JPWO2021045958A5 - - Google Patents
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Claims (20)
第1の側部と、前記第1の側部とは反対側の第2の側部とを有する第1のプリント回路ボード(PCB)基板と、
前記第1のPCB基板の前記第1の側部上に配置された複数のLEDであって、各LEDが第1のLEDボードの前記第1の側部から離れるように光を放射する、前記複数のLEDと、
端部と、
各々が前記第1のPCB基板の前記第2の側部から外向きに延び、かつ前記第1のPCB基板の前記第2の側部に垂直な軸に沿って圧縮性である複数の圧縮性導電性部材と、を含む第1のLEDボードと;
第1の側部と、前記第1の側部とは反対側の第2の側部とを有する第2のPCB基板と、
前記第2のPCB基板の前記第1の側部上に配置された複数のLEDであって、各々が第2のLEDボードの前記第1の側部から離れるように光を放射する複数のLEDと、
端部と、
各々が前記第2のPCB基板の前記第2の側部から外向きに延び、かつ前記第2のPCB基板の前記第2の側部に垂直な軸に沿って圧縮性である複数の圧縮性導電性部材と、を含む第2のLEDボードと;
第1の領域及び第2の領域を有する第3のPCB基板を含む相互接続ボードであって、前記第3のPCB基板は、
前記第3のPCB基板の前記第1の領域内で前記第3のPCB基板の第1の側部上に位置する複数の第1の導電性パッドと、
前記第3のPCB基板の前記第2の領域内で前記第3のPCB基板の前記第1の側部上に位置する複数の第2の導電性パッドと、を含み、前記第1の導電性パッドの各々が、前記相互接続ボードの導電性トレースによって前記第2の導電性パッドのうちの少なくとも1つに電気的に接続されている、相互接続ボードと;を備え、
前記第1のLEDボードの前記端部は、前記第2のLEDボードの前記端部に近接しており、
前記第3のPCB基板の前記第1の側部は、前記第1のLEDボードの前記第2の側部及び前記第2のLEDボードの前記第2の側部に面しており、
前記第1のLEDボードの前記圧縮性導電性部材の各々は、前記第1の導電性パッドのうちの対応する1つと導電的に接触しており、
前記第2のLEDボードの前記圧縮性導電性部材の各々は、前記複数の第2の導電性パッドのうちの対応する1つと導電的に接触しており、
前記第1のLEDボードの前記圧縮性導電性部材の各々が、前記第1の導電性パッドのうちの対応する1つと導電的に接触し、かつ前記第2のLEDボードの前記圧縮性導電性部材の各々が、前記第2の導電性パッドのうちの対応する1つと導電的に接触している時の、前記LED照明ストリップアセンブリの高さは、
前記相互接続ボードの前記第3のPCB基板の厚さと、
前記第1のLEDボードの高さ及び前記第2のLEDボードの高さのうちの大きい方、
との和にほぼ実質的に等しい、前記発光ダイオード(LED)照明ストリップアセンブリ。 A light emitting diode (LED) lighting strip assembly comprising:
a first printed circuit board (PCB) substrate having a first side and a second side opposite the first side;
a plurality of LEDs disposed on the first side of the first PCB board, each LED emitting light away from the first side of the first LED board ; a plurality of LEDs;
an end;
a plurality of compressibles each extending outwardly from the second side of the first PCB board and compressible along an axis perpendicular to the second side of the first PCB board a first LED board comprising a conductive member;
a second PCB board having a first side and a second side opposite the first side;
A plurality of LEDs disposed on the first side of the second PCB board, each LED emitting light away from the first side of the second LED board. and,
an end;
a plurality of compressibles each extending outwardly from the second side of the second PCB board and compressible along an axis perpendicular to the second side of the second PCB board a second LED board comprising a conductive member;
An interconnection board including a third PCB board having a first region and a second region, the third PCB board comprising:
a plurality of first conductive pads positioned on a first side of the third PCB board within the first region of the third PCB board;
a plurality of second conductive pads positioned on the first side of the third PCB board within the second region of the third PCB board, the first conductive pads comprising: an interconnection board, each pad being electrically connected to at least one of said second conductive pads by a conductive trace of said interconnection board;
the edge of the first LED board is proximate to the edge of the second LED board;
the first side of the third PCB board faces the second side of the first LED board and the second side of the second LED board;
each of the compressible conductive members of the first LED board is in conductive contact with a corresponding one of the first conductive pads;
each of the compressible conductive members of the second LED board is in conductive contact with a corresponding one of the plurality of second conductive pads;
Each of the compressible conductive members of the first LED board is in conductive contact with a corresponding one of the first conductive pads and the compressible conductive members of the second LED board. The height of the LED lighting strip assembly when each member is in conductive contact with a corresponding one of the second conductive pads is:
a thickness of the third PCB substrate of the interconnect board;
the greater of the height of the first LED board and the height of the second LED board;
and the light emitting diode (LED) lighting strip assembly.
前記相互接続ボードの前記第3のPCB基板の前記第2の領域に位置する少なくとも1つの第2の穴と、
前記第1のLEDボード内に位置し、前記相互接続ボードの前記第3のPCB基板の前記第1の領域に位置する前記少なくとも1つの穴に位置合わせされた少なくとも1つの穴と、
前記第2のLEDボード内に位置し、前記相互接続ボードの前記第3のPCB基板の前記第2の領域に位置する前記少なくとも1つの穴に位置合わせされた少なくとも1つの穴と、を更に備える、請求項1に記載のLED照明ストリップアセンブリ。 at least one first hole located in the first region of the third PCB board of the interconnect board;
at least one second hole located in the second region of the third PCB board of the interconnect board;
at least one hole located in the first LED board and aligned with the at least one hole located in the first region of the third PCB board of the interconnect board;
at least one hole located in the second LED board and aligned with the at least one hole located in the second region of the third PCB board of the interconnect board. The LED lighting strip assembly of claim 1.
第1の側部と、前記第1の側部とは反対側の第2の側部とを有する第1のPCB基板と、
各々が前記第1のPCB基板の前記第2の側部から外向きに延び、かつ前記第1のPCB基板の前記第2の側部に垂直な軸に沿って圧縮性である複数の圧縮性導電性部材と、を含む第1のボードと;
第1の側部と、前記第1の側部とは反対側の第2の側部とを有し、かつ前記第2のPCB基板の前記第2の側部に垂直な軸に沿って圧縮性である第2のPCB基板と、
複数の圧縮性導電性部材であって、各々が前記第2のPCB基板の前記第2の側部から外向きに延び、各々が、前記第2のボードの前記第1の側部から離れる方向に向いた前記圧縮性導電性部材の側部上に外側表面を有する、前記複数の圧縮性導電性部材と、を含む第2のボードと;
第1の領域及び第2の領域を有する第3のPCB基板を含む相互接続ボードであって、前記第3のPCB基板は、
前記第3のPCB基板の前記第1の領域内で前記第3のPCB基板の第1の側部上に位置する複数の第1の導電性パッドと、
前記第3のPCB基板の前記第2の領域内で前記第3のPCB基板の前記第1の側部上に位置する複数の第2の導電性パッドと、を含み、前記第1の導電性パッドの各々が、前記相互接続ボードの導電性トレースによって前記第2の導電性パッドのうちの少なくとも1つに電気的に接続されている、相互接続ボードと;を備え、
前記第1のボードの前記圧縮性導電性部材の各々は、前記第1の導電性パッドのうちの対応する1つと導電的に接触しており、
前記第2のボードの各圧縮性導電性部材は、前記複数の第2の導電性パッドのうちの対応する1つと導電的に接触しており、
前記第1のボードの各圧縮性導電性部材の各々が、前記第1の導電性パッドのうちの対応する1つと導電的に接触し、かつ前記第2のボードの各圧縮性導電性部材が、前記第2の導電性パッドのうちの対応する1つと導電的に接触している時の、前記PCB相互接続アセンブリの高さは、
前記相互接続ボードの前記第3のPCB基板の厚さと、
前記第1のLEDボードの高さ及び前記第2のLEDボードの高さのうちの大きい方、
との和にほぼ実質的に等しい、プリント回路ボード(PCB)相互接続アセンブリ。 A printed circuit board (PCB) interconnect assembly comprising:
a first PCB board having a first side and a second side opposite the first side;
a plurality of compressibles each extending outwardly from the second side of the first PCB board and compressible along an axis perpendicular to the second side of the first PCB board a first board including a conductive member;
along an axis perpendicular to said second side of said second PCB board having a first side and a second side opposite said first side; a second PCB substrate that is compressible ;
a plurality of compressible conductive members, each extending outwardly from the second side of the second PCB board and each directed away from the first side of the second board; a second board comprising said plurality of compressible conductive members having outer surfaces on the sides of said compressible conductive members facing toward;
An interconnection board including a third PCB board having a first region and a second region, the third PCB board comprising:
a plurality of first conductive pads positioned on a first side of the third PCB board within the first region of the third PCB board;
a plurality of second conductive pads positioned on the first side of the third PCB board within the second region of the third PCB board, the first conductive pads comprising: an interconnection board, each pad being electrically connected to at least one of said second conductive pads by a conductive trace of said interconnection board;
each of said compressible conductive members of said first board is in conductive contact with a corresponding one of said first conductive pads;
each compressible conductive member of the second board is in conductive contact with a corresponding one of the plurality of second conductive pads;
Each compressible conductive member of the first board is in conductive contact with a corresponding one of the first conductive pads, and each compressible conductive member of the second board is , the height of the PCB interconnect assembly when in conductive contact with a corresponding one of the second conductive pads is
a thickness of the third PCB substrate of the interconnect board;
the greater of the height of the first LED board and the height of the second LED board;
a printed circuit board (PCB) interconnect assembly substantially equal to the sum of
前記相互接続ボードの前記第3のPCB基板の前記第2の領域に位置する少なくとも1つの第2の穴と、
前記第1のボード内に位置し、前記相互接続ボードの前記第3のPCB基板の前記第1の領域に位置する前記少なくとも1つの穴に位置合わせされた少なくとも1つの穴と、
前記第2のボード内に位置し、前記相互接続ボードの前記第3のPCB基板の前記第2の領域に位置する前記少なくとも1つの穴に位置合わせされた少なくとも1つの穴と、を更に備える、請求項9に記載のPCB相互接続アセンブリ。 at least one first hole located in the first region of the third PCB board of the interconnect board;
at least one second hole located in the second region of the third PCB board of the interconnect board;
at least one hole located in said first board and aligned with said at least one hole located in said first region of said third PCB substrate of said interconnect board;
at least one hole located in said second board and aligned with said at least one hole located in said second region of said third PCB substrate of said interconnection board; 10. The PCB interconnect assembly of claim 9.
第1のプリント回路ボード(PCB)基板を有する相互接続ボードを支持構造体上に配置する工程であって、
前記第1のPCB基板は、前記第1のPCB基板の第1の領域内で前記第1のPCB基板の第1の側部上に位置する第1の導電性パッドと、前記第1のPCB基板の第2の領域内で前記第1のPCB基板の前記第1の側部上に位置する第2の導電性パッドとを有し、
前記第1の導電性パッドは、前記相互接続ボードの導電性トレースによって前記第2の導電性パッドに電気的に接続されている、工程と;
第2のPCB基板を有する第1のLEDボードを配置する工程であって、前記第2のPCB基板の第1の側部上に1つ以上のLEDが位置し、前記第2のPCB基板の前記第1の側部とは反対側の前記第2のPCB基板の第2の側部が、前記相互接続ボードの前記第1のPCB基板の前記第1の側部に近接し、前記第1のLEDボードの前記第2の側部から外向きに延びる第1の圧縮性導電性部材が、前記第1の導電性パッドに導電的に接触し、前記第1の圧縮性導電性部材が、前記第2のPCB基板の前記第2の側部に垂直な軸に沿って圧縮性である、工程と;
第3のPCB基板を有する第2のLEDボードを配置する工程であって、前記第3のPCB基板の第1の側部上に1つ以上のLEDが位置し、前記第3のPCB基板の前記第1の側部とは反対側の前記第3のPCB基板の第2の側部が、前記第1のPCB基板の前記第1の側部に近接し、前記第2のLEDボードの前記第2の側部から外向きに延びる第2の圧縮性導電性部材が、前記第2の導電性パッドに導電的に接触し、前記第2の圧縮性導電性部材が、前記第3のPCB基板の前記第2の側部に垂直な軸に沿って圧縮性である、工程と;
前記第1のLEDボード及び前記第2のLEDボードに1つ以上の圧縮力を印加して、前記第1のLEDボード及び前記第2のLEDボードを前記相互接続ボード又は支持構造体のうちの少なくとも1つに機械的に結合させる工程と、を含む方法。 A method of assembling an LED lighting strip assembly comprising:
placing an interconnection board having a first printed circuit board (PCB) substrate on a support structure, comprising:
The first PCB board includes: a first conductive pad located on a first side of the first PCB board within a first region of the first PCB board; a second conductive pad located on the first side of the first PCB substrate within a second region of the substrate;
said first conductive pads being electrically connected to said second conductive pads by conductive traces of said interconnection board;
disposing a first LED board having a second PCB board, one or more LEDs located on a first side of the second PCB board; a second side of the second PCB board opposite the first side is proximate the first side of the first PCB board of the interconnect board; a first compressible conductive member extending outwardly from said second side of said LED board in conductive contact with said first conductive pad , said first compressible conductive member: compressible along an axis perpendicular to the second side of the second PCB substrate ;
disposing a second LED board having a third PCB board, one or more LEDs located on a first side of the third PCB board; A second side of the third PCB board opposite the first side is proximate the first side of the first PCB board and the second LED board of the second LED board. A second compressible conductive member extending outwardly from a second side conductively contacts the second conductive pad , and the second compressible conductive member extends outwardly from the third PCB. compressible along an axis perpendicular to said second side of the substrate ;
One or more compressive forces are applied to the first LED board and the second LED board to force the first LED board and the second LED board out of the interconnect board or support structure. and mechanically coupling to at least one.
前記相互接続ボードの前記第1のPCB基板の厚さと、
前記第1のLEDボードの高さ及び前記第2のLEDボードの高さのうちの大きい方、との和にほぼ実質的に等しい、請求項16に記載の方法。 the first compressible conductive members of the first LED board are in conductive contact with the first conductive pads, and the second compressible conductive members of the second LED board are , the height of the LED lighting strip assembly when in conductive contact with the second conductive pad is
a thickness of the first PCB substrate of the interconnect board;
17. The method of claim 16, substantially equal to the sum of the height of the first LED board and the height of the second LED board, whichever is greater.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962897203P | 2019-09-06 | 2019-09-06 | |
US62/897,203 | 2019-09-06 | ||
NL2024328A NL2024328B1 (en) | 2019-09-06 | 2019-11-28 | Pcb interconnect scheme for co-planar led strips |
NL2024328 | 2019-11-28 | ||
PCT/US2020/048248 WO2021045958A1 (en) | 2019-09-06 | 2020-08-27 | Pcb interconnect scheme for co-planar led strips |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022546142A JP2022546142A (en) | 2022-11-04 |
JPWO2021045958A5 true JPWO2021045958A5 (en) | 2023-08-29 |
JP7453237B2 JP7453237B2 (en) | 2024-03-19 |
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Application Number | Title | Priority Date | Filing Date |
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JP2021537913A Active JP7453237B2 (en) | 2019-09-06 | 2020-08-27 | PCB interconnection scheme for coplanar LED strips |
Country Status (9)
Country | Link |
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EP (1) | EP3881653A1 (en) |
JP (1) | JP7453237B2 (en) |
AU (1) | AU2020343214A1 (en) |
BR (1) | BR112021013061A2 (en) |
CA (1) | CA3123642A1 (en) |
IL (1) | IL284064A (en) |
MX (1) | MX2021006290A (en) |
NL (1) | NL2024328B1 (en) |
TW (1) | TWI759831B (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8118611B2 (en) * | 2008-10-31 | 2012-02-21 | Myoungsoo Jeon | PCB bridge connector for connecting PCB devices |
US9004718B2 (en) * | 2012-04-24 | 2015-04-14 | Belwith Products, Llc | LED decorative illuminated trim system |
DE202012103264U1 (en) * | 2012-08-28 | 2013-12-04 | Zumtobel Lighting Gmbh | Arrangement for emitting light with a plurality of LED boards |
TWI566375B (en) * | 2014-09-23 | 2017-01-11 | 錼創科技股份有限公司 | Light emitting module |
CN109312912B (en) * | 2016-05-27 | 2020-12-11 | 昕诺飞控股有限公司 | Lighting device and method |
TWI618459B (en) * | 2016-11-11 | 2018-03-11 | 技嘉科技股份有限公司 | Electronic device |
-
2019
- 2019-11-28 NL NL2024328A patent/NL2024328B1/en active
-
2020
- 2020-08-24 TW TW109128789A patent/TWI759831B/en active
- 2020-08-27 EP EP20767694.1A patent/EP3881653A1/en active Pending
- 2020-08-27 BR BR112021013061A patent/BR112021013061A2/en active Search and Examination
- 2020-08-27 JP JP2021537913A patent/JP7453237B2/en active Active
- 2020-08-27 MX MX2021006290A patent/MX2021006290A/en unknown
- 2020-08-27 AU AU2020343214A patent/AU2020343214A1/en active Pending
- 2020-08-27 CA CA3123642A patent/CA3123642A1/en active Pending
-
2021
- 2021-06-16 IL IL284064A patent/IL284064A/en unknown
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