JPWO2021149687A1 - - Google Patents

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Publication number
JPWO2021149687A1
JPWO2021149687A1 JP2021572744A JP2021572744A JPWO2021149687A1 JP WO2021149687 A1 JPWO2021149687 A1 JP WO2021149687A1 JP 2021572744 A JP2021572744 A JP 2021572744A JP 2021572744 A JP2021572744 A JP 2021572744A JP WO2021149687 A1 JPWO2021149687 A1 JP WO2021149687A1
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Japan
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JP2021572744A
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JP7231067B2 (ja
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    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
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    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
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US20230335579A1 (en) * 2020-06-29 2023-10-19 Tdk Corporation Thin film capacitor, its manufacturing method, and electronic circuit substrate having the thin film capacitor

Citations (5)

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JPH06140275A (ja) * 1992-10-27 1994-05-20 Matsushita Electron Corp 容量素子
JP2007220985A (ja) * 2006-02-17 2007-08-30 Tdk Corp 薄膜デバイス
JP2008252011A (ja) * 2007-03-30 2008-10-16 Taiyo Yuden Co Ltd 誘電体キャパシタ
JP2009010114A (ja) * 2007-06-27 2009-01-15 Murata Mfg Co Ltd 誘電体薄膜キャパシタ
US20190096986A1 (en) * 2017-09-28 2019-03-28 Taiwan Semiconductor Manufacturing Co., Ltd. Metal insulator metal capacitor structure having high capacitance

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KR20080061154A (ko) * 2006-12-28 2008-07-02 주식회사 하이닉스반도체 반도체 소자의 캐패시터 형성방법
DE102012011036A1 (de) 2012-06-05 2013-12-05 Trw Automotive Gmbh Fahrzeuginsassen-Rückhaltevorrichtung mit adaptivem Kniegassack

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH06140275A (ja) * 1992-10-27 1994-05-20 Matsushita Electron Corp 容量素子
JP2007220985A (ja) * 2006-02-17 2007-08-30 Tdk Corp 薄膜デバイス
JP2008252011A (ja) * 2007-03-30 2008-10-16 Taiyo Yuden Co Ltd 誘電体キャパシタ
JP2009010114A (ja) * 2007-06-27 2009-01-15 Murata Mfg Co Ltd 誘電体薄膜キャパシタ
US20190096986A1 (en) * 2017-09-28 2019-03-28 Taiwan Semiconductor Manufacturing Co., Ltd. Metal insulator metal capacitor structure having high capacitance

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