2016-03-22 東北セラミック株式会社 Setter for defatting and firing
JP6464776B2 (en) * 2014-10-29 2019-02-06 住友金属鉱山株式会社 Cylindrical ceramic sintered body and manufacturing method thereof
JP6410758B1 (en) * 2016-05-24 2018-10-24 三井金属鉱業株式会社 Ceramic lattice
JP6741548B2 (en) * 2016-10-14 2020-08-19 日本碍子株式会社 Member for semiconductor manufacturing apparatus and manufacturing method thereof
US10147610B1 (en) * 2017-05-30 2018-12-04 Lam Research Corporation Substrate pedestal module including metallized ceramic tubes for RF and gas delivery
WO2019088203A1 (en) * 2017-11-02 2019-05-09 日本碍子株式会社 Member for semiconductor production apparatuses, method for producing same, and molding die for same

Also Published As

Publication number Publication date
WO2021153180A1 (en) 2021-08-05
JP7447154B2 (en) 2024-03-11
KR20220120656A (en) 2022-08-30
CN115004353A (en) 2022-09-02

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