JPWO2021133140A5 - - Google Patents

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Publication number
JPWO2021133140A5
JPWO2021133140A5 JP2022540346A JP2022540346A JPWO2021133140A5 JP WO2021133140 A5 JPWO2021133140 A5 JP WO2021133140A5 JP 2022540346 A JP2022540346 A JP 2022540346A JP 2022540346 A JP2022540346 A JP 2022540346A JP WO2021133140 A5 JPWO2021133140 A5 JP WO2021133140A5
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JP
Japan
Prior art keywords
light emitting
electrode
emitting stack
connection electrode
stack
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Pending
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JP2022540346A
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Japanese (ja)
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JP2023510170A (en
Publication date
Priority claimed from US17/133,623 external-priority patent/US11688840B2/en
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Publication of JP2023510170A publication Critical patent/JP2023510170A/en
Publication of JPWO2021133140A5 publication Critical patent/JPWO2021133140A5/ja
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Claims (11)

第1の発光スタック;
前記第1の発光スタック下部に配置された第2の発光スタック;
前記第2の発光スタック下部に配置された第3の発光スタック;
前記第1の発光スタック上部に配置され、前記第1~第3の発光スタックに電気的に連結された第1~第4の連結電極;及び
前記第1~第4の連結電極上面に配置されたボンディング金属層を含み、
前記第1~第4の連結電極は、それぞれ上面に溝を含み、
前記ボンディング金属層はそれぞれ前記第1~第4の連結電極の溝を覆う、発光素子。
a first light emitting stack;
a second light emitting stack disposed below the first light emitting stack;
a third light emitting stack disposed below the second light emitting stack;
first to fourth connection electrodes disposed above the first light emitting stack and electrically connected to the first to third light emitting stacks; and including a bonding metal layer,
The first to fourth connection electrodes each include a groove on an upper surface,
In the light emitting device, the bonding metal layer covers each of the grooves of the first to fourth connection electrodes.
前記ボンディング金属層と前記連結電極の間に配置された障壁層をさらに含む、請求項1に記載の発光素子。 The light emitting device of claim 1, further comprising a barrier layer disposed between the bonding metal layer and the connection electrode. 前記ボンディング金属層は、前記連結電極上面の溝と一緒に、前記溝周囲の前記連結電極上面を少なくとも部分的に覆う、請求項1に記載の発光素子。 The light emitting device according to claim 1, wherein the bonding metal layer at least partially covers the top surface of the connection electrode around the groove, together with the groove on the top surface of the connection electrode. 前記連結電極はCuを含み、前記ボンディング金属層はAuを含む、請求項1に記載の発光素子。 The light emitting device according to claim 1, wherein the connection electrode includes Cu and the bonding metal layer includes Au. 前記第1の発光スタックは、前記第1の連結電極および第4の連結電極に電気的に連結され、
前記第2の発光スタックは、前記第2の連結電極および第4の連結電極に電気的に連結され、
前記第3の発光スタックは、前記第3の連結電極および第4の連結電極に電気的に連結された、請求項1に記載の発光素子。
the first light emitting stack is electrically coupled to the first connection electrode and the fourth connection electrode;
the second light emitting stack is electrically coupled to the second connection electrode and the fourth connection electrode;
The light emitting device of claim 1, wherein the third light emitting stack is electrically coupled to the third connection electrode and the fourth connection electrode.
前記第1~第3の連結電極は、それぞれ第1~第3の発光スタックの第2の導電型半導体層に電気的に連結され、
前記第4の連結電極は、前記第1~第3の発光スタックの第1の導電型半導体層に電気的に連結された、請求項5に記載の発光素子。
The first to third connection electrodes are electrically connected to the second conductive type semiconductor layers of the first to third light emitting stacks, respectively;
The light emitting device according to claim 5, wherein the fourth connection electrode is electrically connected to the first conductive type semiconductor layer of the first to third light emitting stacks.
前記第1~第4の連結電極は、第3の発光スタックの第1の導電型半導体層上部領域内に配置された、請求項6に記載の発光素子。 The light emitting device according to claim 6, wherein the first to fourth connection electrodes are disposed in an upper region of the first conductive type semiconductor layer of the third light emitting stack. 前記第1の連結電極を前記第1の発光スタックに電気的に連結する第1のパッド;
前記第2の連結電極を前記第2の発光スタックに電気的に連結する第2のパッド;
前記第3の連結電極を前記第3の発光スタックに電気的に連結する第3のパッド;及び
前記第4の連結電極を前記第1~第3の発光スタックに電気的に連結する第4のパッドをさらに含む、請求項6に記載の発光素子。
a first pad electrically coupling the first connection electrode to the first light emitting stack;
a second pad electrically coupling the second connection electrode to the second light emitting stack;
a third pad electrically coupling the third coupling electrode to the third light emitting stack; and a fourth pad electrically coupling the fourth coupling electrode to the first to third light emitting stacks. The light emitting device according to claim 6, further comprising a pad.
前記第1の発光スタックの第2の導電型半導体層に接触する第1の下部コンタクト電極;
前記第2の発光スタックの第2の導電型半導体層に接触する第2の下部コンタクト電極;及び
前記第3の発光スタックの第2の導電型半導体層に接触する第3の下部コンタクト電極をさらに含み、
前記第1~第3のパッドは、それぞれ前記第1~第3の下部コンタクト電極に接続されている、請求項8に記載の発光素子。
a first lower contact electrode in contact with the second conductivity type semiconductor layer of the first light emitting stack;
a second lower contact electrode in contact with the second conductivity type semiconductor layer of the second light emitting stack; and a third lower contact electrode in contact with the second conductivity type semiconductor layer of the third light emitting stack. including,
9. The light emitting device according to claim 8, wherein the first to third pads are connected to the first to third lower contact electrodes, respectively.
前記第1の発光スタックの第1の導電型半導体層にオーミック接触する第1の上部コンタクト電極をさらに含み、
前記第1の発光スタックの第1の導電型半導体層は、リセスされた領域を有し、
前記第1の上部コンタクト電極は、前記リセスされた領域を覆う、請求項9に記載の発光素子。
further comprising a first upper contact electrode in ohmic contact with the first conductivity type semiconductor layer of the first light emitting stack;
the first conductivity type semiconductor layer of the first light emitting stack has a recessed region;
The light emitting device according to claim 9, wherein the first upper contact electrode covers the recessed region.
前記第4のパッドは、前記第1の上部コンタクト電極に接続する、請求項10に記載の発光素子。 The light emitting device according to claim 10, wherein the fourth pad is connected to the first upper contact electrode.
JP2022540346A 2019-12-28 2020-12-28 Light-emitting element and LED display device having the same Pending JP2023510170A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201962954406P 2019-12-28 2019-12-28
US62/954,406 2019-12-28
US202063000044P 2020-03-26 2020-03-26
US63/000,044 2020-03-26
US17/133,623 2020-12-23
US17/133,623 US11688840B2 (en) 2019-12-28 2020-12-23 Light emitting device and led display apparatus having the same
PCT/KR2020/019198 WO2021133140A1 (en) 2019-12-28 2020-12-28 Light-emitting element and led display device including same

Publications (2)

Publication Number Publication Date
JP2023510170A JP2023510170A (en) 2023-03-13
JPWO2021133140A5 true JPWO2021133140A5 (en) 2024-01-12

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JP2022540346A Pending JP2023510170A (en) 2019-12-28 2020-12-28 Light-emitting element and LED display device having the same

Country Status (7)

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US (2) US11688840B2 (en)
EP (1) EP4084097A4 (en)
JP (1) JP2023510170A (en)
KR (1) KR20220123640A (en)
CN (2) CN114902434A (en)
CA (1) CA3166227A1 (en)
WO (1) WO2021133140A1 (en)

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* Cited by examiner, † Cited by third party
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WO2023229194A1 (en) * 2022-05-27 2023-11-30 삼성전자주식회사 Display module comprising micro light emitting diode

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KR100298205B1 (en) * 1998-05-21 2001-08-07 오길록 Integrated tri-color light emitting diode and method for fabricating the same
US20070170444A1 (en) * 2004-07-07 2007-07-26 Cao Group, Inc. Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same
JP2011176045A (en) 2010-02-23 2011-09-08 Fujifilm Corp Laminated type semiconductor light-emitting element
KR101958419B1 (en) 2013-01-29 2019-03-14 삼성전자 주식회사 Semiconductor light emitting device
KR102303983B1 (en) * 2014-09-22 2021-09-23 삼성전자주식회사 Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices
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