JPWO2021084638A1 - - Google Patents

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Publication number
JPWO2021084638A1
JPWO2021084638A1 JP2021553948A JP2021553948A JPWO2021084638A1 JP WO2021084638 A1 JPWO2021084638 A1 JP WO2021084638A1 JP 2021553948 A JP2021553948 A JP 2021553948A JP 2021553948 A JP2021553948 A JP 2021553948A JP WO2021084638 A1 JPWO2021084638 A1 JP WO2021084638A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021553948A
Other versions
JP7123271B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021084638A1 publication Critical patent/JPWO2021084638A1/ja
Application granted granted Critical
Publication of JP7123271B2 publication Critical patent/JP7123271B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
JP2021553948A 2019-10-30 2019-10-30 気密封止型半導体装置 Active JP7123271B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/042508 WO2021084638A1 (ja) 2019-10-30 2019-10-30 気密封止型半導体装置

Publications (2)

Publication Number Publication Date
JPWO2021084638A1 true JPWO2021084638A1 (ja) 2021-05-06
JP7123271B2 JP7123271B2 (ja) 2022-08-22

Family

ID=75714942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021553948A Active JP7123271B2 (ja) 2019-10-30 2019-10-30 気密封止型半導体装置

Country Status (2)

Country Link
JP (1) JP7123271B2 (ja)
WO (1) WO2021084638A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023167013A1 (ja) * 2022-03-04 2023-09-07 三菱電機株式会社 半導体試験装置
WO2023166726A1 (ja) * 2022-03-04 2023-09-07 三菱電機株式会社 半導体装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102521A (ja) * 1999-09-29 2001-04-13 Hitachi Ltd 絶縁回路基板およびそれを用いた半導体装置
JP2005502213A (ja) * 2001-09-10 2005-01-20 アーベーベー シュヴァイツ アクチェンゲゼルシャフト 圧力接触が可能なパワー半導体モジュール
JP2009081399A (ja) * 2007-09-27 2009-04-16 Mitsubishi Electric Corp 電力半導体モジュール
JP2014216543A (ja) * 2013-04-26 2014-11-17 株式会社豊田中央研究所 半導体モジュール
JP2015015270A (ja) * 2013-07-03 2015-01-22 三菱電機株式会社 半導体装置
JP2017084850A (ja) * 2015-10-22 2017-05-18 日本発條株式会社 電力用半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102521A (ja) * 1999-09-29 2001-04-13 Hitachi Ltd 絶縁回路基板およびそれを用いた半導体装置
JP2005502213A (ja) * 2001-09-10 2005-01-20 アーベーベー シュヴァイツ アクチェンゲゼルシャフト 圧力接触が可能なパワー半導体モジュール
JP2009081399A (ja) * 2007-09-27 2009-04-16 Mitsubishi Electric Corp 電力半導体モジュール
JP2014216543A (ja) * 2013-04-26 2014-11-17 株式会社豊田中央研究所 半導体モジュール
JP2015015270A (ja) * 2013-07-03 2015-01-22 三菱電機株式会社 半導体装置
JP2017084850A (ja) * 2015-10-22 2017-05-18 日本発條株式会社 電力用半導体装置

Also Published As

Publication number Publication date
WO2021084638A1 (ja) 2021-05-06
JP7123271B2 (ja) 2022-08-22

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