JPWO2021039299A1 - - Google Patents

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Publication number
JPWO2021039299A1
JPWO2021039299A1 JP2021542678A JP2021542678A JPWO2021039299A1 JP WO2021039299 A1 JPWO2021039299 A1 JP WO2021039299A1 JP 2021542678 A JP2021542678 A JP 2021542678A JP 2021542678 A JP2021542678 A JP 2021542678A JP WO2021039299 A1 JPWO2021039299 A1 JP WO2021039299A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021542678A
Other languages
Japanese (ja)
Other versions
JPWO2021039299A5 (en
JP7250149B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021039299A1 publication Critical patent/JPWO2021039299A1/ja
Publication of JPWO2021039299A5 publication Critical patent/JPWO2021039299A5/ja
Application granted granted Critical
Publication of JP7250149B2 publication Critical patent/JP7250149B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021542678A 2019-08-26 2020-08-03 Double-sided metal-clad laminates, printed wiring boards, printed wiring devices Active JP7250149B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019153521 2019-08-26
JP2019153521 2019-08-26
PCT/JP2020/029683 WO2021039299A1 (en) 2019-08-26 2020-08-03 Two-sided metal-clad layered plate, printed wiring substrate, and printed wiring device

Publications (3)

Publication Number Publication Date
JPWO2021039299A1 true JPWO2021039299A1 (en) 2021-03-04
JPWO2021039299A5 JPWO2021039299A5 (en) 2022-02-03
JP7250149B2 JP7250149B2 (en) 2023-03-31

Family

ID=74684543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021542678A Active JP7250149B2 (en) 2019-08-26 2020-08-03 Double-sided metal-clad laminates, printed wiring boards, printed wiring devices

Country Status (2)

Country Link
JP (1) JP7250149B2 (en)
WO (1) WO2021039299A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001073249A (en) * 1999-08-31 2001-03-21 Unitika Glass Fiber Co Ltd Glass cloth for printed circuit board
JP2003211568A (en) * 2002-01-22 2003-07-29 Asahi Schwebel Co Ltd Glass cloth formed with conductor pattern, prepreg and multilayer board
JP2015023134A (en) * 2013-07-18 2015-02-02 キヤノン株式会社 Printed circuit board
JP2015099815A (en) * 2013-11-18 2015-05-28 株式会社東芝 Electronic apparatus
CN208962621U (en) * 2018-07-11 2019-06-11 金安国纪科技（珠海）有限公司 A kind of richness resin copper-clad plate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911244A (en) * 1982-07-10 1984-01-20 旭シユエ−ベル株式会社 Laminated board containing glass textile
WO2015079820A1 (en) * 2013-11-29 2015-06-04 日東紡績株式会社 Glass fiber fabric-resin composition laminate
WO2016117320A1 (en) * 2015-01-21 2016-07-28 日本電気株式会社 Wiring board and method for designing same
CN205546197U (en) * 2016-01-31 2016-08-31 深圳市博敏兴电子有限公司 High thick copper circuit board of multilayer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001073249A (en) * 1999-08-31 2001-03-21 Unitika Glass Fiber Co Ltd Glass cloth for printed circuit board
JP2003211568A (en) * 2002-01-22 2003-07-29 Asahi Schwebel Co Ltd Glass cloth formed with conductor pattern, prepreg and multilayer board
JP2015023134A (en) * 2013-07-18 2015-02-02 キヤノン株式会社 Printed circuit board
JP2015099815A (en) * 2013-11-18 2015-05-28 株式会社東芝 Electronic apparatus
CN208962621U (en) * 2018-07-11 2019-06-11 金安国纪科技（珠海）有限公司 A kind of richness resin copper-clad plate

Also Published As

Publication number Publication date
JP7250149B2 (en) 2023-03-31
WO2021039299A1 (en) 2021-03-04

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