JPWO2021060064A1 - - Google Patents
Info
- Publication number
- JPWO2021060064A1 JPWO2021060064A1 JP2021548826A JP2021548826A JPWO2021060064A1 JP WO2021060064 A1 JPWO2021060064 A1 JP WO2021060064A1 JP 2021548826 A JP2021548826 A JP 2021548826A JP 2021548826 A JP2021548826 A JP 2021548826A JP WO2021060064 A1 JPWO2021060064 A1 JP WO2021060064A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019178083 | 2019-09-27 | ||
| PCT/JP2020/034840 WO2021060064A1 (en) | 2019-09-27 | 2020-09-15 | Mounting system, head unit, and imaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021060064A1 true JPWO2021060064A1 (en) | 2021-04-01 |
Family
ID=75166948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021548826A Pending JPWO2021060064A1 (en) | 2019-09-27 | 2020-09-15 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021060064A1 (en) |
| CN (1) | CN114302785A (en) |
| WO (1) | WO2021060064A1 (en) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3512388B2 (en) * | 2001-02-15 | 2004-03-29 | 川崎重工業株式会社 | Laser processing monitoring device |
| JP4459847B2 (en) * | 2005-03-17 | 2010-04-28 | パナソニック株式会社 | Component mounting head and component mounting method |
| JP2012204354A (en) * | 2011-03-23 | 2012-10-22 | Sony Corp | Solid state imaging device, manufacturing method thereof and electronic apparatus |
| JP5865606B2 (en) * | 2011-05-27 | 2016-02-17 | オリンパス株式会社 | Endoscope apparatus and method for operating endoscope apparatus |
| JP6103800B2 (en) * | 2011-07-01 | 2017-03-29 | 富士機械製造株式会社 | Component mounter |
| JP5776089B2 (en) * | 2012-04-27 | 2015-09-09 | ヤマハ発動機株式会社 | Component mounting equipment |
| WO2014174598A1 (en) * | 2013-04-24 | 2014-10-30 | 株式会社日立製作所 | Component mounting device, mounting head, and control device |
| JP2014216621A (en) * | 2013-04-30 | 2014-11-17 | 株式会社日立製作所 | Substrate processing apparatus and substrate processing method |
| CN107371360B (en) * | 2016-05-11 | 2019-07-05 | 松下知识产权经营株式会社 | Apparatus for mounting component |
| JP7002831B2 (en) * | 2016-06-07 | 2022-01-20 | 株式会社Fuji | Parts mounting machine |
| WO2019021365A1 (en) * | 2017-07-25 | 2019-01-31 | ヤマハ発動機株式会社 | Component-mounting device |
-
2020
- 2020-09-15 CN CN202080060143.5A patent/CN114302785A/en active Pending
- 2020-09-15 WO PCT/JP2020/034840 patent/WO2021060064A1/en active Application Filing
- 2020-09-15 JP JP2021548826A patent/JPWO2021060064A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN114302785A (en) | 2022-04-08 |
| WO2021060064A1 (en) | 2021-04-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230710 |