JPWO2021060318A1 - - Google Patents

Info

Publication number
JPWO2021060318A1
JPWO2021060318A1 JP2021548951A JP2021548951A JPWO2021060318A1 JP WO2021060318 A1 JPWO2021060318 A1 JP WO2021060318A1 JP 2021548951 A JP2021548951 A JP 2021548951A JP 2021548951 A JP2021548951 A JP 2021548951A JP WO2021060318 A1 JPWO2021060318 A1 JP WO2021060318A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021548951A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021060318A1 publication Critical patent/JPWO2021060318A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2021548951A 2019-09-25 2020-09-24 Pending JPWO2021060318A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019173936 2019-09-25
PCT/JP2020/035908 WO2021060318A1 (ja) 2019-09-25 2020-09-24 放熱シート、放熱シート積層体、構造体及び発熱素子の放熱処理方法

Publications (1)

Publication Number Publication Date
JPWO2021060318A1 true JPWO2021060318A1 (ja) 2021-04-01

Family

ID=75166984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021548951A Pending JPWO2021060318A1 (ja) 2019-09-25 2020-09-24

Country Status (2)

Country Link
JP (1) JPWO2021060318A1 (ja)
WO (1) WO2021060318A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024034665A (ja) * 2022-09-01 2024-03-13 デクセリアルズ株式会社 積層体及び積層体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437069U (ja) * 1977-08-19 1979-03-10
JPS56161699A (en) * 1980-05-16 1981-12-12 Denki Kagaku Kogyo Kk Method of mounting electric part and insulating heat dissipating sheet used therefor
JPH02166755A (ja) * 1988-12-21 1990-06-27 Nec Corp 伝熱シート
JP6627303B2 (ja) * 2015-07-21 2020-01-08 住友ベークライト株式会社 熱伝導性樹脂組成物、回路基板用積層体、回路基板および半導体装置
EP3612012A4 (en) * 2017-04-12 2021-01-13 Denka Company Limited THERMOCONDUCTOR SHEET AND ITS MANUFACTURING PROCESS

Also Published As

Publication number Publication date
WO2021060318A1 (ja) 2021-04-01

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