JPWO2021112134A1 - - Google Patents

Info

Publication number
JPWO2021112134A1
JPWO2021112134A1 JP2021519686A JP2021519686A JPWO2021112134A1 JP WO2021112134 A1 JPWO2021112134 A1 JP WO2021112134A1 JP 2021519686 A JP2021519686 A JP 2021519686A JP 2021519686 A JP2021519686 A JP 2021519686A JP WO2021112134 A1 JPWO2021112134 A1 JP WO2021112134A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021519686A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021112134A1 publication Critical patent/JPWO2021112134A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021519686A 2019-12-04 2020-12-02 Pending JPWO2021112134A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019219824 2019-12-04
PCT/JP2020/044900 WO2021112134A1 (en) 2019-12-04 2020-12-02 Low-dielectric layered product

Publications (1)

Publication Number Publication Date
JPWO2021112134A1 true JPWO2021112134A1 (en) 2021-06-10

Family

ID=76221687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021519686A Pending JPWO2021112134A1 (en) 2019-12-04 2020-12-02

Country Status (5)

Country Link
JP (1) JPWO2021112134A1 (en)
KR (1) KR20220108030A (en)
CN (1) CN114302933B (en)
TW (1) TW202130504A (en)
WO (1) WO2021112134A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI828469B (en) * 2022-12-09 2024-01-01 南亞塑膠工業股份有限公司 Adhesive composition and copper clad laminate manufactured using the same

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4065595B2 (en) * 1997-02-20 2008-03-26 三井化学株式会社 Adhesive composition and board manufacturing method using the adhesive composition
JP3820668B2 (en) * 1997-02-25 2006-09-13 日立化成工業株式会社 Metal base substrate and manufacturing method thereof
JP2006045388A (en) * 2004-08-05 2006-02-16 Kaneka Corp Insulating adhesive sheet and its application
JP2008153313A (en) * 2006-12-15 2008-07-03 Matsushita Electric Ind Co Ltd Optical device and its manufacturing method and camera module
JP4918380B2 (en) * 2007-03-13 2012-04-18 ソマール株式会社 Shielding film and method for producing the same
JP2009084507A (en) * 2007-10-02 2009-04-23 Hitachi Kasei Polymer Co Ltd Multilayered adhesive film, coverlay film using it, and multilayered adhesive film with copper foil
US8163381B2 (en) * 2007-10-26 2012-04-24 E. I. Du Pont De Nemours And Company Multi-layer chip carrier and process for making
JP5327937B2 (en) * 2007-12-25 2013-10-30 旭化成ケミカルズ株式会社 Adhesive for laser welding
TWI506082B (en) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP2014141603A (en) * 2013-01-25 2014-08-07 Toyo Ink Sc Holdings Co Ltd Adhesive agent composition excellent in dielectric property, adhesive agent sheet using the same and printed wiring board
JP6188788B2 (en) * 2013-03-22 2017-08-30 ナミックス株式会社 Resin composition, and adhesive film, coverlay film, and interlayer adhesive formed thereby
JP6718148B2 (en) * 2014-09-24 2020-07-08 東亞合成株式会社 Adhesive composition and laminate with adhesive layer using the same
JP6686587B2 (en) * 2015-03-30 2020-04-22 大日本印刷株式会社 Battery packaging material, manufacturing method thereof, and battery
JP6579309B2 (en) * 2015-05-01 2019-09-25 味の素株式会社 Curable composition
KR102160499B1 (en) * 2015-05-15 2020-09-28 도요보 가부시키가이샤 Laminate comprising low dielectric constant adhesive layer
WO2017077912A1 (en) * 2015-11-02 2017-05-11 東洋紡株式会社 Low-dielectric flame-resistant adhesive composition
TW201800543A (en) * 2016-03-08 2018-01-01 東洋油墨Ｓｃ控股股份有限公司 Laminate and manufacturing method thereof, and resin film with adhesive layer
WO2018116728A1 (en) * 2016-12-22 2018-06-28 株式会社村田製作所 Circuit module
JP2018135467A (en) * 2017-02-22 2018-08-30 藤森工業株式会社 Hot-melt adhesive resin laminate and laminate
JP2019127501A (en) * 2018-01-22 2019-08-01 藤森工業株式会社 Thermosetting adhesive composition, adhesive film, coverlay film, and flexible printed wiring board
US20210009865A1 (en) * 2018-03-07 2021-01-14 Toagosei Co., Ltd. Adhesive composition, and adhesive layer-equipped layered product using same

Also Published As

Publication number Publication date
CN114302933B (en) 2024-05-10
TW202130504A (en) 2021-08-16
CN114302933A (en) 2022-04-08
WO2021112134A1 (en) 2021-06-10
KR20220108030A (en) 2022-08-02

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