JPWO2021095620A1 - - Google Patents

Info

Publication number
JPWO2021095620A1
JPWO2021095620A1 JP2021556048A JP2021556048A JPWO2021095620A1 JP WO2021095620 A1 JPWO2021095620 A1 JP WO2021095620A1 JP 2021556048 A JP2021556048 A JP 2021556048A JP 2021556048 A JP2021556048 A JP 2021556048A JP WO2021095620 A1 JPWO2021095620 A1 JP WO2021095620A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021556048A
Other languages
Japanese (ja)
Other versions
JP7180788B2 (ja
JPWO2021095620A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021095620A1 publication Critical patent/JPWO2021095620A1/ja
Publication of JPWO2021095620A5 publication Critical patent/JPWO2021095620A5/ja
Application granted granted Critical
Publication of JP7180788B2 publication Critical patent/JP7180788B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H01P3/087—Suspended triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H01P3/082—Multilayer dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021556048A 2019-11-15 2020-11-05 伝送線路及び電子機器 Active JP7180788B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019206612 2019-11-15
JP2019206612 2019-11-15
PCT/JP2020/041294 WO2021095620A1 (ja) 2019-11-15 2020-11-05 伝送線路及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2021095620A1 true JPWO2021095620A1 (https=) 2021-05-20
JPWO2021095620A5 JPWO2021095620A5 (https=) 2022-04-27
JP7180788B2 JP7180788B2 (ja) 2022-11-30

Family

ID=75912967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021556048A Active JP7180788B2 (ja) 2019-11-15 2020-11-05 伝送線路及び電子機器

Country Status (4)

Country Link
US (1) US12119531B2 (https=)
JP (1) JP7180788B2 (https=)
CN (1) CN216905421U (https=)
WO (1) WO2021095620A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7197057B2 (ja) * 2020-05-15 2022-12-27 株式会社村田製作所 伝送線路
CN220021573U (zh) * 2020-11-30 2023-11-14 株式会社村田制作所 传输线路以及电子设备
CN113452814A (zh) * 2021-05-21 2021-09-28 荣耀终端有限公司 传输组件及可折叠电子设备
JP7753391B2 (ja) * 2021-12-23 2025-10-14 京セラ株式会社 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール
US20250247960A1 (en) * 2024-01-30 2025-07-31 Snap Inc. Air gapped dynamic-flex circuits with stripline impedance controls
WO2025225396A1 (ja) * 2024-04-22 2025-10-30 株式会社村田製作所 多層基板、多層基板モジュール及び電子機器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2229322A (en) * 1988-12-03 1990-09-19 Quantel Ltd Strip lines
WO2011007660A1 (ja) * 2009-07-13 2011-01-20 株式会社村田製作所 信号線路及び回路基板
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050083147A1 (en) * 2003-10-20 2005-04-21 Barr Andrew H. Circuit board and method in which the impedance of a transmission-path is selected by varying at least one opening in a proximate conductive plane
KR100761858B1 (ko) * 2006-09-13 2007-09-28 삼성전자주식회사 향상된 전송 특성을 갖는 신호 전송 회로
JP5666270B2 (ja) * 2010-11-29 2015-02-12 株式会社ヨコオ 信号伝送媒体、高周波信号伝送媒体
CN110602883B (zh) * 2014-09-26 2022-10-21 株式会社村田制作所 传输线路及电子设备
JP6809544B2 (ja) 2017-02-20 2021-01-06 株式会社村田製作所 電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2229322A (en) * 1988-12-03 1990-09-19 Quantel Ltd Strip lines
WO2011007660A1 (ja) * 2009-07-13 2011-01-20 株式会社村田製作所 信号線路及び回路基板
WO2017130731A1 (ja) * 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Also Published As

Publication number Publication date
US20220200116A1 (en) 2022-06-23
CN216905421U (zh) 2022-07-05
WO2021095620A1 (ja) 2021-05-20
JP7180788B2 (ja) 2022-11-30
US12119531B2 (en) 2024-10-15

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