JPWO2021086691A5 - - Google Patents

Description

In one embodiment, the showerhead 108 is cleaned at moderate temperatures without opening the plasma chamber 105. An example of a medium temperature for the showerhead 108 is a temperature of or about 200 degrees Celsius, such as within ±10% of 200 degrees Celsius. When the showerhead is at a medium temperature, the pedestal 110A is also at a medium temperature, such as at or about 300 degrees Celsius. To illustrate, pedestal 110A has a temperature of about 300 degrees Celsius when the temperature is within ±10% of 300 degrees Celsius. When plasma chamber 105 is closed so that there is no gap between sections 105A and 105B of plasma chamber 105, a vacuum exists within plasma chamber 105 and no outside air exists within plasma chamber 105. Further, the plasma chamber 105 is at a medium temperature and under vacuum.

When the cleaning assembly 220 is placed on the top surface 416A of the rotating section 408 of the arm 414, the protrusion 412A is located within, extends within, or engages the recess 414A. or mechanically connected to the recess 414A, or mechanically connected to the recess 414A. Similarly, protrusion 412B fits into recess 414B, and protrusion 412C fits into recess 414C. When protrusion 412A fits into recess 414A, protrusion 412B fits into recess 414B, and protrusion 412C fits into recess 414C, cleaning assembly 220 is configured to avoid movement or substantial movement of cleaning assembly 220 relative to rotating section 408. is stably mounted on top of rotating section 408. For example, there is no or minimal angular movement of cleaning assembly 220 that is stably positioned on top of rotating section 408. An example of a minimum angular movement is one that has several degrees of rotation, such as 1 to 2 degrees of angular rotation relative to rotating section 408.

FIG. 9B is a diagram of one embodiment of a system 950 illustrating vertical movement of spider forks 908A and 908B as spindle 212 moves. System 950 includes showerhead 108, cleaning device 802, carrier ring 112, pedestal 110A, spindle 212, and spider forks 908A and 908B.

FIG. 12B is a side view of one embodiment of a set of pillars of cleaning layer 1206. Instead of cleaning layer 456 (FIG. 11A), cleaning layer 1206 is used. For example, cleaning layer 1206 is attached to press plate 806 (FIG. 11B). The cleaning layer 1206 includes pillars of alternating heights, two shorter pillars followed by one taller pillar. For example, pillars 1208A and 1208B of cleaning layer 1206 are shorter than another pillar 1208C of cleaning layer 1206. Pillar 1208B is adjacent to pillar 1208A, and there are no other pillars between the two pillars 1208A and 1208B. Further, pillar 1208C is adjacent to pillar 1208B, and no other pillar exists between the two pillars 1208B and 1208C. As another example, pillars 1208D and 1208E of cleaning layer 1206 are shorter than another pillar 1208F of cleaning layer 1206. Pillar 1208D is adjacent to pillar 1208C, and there are no other pillars between the two pillars 1208C and 1208D. Similarly, pillar 1208E is adjacent to pillar 1208D and there are no other pillars between the two pillars 1208D and 1208E, and pillar 1208F is adjacent to pillar 1208E and there are no other pillars between the two pillars 1208E and 1208F. There are no other pillars in between. A set of pillars of cleaning layer 1206 extend from planar layer 1102 of cleaning layer 1206 .

The pattern of alternating heights shown in FIG. 12B is repeated in the y direction. For example, a plurality of sets of pillars having the same pattern as the set of pillars shown in FIG. 12B extend along the y-axis from the planar layer 1102 of the cleaning layer 1206 .

FIG. 13C is a top view of one embodiment of a cleaning layer 1320 illustrating that the cleaning layer 1320 is distributed into pillar sections and non-pillar sections. Cleaning layer 1320 includes a pillar section 1322A and another pillar section 1322B. Cleaning layer 1320 further includes non-pillar sections 1324. A non-pillar section 1324 is between pillar section 1322A and pillar section 1322B and separates pillar section 1322A from pillar section 1322B.

FIG. 15C is a graph 1506 of one embodiment of the movement of cleaning assembly 220 (FIG. 2). Graph 1506 plots the vertical distance traveled by cleaning assembly 220 along the z-axis and the horizontal curved distance traveled by cleaning assembly 220. Graph 1506 is similar to graph 1502 (FIG. 15A) except that in graph 1506, when cleaning assembly 220 is at a distance D2, such as height H2 (FIG. 6B), there is back and forth movement of cleaning assembly 1056 along an arc. ) is the same as

Back and forth movement of cleaning assembly 220 is accomplished by back and forth movement of spindle 212 (FIG. 2). For example, during rotation of the spindle 212 with respect to the axis 216, the spindle 212 moves in a clockwise direction during a first period tp1, moves in a counterclockwise direction during a second period tp2, clockwise and counterclockwise. Repeat clockwise movement. Period tp2 continues continuously from period tp1. The clockwise and counterclockwise movements continue during the period when cleaning assembly 220 is at height H2 between locations hd1 and hd2.

During the back and forth movement, the cleaning assembly 220 is in contact with or proximate the bottom surface 604C (FIG. 6A) of the showerhead 108. Upon contact, cleaning assembly 220 slides along the x-axis relative to bottom surface 604, removing and/or attracting particles from bottom surface 604C. Particles are attracted by electrostatic forces.

FIG. 17B is a top view of one embodiment of a FOUP 1750 for storing multiple cleaning assemblies, such as cleaning assembly 802. FOUP 1750 is an example of pod 204A or pod 204B (FIG. 2). FOUP 1750 has the same structure as FOUP 1600 (FIG. 16A), except that instead of support extensions such as support extensions 1610A-1610D, FOUP 1750 includes tines 1752A and 1752B. Tines are sometimes referred to herein as prongs. Tines 1752A are connected to or integral with back wall 1650E and extend from back wall 1650E into the space within FOUP 1700 to support the left edge of cleaning assembly 802. Similarly, tines 1752B are connected or integral with back wall 1650E and extend from tine 1752B into the space within FOUP 1750 to support the right edge of cleaning assembly 802. Tines 1752A are aligned in the y direction with tines 1752B and support the left and right edges of cleaning assembly 802.

Each roller 2052A and 2052B is wrapped around bar 1806, creating a gap between the inner surface of the roller and bar 1806 to facilitate rotation of the roller relative to bar 1806. A gap between the inner surface of each roller 2052A and 2052B and bar 1806 is formed in the same manner that a gap is formed between inner surface 1805 of roller 1804 (FIG. 18A) and bar 1806. Similarly, each roller 2052C and 2052D is wrapped around bar 2006 , creating a gap between the inner surface of the roller and bar 2006 to facilitate rotation of the roller relative to bar 2006 .

FIG. 24 is a top view of one embodiment of a system 2400 illustrating a cleaning assembly 2402 where two rollers 2302 and 2404 are used instead of one. System 2400 includes cleaning assembly 2402, spindle 212, and arm 404 (FIG. 4A). Cleaning assembly 2402 is similar in construction to cleaning assembly 2050 (FIG. 20B), except that cleaning assembly 2402 includes rollers 2302 and 2404 instead of rollers 2052A-2052D (FIG. 20B). For example, cleaning assembly 2402 has a housing 1820 and rollers 2302 and 2404 . As another example, roller 2302 is wrapped around bar 1806 instead of rollers 2052A and 2052B, and roller 2404 is wrapped around bar 2006 instead of rollers 2052C and 2052D.

Roller 2404 has the same structure as roller 2302. For example, roller 2404 tapers toward spindle 212 to have an outer diameter OD3 that is less than outer diameter OD4. Also, the ratio between the outer diameters OD3 and OD4 is the same as the ratio between the radii R1 and R2 (FIG. 23).

FIG. 25B is a side view of one embodiment of cleaning assembly 2500 in a reduced pressure position. Cleaning assembly 2500 includes spring 2508A and pin 2510A. An example of spring 2508A is a metal wave spring such as a stainless steel wave spring. Spring 2508A controls the force applied by pad 2502 to showerhead 108 (FIG. 1). Spring 2508A wraps around pin 2510A. For example, pin 2510A passes through spring 2508A along the z-axis or along the length of spring 2508A, so the length of pin 2510A is bounded by the length of spring 2508A.

FIG. 25C is a side view of one embodiment of cleaning assembly 2500 in a compressed position. Press plate 2504 and pad 2502 are in a compressed position along the z-axis relative to support plate 2506. For example, press plate 2504 and pad 2502 are at a distance along the z-axis closer to the top surface 2506A of support plate 2506 compared to the distance along the z-axis at which press plate 2504 and pad 2502 are in the vacuum position. To illustrate, the distance along the z-axis between press plate 2504 and support plate 2506 in the vacuum position ranges from 0.12 inches to 0.13 inches (0.3048 centimeters to 0.3302 centimeters). It is. To further illustrate, the distance between press plate 2504 and support plate 2506 in the vacuum position is 0.125 inches (0.3175 centimeters).

Although the embodiments described above have been described in some detail for clarity of understanding, it will be obvious that certain changes and modifications may be practiced within the scope of the appended claims. Accordingly, the present embodiments are to be regarded as illustrative rather than limiting, and embodiments are not to be limited to the details set forth herein, but with modification within the scope of the appended claims and equivalents. may be done. For example, the present disclosure can be implemented as the following form.
[Form 1]
A cleaning assembly, the cleaning assembly comprising:
a support section having a bottom side and a top side, the bottom side connecting to an arm of a plasma processing tool, the arm configured to manipulate movement of the cleaning assembly within the plasma processing tool under vacuum; a supporting section that is
a press plate coupled to the upper side of the support section via a compression interface;
a cleaning layer disposed on the press plate, the cleaning layer including a plurality of pillars;
Equipped with
the arm is configured to move the cleaning layer onto an interior surface of the plasma processing tool and transfer particulates disposed on the surface away from the surface and onto the cleaning layer;
cleaning assembly.
[Form 2]
The cleaning assembly according to aspect 1, comprising:
The compression interface includes a plurality of springs that provide cushioning against the surface as the arm moves the cleaning layer over the surface.
[Form 3]
The cleaning assembly according to aspect 1, comprising:
The bottom side of the support section includes a plurality of protrusions to enable the connection to the arm as the arm moves the cleaning assembly.
[Form 4]
The cleaning assembly according to aspect 1, comprising:
a cushion layer disposed between the press plate and the cleaning layer to provide additional compressive absorption when the arm presses the cleaning layer onto the surface inside the plasma processing tool;
A cleaning assembly further comprising:
[Form 5]
The cleaning assembly according to aspect 1, comprising:
The cleaning layer is formed from a polyimide material fabricated to define the plurality of pillars.
[Form 6]
The cleaning assembly according to aspect 1, comprising:
The cleaning assembly wherein the plurality of pillars are arranged in a microstructured pattern that includes upper contact surfaces and lower non-contact surfaces of the plurality of pillars.
[Form 7]
The cleaning assembly according to aspect 6, comprising:
The movement by the arm brings the upper contact surface into proximity or contact with the surface to attract the particulates from the surface onto one or more of the plurality of pillars, and some of the particulates are attracted to the lower part. Cleaning assembly transitioning towards non-contact surfaces.
[Form 8]
The cleaning assembly according to aspect 6, comprising:
The movement by the arm causes the upper contact surface to periodically contact the surface to attract the particulates from the surface onto one or more of the plurality of pillars, some of the particulates being Cleaning assembly transitioning towards the bottom non-contact surface.
[Form 9]
The cleaning assembly according to aspect 6, comprising:
The movement by the arm causes the upper contact surface to contact the surface and slide along the surface in horizontal contact, repeating the contact and the sliding in horizontal contact along the surface to cause the particulate to A cleaning assembly drawn from a surface onto one or more of the plurality of pillars.
[Form 10]
The cleaning assembly according to aspect 6, comprising:
The movement by the arm causes the upper contact surface to contact the surface and slide in horizontal contact while moving back and forth along the surface to move the particulate from the surface onto one or more of the plurality of pillars. the cleaning assembly.
[Form 11]
The cleaning assembly according to aspect 1, comprising:
the plasma processing tool is interfaced with a load lock for interfacing with a pod used to hold the cleaning assembly and one or more additional cleaning assemblies;
The cleaning assembly is configured to be brought into the plasma processing tool to clean the surface and removed from the processing tool after the cleaning has been performed, and the cleaning assembly is configured to be brought into and out of the processing tool. The removal of the cleaning assembly is performed without removing the plasma processing tool from the vacuum.
[Form 12]
The cleaning assembly according to aspect 1, comprising:
The cleaning assembly, wherein the arm is one of a plurality of arms connected to a spindle assembly disposed within the plasma processing tool, the spindle assembly being oriented between sets of processing stations.
[Form 13]
The cleaning assembly according to aspect 1, comprising:
The cleaning assembly, wherein the surface is of a showerhead of a processing station within the plasma processing tool.
[Form 14]
The cleaning assembly according to aspect 1, comprising:
The cleaning assembly is a consumable part.
[Form 15]
The cleaning assembly according to aspect 1, comprising:
Each of the plurality of pillars is a dome top pillar, or a mushroom-shaped pillar, or a conical pillar, or a flat top pillar, or a recessive top pillar, or a faceted top pillar, or a slotted top pillar, or a protruding top pillar, or A cleaning assembly is a combination of these.
[Form 16]
A method for cleaning surfaces within a plasma processing tool, the method comprising:
receiving a cleaning assembly on an arm of the plasma processing tool, the cleaning assembly comprising:
a support section having a bottom side and a top side, the bottom side connecting to the arm of the plasma processing tool;
a press plate coupled to the upper side of the support section via a compression interface;
a cleaning layer disposed on the press plate, the cleaning layer including a plurality of pillars;
including;
moving the arm in an upward direction to move the cleaning layer onto the surface inside the plasma processing tool, bringing the cleaning layer closer to the surface;
including methods.
[Form 17]
The method according to Form 16,
The moving the arm in the upward direction brings the plurality of pillars into close proximity to or contact with the surface, thereby attracting subsurface particles from the surface onto one or more of the plurality of pillars. and a portion of the particulates migrate toward a non-contact surface of the cleaning layer.
[Form 18]
The method according to Form 16,
The moving the arm in the upward direction periodically brings the plurality of pillars into contact with the surface to attract particulates from the surface onto one or more of the plurality of pillars, and attracts particulates from the surface onto one or more of the plurality of pillars. a portion of which migrates toward said lower non-contact surface.
[Form 19]
The method according to Form 16,
The method wherein the surface is of a showerhead of the plasma processing tool.
[Form 20]
The method according to Form 16,
The method further comprising rotating the arm to move the cleaning assembly along an arc relative to a spindle of the plasma processing tool.

Claims (20)

A cleaning assembly, the cleaning assembly comprising:
a support section having a bottom side and a top side, the bottom side connecting to an arm of a plasma processing tool, the arm configured to manipulate movement of the cleaning assembly within the plasma processing tool under vacuum; a supporting section that is
a press plate coupled to the upper side of the support section via a compression interface;
a cleaning layer disposed on the press plate, the cleaning layer including a plurality of pillars;
the arm is configured to move the cleaning layer onto an interior surface of the plasma processing tool and transfer particulates disposed on the surface away from the surface and onto the cleaning layer;
cleaning assembly. A cleaning assembly according to claim 1, comprising:
The compression interface includes a plurality of springs that provide cushioning against the surface as the arm moves the cleaning layer over the surface. A cleaning assembly according to claim 1, comprising:
The bottom side of the support section includes a plurality of protrusions to enable the connection to the arm as the arm moves the cleaning assembly. A cleaning assembly according to claim 1, comprising:
the cleaning further comprising: a cushion layer disposed between the press plate and the cleaning layer to provide additional compressive absorption when the arm presses the cleaning layer onto the surface inside the plasma processing tool; assembly. A cleaning assembly according to claim 1, comprising:
The cleaning layer is formed from a polyimide material fabricated to define the plurality of pillars. A cleaning assembly according to claim 1, comprising:
The cleaning assembly wherein the plurality of pillars are arranged in a microstructured pattern that includes upper contact surfaces and lower non-contact surfaces of the plurality of pillars. 7. A cleaning assembly according to claim 6, comprising:
The movement by the arm brings the upper contact surface into proximity or contact with the surface to attract the particulates from the surface onto one or more of the plurality of pillars, and some of the particulates are attracted to the lower part. Cleaning assembly transitioning towards non-contact surfaces. 7. A cleaning assembly according to claim 6, comprising:
The movement by the arm causes the upper contact surface to periodically contact the surface to attract the particulates from the surface onto one or more of the plurality of pillars, some of the particulates being Cleaning assembly transitioning towards the bottom non-contact surface. 7. A cleaning assembly according to claim 6, comprising:
The movement by the arm causes the upper contact surface to contact the surface and slide along the surface in horizontal contact, repeating the contact and the sliding in horizontal contact along the surface to cause the particulate to A cleaning assembly drawn from a surface onto one or more of the plurality of pillars. 7. A cleaning assembly according to claim 6, comprising:
The movement by the arm causes the upper contact surface to contact the surface and slide in horizontal contact while moving back and forth along the surface to move the particulate from the surface onto one or more of the plurality of pillars. the cleaning assembly. A cleaning assembly according to claim 1, comprising:
the plasma processing tool is interfaced with a load lock for interfacing with a pod used to hold the cleaning assembly and one or more additional cleaning assemblies;
The cleaning assembly is configured to be brought into the plasma processing tool to clean the surface and removed from the processing tool after the cleaning has been performed, and the cleaning assembly is configured to be brought into and out of the processing tool. The removal of the cleaning assembly is performed without removing the plasma processing tool from the vacuum. A cleaning assembly according to claim 1, comprising:
The cleaning assembly, wherein the arm is one of a plurality of arms connected to a spindle assembly disposed within the plasma processing tool, the spindle assembly being oriented between sets of processing stations. A cleaning assembly according to claim 1, comprising:
The cleaning assembly, wherein the surface is of a showerhead of a processing station within the plasma processing tool. A cleaning assembly according to claim 1, comprising:
The cleaning assembly is a consumable part. A cleaning assembly according to claim 1, comprising:
Each of the plurality of pillars is a dome top pillar, or a mushroom-shaped pillar, or a conical pillar, or a flat top pillar, or a recessive top pillar, or a faceted top pillar, or a slotted top pillar, or a protruding top pillar, or A cleaning assembly is a combination of these. A method for cleaning surfaces within a plasma processing tool, the method comprising:
receiving a cleaning assembly on an arm of the plasma processing tool, the cleaning assembly comprising:
a support section having a bottom side and a top side, the bottom side connecting to the arm of the plasma processing tool;
a press plate coupled to the upper side of the support section via a compression interface; and a cleaning layer disposed over the press plate, the cleaning layer including a plurality of pillars. ,
moving the arm in an upward direction to move the cleaning layer onto the surface inside the plasma processing tool, bringing the cleaning layer into proximity with the surface. 17. The method according to claim 16,
The moving the arm in the upward direction brings the plurality of pillars into close proximity to or contact with the surface, thereby attracting subsurface particles from the surface onto one or more of the plurality of pillars. and a portion of the particulates migrate toward a non-contact surface of the cleaning layer. 17. The method according to claim 16,
The moving the arm in the upward direction periodically brings the plurality of pillars into contact with the surface to attract particulates from the surface onto one or more of the plurality of pillars, and attracts particulates from the surface onto one or more of the plurality of pillars. A portion of the cleaning layer migrates towards a non-contact surface . 17. The method according to claim 16,
The method wherein the surface is of a showerhead of the plasma processing tool. 17. The method according to claim 16,
The method further comprising rotating the arm to move the cleaning assembly along an arc relative to a spindle of the plasma processing tool.