JPWO2021060318A1 - - Google Patents
Info
- Publication number
- JPWO2021060318A1 JPWO2021060318A1 JP2021548951A JP2021548951A JPWO2021060318A1 JP WO2021060318 A1 JPWO2021060318 A1 JP WO2021060318A1 JP 2021548951 A JP2021548951 A JP 2021548951A JP 2021548951 A JP2021548951 A JP 2021548951A JP WO2021060318 A1 JPWO2021060318 A1 JP WO2021060318A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019173936 | 2019-09-25 | ||
| PCT/JP2020/035908 WO2021060318A1 (ja) | 2019-09-25 | 2020-09-24 | 放熱シート、放熱シート積層体、構造体及び発熱素子の放熱処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021060318A1 true JPWO2021060318A1 (https=) | 2021-04-01 |
Family
ID=75166984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021548951A Pending JPWO2021060318A1 (https=) | 2019-09-25 | 2020-09-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2021060318A1 (https=) |
| WO (1) | WO2021060318A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024004245A (ja) * | 2022-06-28 | 2024-01-16 | パナソニックIpマネジメント株式会社 | 放熱シート |
| JP2024034665A (ja) * | 2022-09-01 | 2024-03-13 | デクセリアルズ株式会社 | 積層体及び積層体の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437069U (https=) * | 1977-08-19 | 1979-03-10 | ||
| JPS56161699A (en) * | 1980-05-16 | 1981-12-12 | Denki Kagaku Kogyo Kk | Method of mounting electric part and insulating heat dissipating sheet used therefor |
| JPH02166755A (ja) * | 1988-12-21 | 1990-06-27 | Nec Corp | 伝熱シート |
| JP2017025186A (ja) * | 2015-07-21 | 2017-02-02 | 住友ベークライト株式会社 | 熱伝導性樹脂組成物、回路基板用積層体、回路基板および半導体装置 |
| WO2018190233A1 (ja) * | 2017-04-12 | 2018-10-18 | デンカ株式会社 | 熱伝導性シート及びその製造方法 |
-
2020
- 2020-09-24 JP JP2021548951A patent/JPWO2021060318A1/ja active Pending
- 2020-09-24 WO PCT/JP2020/035908 patent/WO2021060318A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437069U (https=) * | 1977-08-19 | 1979-03-10 | ||
| JPS56161699A (en) * | 1980-05-16 | 1981-12-12 | Denki Kagaku Kogyo Kk | Method of mounting electric part and insulating heat dissipating sheet used therefor |
| JPH02166755A (ja) * | 1988-12-21 | 1990-06-27 | Nec Corp | 伝熱シート |
| JP2017025186A (ja) * | 2015-07-21 | 2017-02-02 | 住友ベークライト株式会社 | 熱伝導性樹脂組成物、回路基板用積層体、回路基板および半導体装置 |
| WO2018190233A1 (ja) * | 2017-04-12 | 2018-10-18 | デンカ株式会社 | 熱伝導性シート及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021060318A1 (ja) | 2021-04-01 |
Similar Documents
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| Date | Code | Title | Description |
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