JPWO2021049253A1 - - Google Patents

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Publication number
JPWO2021049253A1
JPWO2021049253A1 JP2021545180A JP2021545180A JPWO2021049253A1 JP WO2021049253 A1 JPWO2021049253 A1 JP WO2021049253A1 JP 2021545180 A JP2021545180 A JP 2021545180A JP 2021545180 A JP2021545180 A JP 2021545180A JP WO2021049253 A1 JPWO2021049253 A1 JP WO2021049253A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021545180A
Other versions
JP7550771B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Publication of JPWO2021049253A1 publication Critical patent/JPWO2021049253A1/ja
Application granted granted Critical
Publication of JP7550771B2 publication Critical patent/JP7550771B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2021545180A 2019-09-10 2020-08-17 研磨用組成物 Active JP7550771B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019164951 2019-09-10
JP2019164951 2019-09-10
PCT/JP2020/030957 WO2021049253A1 (ja) 2019-09-10 2020-08-17 研磨用組成物

Publications (2)

Publication Number Publication Date
JPWO2021049253A1 true JPWO2021049253A1 (ja) 2021-03-18
JP7550771B2 JP7550771B2 (ja) 2024-09-13

Family

ID=74865872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021545180A Active JP7550771B2 (ja) 2019-09-10 2020-08-17 研磨用組成物

Country Status (3)

Country Link
JP (1) JP7550771B2 (ja)
TW (1) TW202116965A (ja)
WO (1) WO2021049253A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114891509B (zh) * 2021-12-14 2023-05-05 湖北兴福电子材料股份有限公司 一种高选择性的缓冲氧化物蚀刻液

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009260236A (ja) 2008-03-18 2009-11-05 Hitachi Chem Co Ltd 研磨剤、これを用いた基板の研磨方法並びにこの研磨方法に用いる溶液及びスラリー
KR20180071631A (ko) * 2016-12-20 2018-06-28 주식회사 케이씨텍 다결정실리콘을 함유하는 웨이퍼의 연마 슬러리 조성물
JP6837958B2 (ja) * 2017-12-28 2021-03-03 花王株式会社 酸化珪素膜用研磨液組成物

Also Published As

Publication number Publication date
TW202116965A (zh) 2021-05-01
WO2021049253A1 (ja) 2021-03-18
JP7550771B2 (ja) 2024-09-13

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