JPWO2021107139A1 - - Google Patents

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Publication number
JPWO2021107139A1
JPWO2021107139A1 JP2021561572A JP2021561572A JPWO2021107139A1 JP WO2021107139 A1 JPWO2021107139 A1 JP WO2021107139A1 JP 2021561572 A JP2021561572 A JP 2021561572A JP 2021561572 A JP2021561572 A JP 2021561572A JP WO2021107139 A1 JPWO2021107139 A1 JP WO2021107139A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021561572A
Other versions
JP7294448B2 (ja
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Publication of JP7294448B2 publication Critical patent/JP7294448B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Numerical Control (AREA)
JP2021561572A 2019-11-27 2020-11-27 研削システム、補正量推定装置、コンピュータプログラム及び研削方法 Active JP7294448B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962940912P 2019-11-27 2019-11-27
US62/940,912 2019-11-27
PCT/JP2020/044359 WO2021107139A1 (ja) 2019-11-27 2020-11-27 研削システム、補正量推定装置、コンピュータプログラム及び研削方法

Publications (2)

Publication Number Publication Date
JPWO2021107139A1 true JPWO2021107139A1 (ja) 2021-06-03
JP7294448B2 JP7294448B2 (ja) 2023-06-20

Family

ID=76129657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561572A Active JP7294448B2 (ja) 2019-11-27 2020-11-27 研削システム、補正量推定装置、コンピュータプログラム及び研削方法

Country Status (3)

Country Link
JP (1) JP7294448B2 (ja)
CN (1) CN114616076B (ja)
WO (1) WO2021107139A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023109766B3 (de) 2023-04-18 2024-10-02 Deutsches Zentrum für Luft- und Raumfahrt e.V. Verfahren zum Steuern einer Robotereinrichtung
CN117742239B (zh) * 2024-02-19 2024-05-14 南京超颖新能源科技有限公司 机床的垂直矫正系统及矫正方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62203756A (ja) * 1986-03-03 1987-09-08 Takaaki Nagao 曲面加工装置
JPS6347058A (ja) * 1986-08-13 1988-02-27 Daikin Ind Ltd ロボツトの制御装置
US4886529A (en) * 1988-07-08 1989-12-12 Showa Precision Machinery Co., Ltd. Polishing robot and polishing method using the same
JPH0215956A (ja) * 1988-06-30 1990-01-19 Toyota Motor Corp 倣い制御ロボット
JPH07205022A (ja) * 1993-12-30 1995-08-08 Hitachi Constr Mach Co Ltd 力制御ロボットの砥石摩耗補正方法
JP2011125986A (ja) * 2009-12-21 2011-06-30 Saito-Seiki Co Ltd 角ブロックの表面研削装置
JP2014155986A (ja) * 2013-02-15 2014-08-28 Ihi Corp 姿勢検知制御装置、研磨装置、および、姿勢検知制御方法
JP2017001122A (ja) * 2015-06-08 2017-01-05 ファナック株式会社 ロボットと力の表示機能を備えたロボット制御装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126645A (en) * 1989-09-30 1992-06-30 Kabushiki Kaisha Toshiba Grinder robot
JP6347058B2 (ja) 2014-03-11 2018-06-27 産業振興株式会社 スペーサ投入装置
JP6816364B2 (ja) * 2016-02-25 2021-01-20 セイコーエプソン株式会社 制御装置、ロボット、及びロボットシステム
JP6886869B2 (ja) * 2017-06-09 2021-06-16 川崎重工業株式会社 動作予測システム及び動作予測方法
JP2019162712A (ja) * 2018-03-20 2019-09-26 ファナック株式会社 制御装置、機械学習装置及びシステム
JP7205022B2 (ja) 2018-08-08 2023-01-17 国立研究開発法人宇宙航空研究開発機構 樹脂成形体、樹脂成形体の製造方法、および殺菌方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62203756A (ja) * 1986-03-03 1987-09-08 Takaaki Nagao 曲面加工装置
JPS6347058A (ja) * 1986-08-13 1988-02-27 Daikin Ind Ltd ロボツトの制御装置
JPH0215956A (ja) * 1988-06-30 1990-01-19 Toyota Motor Corp 倣い制御ロボット
US4886529A (en) * 1988-07-08 1989-12-12 Showa Precision Machinery Co., Ltd. Polishing robot and polishing method using the same
JPH07205022A (ja) * 1993-12-30 1995-08-08 Hitachi Constr Mach Co Ltd 力制御ロボットの砥石摩耗補正方法
JP2011125986A (ja) * 2009-12-21 2011-06-30 Saito-Seiki Co Ltd 角ブロックの表面研削装置
JP2014155986A (ja) * 2013-02-15 2014-08-28 Ihi Corp 姿勢検知制御装置、研磨装置、および、姿勢検知制御方法
JP2017001122A (ja) * 2015-06-08 2017-01-05 ファナック株式会社 ロボットと力の表示機能を備えたロボット制御装置

Also Published As

Publication number Publication date
JP7294448B2 (ja) 2023-06-20
CN114616076B (zh) 2024-07-19
CN114616076A (zh) 2022-06-10
WO2021107139A1 (ja) 2021-06-03

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