JPWO2021145064A1 - - Google Patents
Info
- Publication number
- JPWO2021145064A1 JPWO2021145064A1 JP2021570662A JP2021570662A JPWO2021145064A1 JP WO2021145064 A1 JPWO2021145064 A1 JP WO2021145064A1 JP 2021570662 A JP2021570662 A JP 2021570662A JP 2021570662 A JP2021570662 A JP 2021570662A JP WO2021145064 A1 JPWO2021145064 A1 JP WO2021145064A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/32—Post-polymerisation treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020004248 | 2020-01-15 | ||
| JP2020004248 | 2020-01-15 | ||
| PCT/JP2020/043223 WO2021145064A1 (ja) | 2020-01-15 | 2020-11-19 | 樹脂組成物、その製造方法、及び、多液型硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021145064A1 true JPWO2021145064A1 (https=) | 2021-07-22 |
| JP7637070B2 JP7637070B2 (ja) | 2025-02-27 |
Family
ID=76864177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021570662A Active JP7637070B2 (ja) | 2020-01-15 | 2020-11-19 | 樹脂組成物、その製造方法、及び、多液型硬化性樹脂組成物 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12312494B2 (https=) |
| JP (1) | JP7637070B2 (https=) |
| CN (1) | CN115003759B (https=) |
| WO (1) | WO2021145064A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7514804B2 (ja) * | 2021-08-16 | 2024-07-11 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び熱伝導性シリコーン硬化物 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01306477A (ja) * | 1988-06-03 | 1989-12-11 | Shin Etsu Chem Co Ltd | ハードコーティング剤及び光学製品 |
| JP2016160342A (ja) * | 2015-03-02 | 2016-09-05 | 株式会社カネカ | 光または熱硬化性樹脂組成物、硬化物及び積層体 |
| JP2017020000A (ja) * | 2015-06-15 | 2017-01-26 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 湿式剥離性シリコン含有反射防止剤 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010026714A1 (ja) * | 2008-09-03 | 2010-03-11 | 日本化薬株式会社 | シロキサン化合物、硬化性樹脂組成物、その硬化物及び光半導体素子 |
| EP3235845B1 (en) | 2014-12-16 | 2020-07-15 | Kaneka Corporation | Photocurable and thermosetting resin composition, cured product and laminate |
| WO2019026458A1 (ja) * | 2017-08-02 | 2019-02-07 | 東レ株式会社 | シロキサン樹脂組成物、それを用いた接着剤、表示装置、半導体装置および照明装置 |
-
2020
- 2020-11-19 WO PCT/JP2020/043223 patent/WO2021145064A1/ja not_active Ceased
- 2020-11-19 JP JP2021570662A patent/JP7637070B2/ja active Active
- 2020-11-19 CN CN202080092442.7A patent/CN115003759B/zh active Active
-
2022
- 2022-07-08 US US17/860,292 patent/US12312494B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01306477A (ja) * | 1988-06-03 | 1989-12-11 | Shin Etsu Chem Co Ltd | ハードコーティング剤及び光学製品 |
| JP2016160342A (ja) * | 2015-03-02 | 2016-09-05 | 株式会社カネカ | 光または熱硬化性樹脂組成物、硬化物及び積層体 |
| JP2017020000A (ja) * | 2015-06-15 | 2017-01-26 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 湿式剥離性シリコン含有反射防止剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021145064A1 (ja) | 2021-07-22 |
| CN115003759B (zh) | 2023-12-01 |
| JP7637070B2 (ja) | 2025-02-27 |
| CN115003759A (zh) | 2022-09-02 |
| US12312494B2 (en) | 2025-05-27 |
| US20220340777A1 (en) | 2022-10-27 |
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