JPWO2021053453A5 - - Google Patents

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Publication number
JPWO2021053453A5
JPWO2021053453A5 JP2021546060A JP2021546060A JPWO2021053453A5 JP WO2021053453 A5 JPWO2021053453 A5 JP WO2021053453A5 JP 2021546060 A JP2021546060 A JP 2021546060A JP 2021546060 A JP2021546060 A JP 2021546060A JP WO2021053453 A5 JPWO2021053453 A5 JP WO2021053453A5
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JP
Japan
Prior art keywords
bit
data
integer
arithmetic
memory cell
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Pending
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JP2021546060A
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JPWO2021053453A1 (ja
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Priority claimed from PCT/IB2020/058318 external-priority patent/WO2021053453A1/ja
Publication of JPWO2021053453A1 publication Critical patent/JPWO2021053453A1/ja
Publication of JPWO2021053453A5 publication Critical patent/JPWO2021053453A5/ja
Pending legal-status Critical Current

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Claims (2)

  1. メモリセルアレイと、マルチプレクサ回路と、演算回路と、を有する半導体装置であって、
    前記メモリセルアレイは、行列状に配置されたm×n個(m、nは2以上の整数)のメモリセルと、n本のビット線と、を有し、
    前記マルチプレクサ回路は、n本の前記ビット線の中からs本(sは1以上n以下の整数)の前記ビット線を選択する機能と、s本の前記ビット線を介して前記メモリセルアレイから出力されたsビットの重み係数のデータを、前記演算回路に供給する機能と、を有し、
    前記演算回路は、t個(tは1以上s以下の整数)の積和演算器を有し、
    前記演算回路は、t個の前記積和演算器のそれぞれに、sビットの前記重み係数のデータからuビット(uは1以上の整数、t×uはs以下の整数)ずつ前記重み係数のデータを入力する機能を有し、
    t個の前記積和演算器のそれぞれには、前記半導体装置の外部から入力されたuビットの第2のデータが入力され、
    t個の前記積和演算器のそれぞれにおいて、uビットの前記重み係数のデータと、uビットの前記第2のデータとを用いた演算処理が並行して行われる、
    半導体装置。
  2. 請求項1において、
    前記メモリセルは、トランジスタを有し、
    前記トランジスタは、チャネル形成領域に金属酸化物を有する、
    半導体装置。
JP2021546060A 2019-09-20 2020-09-08 Pending JPWO2021053453A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019172147 2019-09-20
PCT/IB2020/058318 WO2021053453A1 (ja) 2019-09-20 2020-09-08 半導体装置

Publications (2)

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JPWO2021053453A1 JPWO2021053453A1 (ja) 2021-03-25
JPWO2021053453A5 true JPWO2021053453A5 (ja) 2023-08-30

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JP2021546060A Pending JPWO2021053453A1 (ja) 2019-09-20 2020-09-08

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US (1) US20220343954A1 (ja)
JP (1) JPWO2021053453A1 (ja)
DE (1) DE112020004469T5 (ja)
WO (1) WO2021053453A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220085020A1 (en) * 2019-01-15 2022-03-17 Semiconductor Energy Laboratory Co., Ltd. Memory device
JPWO2021024083A1 (ja) 2019-08-08 2021-02-11
CN114792688A (zh) * 2021-01-26 2022-07-26 上峰科技股份有限公司 电子系统、与宽带隙半导体器件集成的可编程电阻存储器及其操作方法
US11974422B2 (en) * 2021-11-04 2024-04-30 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3260357B2 (ja) * 1990-01-24 2002-02-25 株式会社日立製作所 情報処理装置
JP3601883B2 (ja) * 1994-11-22 2004-12-15 株式会社ルネサステクノロジ 半導体装置
TWI555128B (zh) 2010-08-06 2016-10-21 半導體能源研究所股份有限公司 半導體裝置及半導體裝置的驅動方法
WO2012029638A1 (en) 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20170122771A (ko) * 2015-02-26 2017-11-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 메모리 시스템 및 정보 처리 시스템
US10242728B2 (en) * 2016-10-27 2019-03-26 Samsung Electronics Co., Ltd. DPU architecture
JP2019056955A (ja) * 2017-09-19 2019-04-11 東芝メモリ株式会社 メモリシステム
US11322199B1 (en) * 2020-10-09 2022-05-03 Qualcomm Incorporated Compute-in-memory (CIM) cell circuits employing capacitive storage circuits for reduced area and CIM bit cell array circuits

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