JPWO2021133140A5 - - Google Patents
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- JPWO2021133140A5 JPWO2021133140A5 JP2022540346A JP2022540346A JPWO2021133140A5 JP WO2021133140 A5 JPWO2021133140 A5 JP WO2021133140A5 JP 2022540346 A JP2022540346 A JP 2022540346A JP 2022540346 A JP2022540346 A JP 2022540346A JP WO2021133140 A5 JPWO2021133140 A5 JP WO2021133140A5
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- JP
- Japan
- Prior art keywords
- light emitting
- electrode
- emitting stack
- connection electrode
- stack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 8
- 230000008878 coupling Effects 0.000 claims 6
- 238000010168 coupling process Methods 0.000 claims 6
- 238000005859 coupling reaction Methods 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 5
- 230000004888 barrier function Effects 0.000 claims 1
Claims (11)
前記第1の発光スタック下部に配置された第2の発光スタック;
前記第2の発光スタック下部に配置された第3の発光スタック;
前記第1の発光スタック上部に配置され、前記第1~第3の発光スタックに電気的に連結された第1~第4の連結電極;及び
前記第1~第4の連結電極上面に配置されたボンディング金属層を含み、
前記第1~第4の連結電極は、それぞれ上面に溝を含み、
前記ボンディング金属層はそれぞれ前記第1~第4の連結電極の溝を覆う、発光素子。 a first light emitting stack;
a second light emitting stack disposed below the first light emitting stack;
a third light emitting stack disposed below the second light emitting stack;
first to fourth connection electrodes disposed above the first light emitting stack and electrically connected to the first to third light emitting stacks; and including a bonding metal layer,
The first to fourth connection electrodes each include a groove on an upper surface,
In the light emitting device, the bonding metal layer covers each of the grooves of the first to fourth connection electrodes.
前記第2の発光スタックは、前記第2の連結電極および第4の連結電極に電気的に連結され、
前記第3の発光スタックは、前記第3の連結電極および第4の連結電極に電気的に連結された、請求項1に記載の発光素子。 the first light emitting stack is electrically coupled to the first connection electrode and the fourth connection electrode;
the second light emitting stack is electrically coupled to the second connection electrode and the fourth connection electrode;
The light emitting device of claim 1, wherein the third light emitting stack is electrically coupled to the third connection electrode and the fourth connection electrode.
前記第4の連結電極は、前記第1~第3の発光スタックの第1の導電型半導体層に電気的に連結された、請求項5に記載の発光素子。 The first to third connection electrodes are electrically connected to the second conductive type semiconductor layers of the first to third light emitting stacks, respectively;
The light emitting device according to claim 5, wherein the fourth connection electrode is electrically connected to the first conductive type semiconductor layer of the first to third light emitting stacks.
前記第2の連結電極を前記第2の発光スタックに電気的に連結する第2のパッド;
前記第3の連結電極を前記第3の発光スタックに電気的に連結する第3のパッド;及び
前記第4の連結電極を前記第1~第3の発光スタックに電気的に連結する第4のパッドをさらに含む、請求項6に記載の発光素子。 a first pad electrically coupling the first connection electrode to the first light emitting stack;
a second pad electrically coupling the second connection electrode to the second light emitting stack;
a third pad electrically coupling the third coupling electrode to the third light emitting stack; and a fourth pad electrically coupling the fourth coupling electrode to the first to third light emitting stacks. The light emitting device according to claim 6, further comprising a pad.
前記第2の発光スタックの第2の導電型半導体層に接触する第2の下部コンタクト電極;及び
前記第3の発光スタックの第2の導電型半導体層に接触する第3の下部コンタクト電極をさらに含み、
前記第1~第3のパッドは、それぞれ前記第1~第3の下部コンタクト電極に接続されている、請求項8に記載の発光素子。 a first lower contact electrode in contact with the second conductivity type semiconductor layer of the first light emitting stack;
a second lower contact electrode in contact with the second conductivity type semiconductor layer of the second light emitting stack; and a third lower contact electrode in contact with the second conductivity type semiconductor layer of the third light emitting stack. including,
9. The light emitting device according to claim 8, wherein the first to third pads are connected to the first to third lower contact electrodes, respectively.
前記第1の発光スタックの第1の導電型半導体層は、リセスされた領域を有し、
前記第1の上部コンタクト電極は、前記リセスされた領域を覆う、請求項9に記載の発光素子。 further comprising a first upper contact electrode in ohmic contact with the first conductivity type semiconductor layer of the first light emitting stack;
the first conductivity type semiconductor layer of the first light emitting stack has a recessed region;
The light emitting device according to claim 9, wherein the first upper contact electrode covers the recessed region.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962954406P | 2019-12-28 | 2019-12-28 | |
US62/954,406 | 2019-12-28 | ||
US202063000044P | 2020-03-26 | 2020-03-26 | |
US63/000,044 | 2020-03-26 | ||
US17/133,623 | 2020-12-23 | ||
US17/133,623 US11688840B2 (en) | 2019-12-28 | 2020-12-23 | Light emitting device and led display apparatus having the same |
PCT/KR2020/019198 WO2021133140A1 (en) | 2019-12-28 | 2020-12-28 | Light-emitting element and led display device including same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023510170A JP2023510170A (en) | 2023-03-13 |
JPWO2021133140A5 true JPWO2021133140A5 (en) | 2024-01-12 |
Family
ID=76546717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022540346A Pending JP2023510170A (en) | 2019-12-28 | 2020-12-28 | Light-emitting element and LED display device having the same |
Country Status (7)
Country | Link |
---|---|
US (2) | US11688840B2 (en) |
EP (1) | EP4084097A4 (en) |
JP (1) | JP2023510170A (en) |
KR (1) | KR20220123640A (en) |
CN (2) | CN114902434A (en) |
CA (1) | CA3166227A1 (en) |
WO (1) | WO2021133140A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11476299B2 (en) * | 2020-08-31 | 2022-10-18 | Hong Kong Beida Jade Bird Display Limited | Double color micro LED display panel |
WO2023229194A1 (en) * | 2022-05-27 | 2023-11-30 | 삼성전자주식회사 | Display module comprising micro light emitting diode |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2726126A1 (en) * | 1994-10-24 | 1996-04-26 | Mitsubishi Electric Corp | LED device mfr. by thermally bonding LEDs |
KR100298205B1 (en) * | 1998-05-21 | 2001-08-07 | 오길록 | Integrated tri-color light emitting diode and method for fabricating the same |
US20070170444A1 (en) * | 2004-07-07 | 2007-07-26 | Cao Group, Inc. | Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same |
JP2011176045A (en) | 2010-02-23 | 2011-09-08 | Fujifilm Corp | Laminated type semiconductor light-emitting element |
KR101958419B1 (en) | 2013-01-29 | 2019-03-14 | 삼성전자 주식회사 | Semiconductor light emitting device |
KR102303983B1 (en) * | 2014-09-22 | 2021-09-23 | 삼성전자주식회사 | Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices |
KR102256591B1 (en) | 2014-10-31 | 2021-05-27 | 서울바이오시스 주식회사 | High efficiency light emitti ng device |
DE102016104280A1 (en) * | 2016-03-09 | 2017-09-14 | Osram Opto Semiconductors Gmbh | Component and method for manufacturing a device |
KR102513080B1 (en) | 2016-04-04 | 2023-03-24 | 삼성전자주식회사 | Led lighting source module and display apparatus |
KR102530759B1 (en) * | 2016-06-14 | 2023-05-11 | 삼성전자주식회사 | Light emitting device package and method of manufacturing the same |
US11527519B2 (en) * | 2017-11-27 | 2022-12-13 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
US11552057B2 (en) | 2017-12-20 | 2023-01-10 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
US10777531B2 (en) * | 2018-12-28 | 2020-09-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package contact structure, semiconductor package and manufacturing method thereof |
-
2020
- 2020-12-23 US US17/133,623 patent/US11688840B2/en active Active
- 2020-12-28 CA CA3166227A patent/CA3166227A1/en active Pending
- 2020-12-28 KR KR1020227020544A patent/KR20220123640A/en unknown
- 2020-12-28 WO PCT/KR2020/019198 patent/WO2021133140A1/en unknown
- 2020-12-28 CN CN202080090918.3A patent/CN114902434A/en active Pending
- 2020-12-28 EP EP20906617.4A patent/EP4084097A4/en active Pending
- 2020-12-28 JP JP2022540346A patent/JP2023510170A/en active Pending
- 2020-12-28 CN CN202023221951.1U patent/CN213878132U/en active Active
-
2023
- 2023-05-16 US US18/197,729 patent/US20230282797A1/en active Pending
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