JPWO2021149410A1 - - Google Patents

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Publication number
JPWO2021149410A1
JPWO2021149410A1 JP2020570579A JP2020570579A JPWO2021149410A1 JP WO2021149410 A1 JPWO2021149410 A1 JP WO2021149410A1 JP 2020570579 A JP2020570579 A JP 2020570579A JP 2020570579 A JP2020570579 A JP 2020570579A JP WO2021149410 A1 JPWO2021149410 A1 JP WO2021149410A1
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JP
Japan
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JP2020570579A
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Japanese (ja)
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JP7081696B2 (en
JPWO2021149410A5 (en
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
JP2020570579A 2020-01-21 2020-12-16 Positive photosensitive resin composition, cured film, laminate, substrate with conductive pattern, manufacturing method of laminate, touch panel and organic EL display device Active JP7081696B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020007333 2020-01-21
JP2020007333 2020-01-21
PCT/JP2020/046911 WO2021149410A1 (en) 2020-01-21 2020-12-16 Positive photosensitive resin composition, cured film, multilayer body, substrate with conductive pattern, method for producing multilayer body, touch panel and organic el display device

Publications (3)

Publication Number Publication Date
JPWO2021149410A1 true JPWO2021149410A1 (en) 2021-07-29
JPWO2021149410A5 JPWO2021149410A5 (en) 2022-02-22
JP7081696B2 JP7081696B2 (en) 2022-06-07

Family

ID=76992186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020570579A Active JP7081696B2 (en) 2020-01-21 2020-12-16 Positive photosensitive resin composition, cured film, laminate, substrate with conductive pattern, manufacturing method of laminate, touch panel and organic EL display device

Country Status (5)

Country Link
JP (1) JP7081696B2 (en)
KR (1) KR102624811B1 (en)
CN (1) CN114945867B (en)
TW (1) TWI826761B (en)
WO (1) WO2021149410A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008185692A (en) * 2007-01-29 2008-08-14 Adeka Corp Positive photosensitive resin composition
WO2016158863A1 (en) * 2015-04-01 2016-10-06 東レ株式会社 Photosensitive colored resin composition
WO2018180548A1 (en) * 2017-03-29 2018-10-04 東レ株式会社 Photosensitive composition, cured film and organic el display device
WO2019059359A1 (en) * 2017-09-25 2019-03-28 東レ株式会社 Colored resin composition, colored film, color filter and liquid crystal display device

Family Cites Families (25)

* Cited by examiner, † Cited by third party
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JP2009020246A (en) * 2007-07-11 2009-01-29 Toray Ind Inc Photosensitive resin composition, and manufacturing method for insulating resin pattern and organic electroluminescence element using it
JP5181968B2 (en) * 2007-09-28 2013-04-10 東レ株式会社 Positive photosensitive composition, method for producing cured film, cured film, and element having cured film
JP5233526B2 (en) * 2008-09-05 2013-07-10 東レ株式会社 Photosensitive composition, cured film formed therefrom, and device having cured film
JP5441542B2 (en) * 2009-07-22 2014-03-12 富士フイルム株式会社 Positive photosensitive resin composition, cured film, interlayer insulating film, organic EL display device, and liquid crystal display device
JP5821481B2 (en) * 2011-09-30 2015-11-24 東レ株式会社 Negative photosensitive resin composition and protective film and touch panel member using the same
JP2014048607A (en) * 2012-09-04 2014-03-17 Sumitomo Chemical Co Ltd Photosensitive resin composition
JP2014052401A (en) * 2012-09-05 2014-03-20 Sumitomo Chemical Co Ltd Photosensitive resin composition
JP2014091790A (en) * 2012-11-05 2014-05-19 Toyo Ink Sc Holdings Co Ltd Resin composition
JP6417669B2 (en) * 2013-03-05 2018-11-07 東レ株式会社 Photosensitive resin composition, protective film, insulating film, and method of manufacturing touch panel
JP2015193758A (en) * 2014-03-31 2015-11-05 東洋インキＳｃホールディングス株式会社 Photosensitive resin composition for overcoat and coating film using the same
CN107079560B (en) * 2014-09-26 2018-09-25 东丽株式会社 Organic el display device
KR102399270B1 (en) * 2014-11-27 2022-05-19 도레이 카부시키가이샤 Resin and photosensitive resin composition
KR101611836B1 (en) * 2015-01-13 2016-04-12 동우 화인켐 주식회사 Photosensitive resin comopsition, photocurable pattern formed from the same and image display comprising the pattern
KR101609234B1 (en) * 2015-01-13 2016-04-05 동우 화인켐 주식회사 Photosensitive resin comopsition, photocurable pattern formed from the same and image display comprising the pattern
JPWO2016143580A1 (en) * 2015-03-06 2017-12-14 東レ株式会社 Photosensitive resin composition and electronic component
CN108475012B (en) * 2015-12-24 2022-07-15 三菱化学株式会社 Photosensitive coloring composition, cured product, coloring spacer and image display device
KR102341566B1 (en) * 2016-03-15 2021-12-21 도레이 카부시키가이샤 A photosensitive resin composition, a cured film, a laminated body, the member for touch panels, and the manufacturing method of a cured film
KR101979980B1 (en) * 2016-03-23 2019-05-17 동우 화인켐 주식회사 Photosensitive Resin Composition
JP6939564B2 (en) * 2016-07-27 2021-09-22 東レ株式会社 Resin composition
EP3505545B1 (en) * 2016-08-25 2021-05-26 FUJIFILM Corporation Curable composition and production process therefor, cured film and production process therefor, color filter, solid-state imaging element, solid-state imaging device, and infrared sensor
JP6866387B2 (en) * 2016-10-04 2021-04-28 富士フイルム株式会社 Dispersion composition, curable composition, cured film, color filter, solid-state image sensor, solid-state image sensor, infrared sensor, method for producing dispersion composition, method for producing curable composition, and method for producing cured film.
WO2019065128A1 (en) * 2017-09-29 2019-04-04 富士フイルム株式会社 Photocurable composition, laminate, and solid-state imaging element
KR102379844B1 (en) * 2017-10-06 2022-03-29 후지필름 가부시키가이샤 The manufacturing method of a cured film, the manufacturing method of a solid-state image sensor, and the manufacturing method of an image display device
JP2019172975A (en) * 2018-03-26 2019-10-10 東レ株式会社 Resin composition, resin sheet and cured film
JP2019185034A (en) * 2018-03-30 2019-10-24 Jsr株式会社 Coloring composition, cured coloring film, color filter, display element, photosensitive element, and light-emitting element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008185692A (en) * 2007-01-29 2008-08-14 Adeka Corp Positive photosensitive resin composition
WO2016158863A1 (en) * 2015-04-01 2016-10-06 東レ株式会社 Photosensitive colored resin composition
WO2018180548A1 (en) * 2017-03-29 2018-10-04 東レ株式会社 Photosensitive composition, cured film and organic el display device
WO2019059359A1 (en) * 2017-09-25 2019-03-28 東レ株式会社 Colored resin composition, colored film, color filter and liquid crystal display device

Also Published As

Publication number Publication date
KR102624811B1 (en) 2024-01-16
TW202132922A (en) 2021-09-01
JP7081696B2 (en) 2022-06-07
CN114945867B (en) 2023-05-16
WO2021149410A1 (en) 2021-07-29
CN114945867A (en) 2022-08-26
TWI826761B (en) 2023-12-21
KR20220131512A (en) 2022-09-28

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