JPWO2021131192A1 - - Google Patents

Info

Publication number
JPWO2021131192A1
JPWO2021131192A1 JP2021566821A JP2021566821A JPWO2021131192A1 JP WO2021131192 A1 JPWO2021131192 A1 JP WO2021131192A1 JP 2021566821 A JP2021566821 A JP 2021566821A JP 2021566821 A JP2021566821 A JP 2021566821A JP WO2021131192 A1 JPWO2021131192 A1 JP WO2021131192A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021566821A
Other versions
JP7223170B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131192A1 publication Critical patent/JPWO2021131192A1/ja
Application granted granted Critical
Publication of JP7223170B2 publication Critical patent/JP7223170B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021566821A 2019-12-26 2020-09-25 配線構造 Active JP7223170B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019237042 2019-12-26
JP2019237042 2019-12-26
PCT/JP2020/036178 WO2021131192A1 (ja) 2019-12-26 2020-09-25 配線構造

Publications (2)

Publication Number Publication Date
JPWO2021131192A1 true JPWO2021131192A1 (ja) 2021-07-01
JP7223170B2 JP7223170B2 (ja) 2023-02-15

Family

ID=76575307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021566821A Active JP7223170B2 (ja) 2019-12-26 2020-09-25 配線構造

Country Status (3)

Country Link
JP (1) JP7223170B2 (ja)
CN (1) CN114424678A (ja)
WO (1) WO2021131192A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150467A (ja) * 2003-11-17 2005-06-09 Kyocera Corp 半導体装置
JP2014135372A (ja) * 2013-01-10 2014-07-24 Mitsubishi Electric Corp 半導体素子収納用パッケージ
JP2016531439A (ja) * 2013-08-08 2016-10-06 インヴェンサス・コーポレイション 超高性能インターポーザ
JP2019114689A (ja) * 2017-12-25 2019-07-11 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150467A (ja) * 2003-11-17 2005-06-09 Kyocera Corp 半導体装置
JP2014135372A (ja) * 2013-01-10 2014-07-24 Mitsubishi Electric Corp 半導体素子収納用パッケージ
JP2016531439A (ja) * 2013-08-08 2016-10-06 インヴェンサス・コーポレイション 超高性能インターポーザ
JP2019114689A (ja) * 2017-12-25 2019-07-11 京セラ株式会社 高周波基体、高周波パッケージおよび高周波モジュール

Also Published As

Publication number Publication date
JP7223170B2 (ja) 2023-02-15
CN114424678A (zh) 2022-04-29
WO2021131192A1 (ja) 2021-07-01

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