JPWO2021044620A1 - - Google Patents

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Publication number
JPWO2021044620A1
JPWO2021044620A1 JP2021543920A JP2021543920A JPWO2021044620A1 JP WO2021044620 A1 JPWO2021044620 A1 JP WO2021044620A1 JP 2021543920 A JP2021543920 A JP 2021543920A JP 2021543920 A JP2021543920 A JP 2021543920A JP WO2021044620 A1 JPWO2021044620 A1 JP WO2021044620A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021543920A
Other versions
JP7266103B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2021044620A1 publication Critical patent/JPWO2021044620A1/ja
Application granted granted Critical
Publication of JP7266103B2 publication Critical patent/JP7266103B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021543920A 2019-09-06 2019-09-06 部品実装機のバックアップピン自動配置システム Active JP7266103B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/035225 WO2021044620A1 (ja) 2019-09-06 2019-09-06 部品実装機のバックアップピン自動配置システム

Publications (2)

Publication Number Publication Date
JPWO2021044620A1 true JPWO2021044620A1 (ja) 2021-03-11
JP7266103B2 JP7266103B2 (ja) 2023-04-27

Family

ID=74853116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021543920A Active JP7266103B2 (ja) 2019-09-06 2019-09-06 部品実装機のバックアップピン自動配置システム

Country Status (5)

Country Link
US (1) US11856707B2 (ja)
EP (1) EP4027764A4 (ja)
JP (1) JP7266103B2 (ja)
CN (1) CN114287174B (ja)
WO (1) WO2021044620A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4025030A4 (en) * 2019-08-28 2022-09-14 Fuji Corporation AUTOMATIC SPARE SPINDLE ARRANGEMENT SYSTEM FOR COMPONENT ASSEMBLY MACHINE

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211051A (ja) * 2007-02-27 2008-09-11 Yamaha Motor Co Ltd バックアップピン配設位置決定装置、バックアップユニット形成装置、及び基板処理装置
JP2011014627A (ja) * 2009-06-30 2011-01-20 Hitachi High-Tech Instruments Co Ltd バックアップピン配置方法及び同配置装置並びに電子部品処理方法及び電子部品装着装置
JP5925666B2 (ja) * 2012-11-06 2016-05-25 ヤマハ発動機株式会社 部品実装装置およびバックアップピン挿入位置データ作成方法
JP6553709B2 (ja) * 2015-03-19 2019-07-31 株式会社Ｆｕｊｉ 部品実装ライン、および部品実装ラインの段取り方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06880Y2 (ja) * 1986-12-10 1994-01-05 三洋電機株式会社 基板支持装置
US5218753A (en) * 1989-06-22 1993-06-15 Sanyo Electric Co., Ltd. Assembling apparatus using back up pins for supporting printed circuit board
JP2000114793A (ja) * 1998-10-02 2000-04-21 Olympus Optical Co Ltd 基板支持装置
EP1185156B1 (en) * 1999-05-21 2008-03-12 Matsushita Electric Industrial Co., Ltd. Device for transferring/holding sheetlike member and its method
JP4503954B2 (ja) * 2003-08-21 2010-07-14 株式会社日立ハイテクインスツルメンツ 基板位置決め装置及び基板位置決め方法
JP2010278269A (ja) * 2009-05-28 2010-12-09 Hitachi High-Tech Instruments Co Ltd 支持ピンの移載方法
JP5122532B2 (ja) * 2009-06-25 2013-01-16 株式会社日立ハイテクインスツルメンツ 支持ピンの移載方法
JP5656446B2 (ja) * 2010-04-28 2015-01-21 富士機械製造株式会社 バックアップピン装置並びにバックアップピン配置方法及び配置装置
JP5850656B2 (ja) * 2011-07-01 2016-02-03 富士機械製造株式会社 基板搬送装置
JP5747167B2 (ja) * 2012-02-02 2015-07-08 パナソニックＩｐマネジメント株式会社 下受けピンの配置方法および下受けピンの返戻方法
JP6385645B2 (ja) * 2013-04-04 2018-09-05 ヤマハ発動機株式会社 レイアウト変更順位決定ユニット及び表面実装機
JP5911899B2 (ja) * 2014-02-17 2016-04-27 Ckd株式会社 基板検査装置及び部品実装装置
EP3331338B1 (en) * 2015-07-29 2022-06-29 FUJI Corporation Component mounting machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211051A (ja) * 2007-02-27 2008-09-11 Yamaha Motor Co Ltd バックアップピン配設位置決定装置、バックアップユニット形成装置、及び基板処理装置
JP2011014627A (ja) * 2009-06-30 2011-01-20 Hitachi High-Tech Instruments Co Ltd バックアップピン配置方法及び同配置装置並びに電子部品処理方法及び電子部品装着装置
JP5925666B2 (ja) * 2012-11-06 2016-05-25 ヤマハ発動機株式会社 部品実装装置およびバックアップピン挿入位置データ作成方法
JP6553709B2 (ja) * 2015-03-19 2019-07-31 株式会社Ｆｕｊｉ 部品実装ライン、および部品実装ラインの段取り方法

Also Published As

Publication number Publication date
US11856707B2 (en) 2023-12-26
US20220295681A1 (en) 2022-09-15
CN114287174B (zh) 2023-07-14
CN114287174A (zh) 2022-04-05
EP4027764A4 (en) 2022-09-07
EP4027764A1 (en) 2022-07-13
JP7266103B2 (ja) 2023-04-27
WO2021044620A1 (ja) 2021-03-11

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