JPWO2021149784A1 - - Google Patents
Info
- Publication number
- JPWO2021149784A1 JPWO2021149784A1 JP2021572805A JP2021572805A JPWO2021149784A1 JP WO2021149784 A1 JPWO2021149784 A1 JP WO2021149784A1 JP 2021572805 A JP2021572805 A JP 2021572805A JP 2021572805 A JP2021572805 A JP 2021572805A JP WO2021149784 A1 JPWO2021149784 A1 JP WO2021149784A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020010250 | 2020-01-24 | ||
JP2020010250 | 2020-01-24 | ||
PCT/JP2021/002126 WO2021149784A1 (ja) | 2020-01-24 | 2021-01-22 | 塗布膜形成装置、及び塗布膜形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021149784A1 true JPWO2021149784A1 (ja) | 2021-07-29 |
JP7392740B2 JP7392740B2 (ja) | 2023-12-06 |
Family
ID=76992527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021572805A Active JP7392740B2 (ja) | 2020-01-24 | 2021-01-22 | 塗布膜形成装置、及び塗布膜形成方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7392740B2 (ja) |
TW (1) | TW202141570A (ja) |
WO (1) | WO2021149784A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023140165A (ja) * | 2022-03-22 | 2023-10-04 | キオクシア株式会社 | 半導体製造装置および半導体装置の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03245870A (ja) * | 1990-02-21 | 1991-11-01 | Mitsubishi Electric Corp | 塗布液塗布装置および塗布液塗布方法 |
JP2007189185A (ja) * | 2005-12-15 | 2007-07-26 | Tokyo Electron Ltd | 塗布装置及び塗布方法 |
JP2009016727A (ja) * | 2007-07-09 | 2009-01-22 | Tokyo Electron Ltd | 基板処理装置 |
JP2009021268A (ja) * | 2007-07-10 | 2009-01-29 | Tokyo Electron Ltd | 基板処理装置 |
JP2011159656A (ja) * | 2010-01-29 | 2011-08-18 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2016092356A (ja) * | 2014-11-11 | 2016-05-23 | セイコーエプソン株式会社 | レジスト塗布方法 |
-
2021
- 2021-01-20 TW TW110102058A patent/TW202141570A/zh unknown
- 2021-01-22 JP JP2021572805A patent/JP7392740B2/ja active Active
- 2021-01-22 WO PCT/JP2021/002126 patent/WO2021149784A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03245870A (ja) * | 1990-02-21 | 1991-11-01 | Mitsubishi Electric Corp | 塗布液塗布装置および塗布液塗布方法 |
JP2007189185A (ja) * | 2005-12-15 | 2007-07-26 | Tokyo Electron Ltd | 塗布装置及び塗布方法 |
JP2009016727A (ja) * | 2007-07-09 | 2009-01-22 | Tokyo Electron Ltd | 基板処理装置 |
JP2009021268A (ja) * | 2007-07-10 | 2009-01-29 | Tokyo Electron Ltd | 基板処理装置 |
JP2011159656A (ja) * | 2010-01-29 | 2011-08-18 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2016092356A (ja) * | 2014-11-11 | 2016-05-23 | セイコーエプソン株式会社 | レジスト塗布方法 |
Also Published As
Publication number | Publication date |
---|---|
JP7392740B2 (ja) | 2023-12-06 |
TW202141570A (zh) | 2021-11-01 |
WO2021149784A1 (ja) | 2021-07-29 |
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