CN208962621U - A kind of richness resin copper-clad plate - Google Patents
A kind of richness resin copper-clad plate Download PDFInfo
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- CN208962621U CN208962621U CN201821099010.5U CN201821099010U CN208962621U CN 208962621 U CN208962621 U CN 208962621U CN 201821099010 U CN201821099010 U CN 201821099010U CN 208962621 U CN208962621 U CN 208962621U
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Abstract
The utility model provides a kind of rich resin copper-clad plate, it is included in several semi-solid preparation layers and the copper foil layer being arranged in the two sides in middle position that middle position is stacked, semi-solid preparation layer includes hydrophobic resin layer and the glass layer for being embedded in hydrophobic resin layer, and glass layer includes 7628 type glass fabric layers and/or 1080 type glass fabric layers.Richness resin structure for covering copper plate provided by the utility model, hydrophobic resin content ratio is greater than traditional copper-clad plate content in its whole plate, overall resin content be higher than plate gross mass 55%, be adapted to hyperbaric environment use, glass fibre completely by resin it is coated, be impregnated with, without capillary gap in plate construction, therefore, there are extremely low water absorbing properties, plate uses in wet environment, its sheet resistance, volume resistivity are all more stable, and the reliability of every electric property is effectively promoted.
Description
Technical field
The utility model belongs to copper-clad laminate technical field, and in particular to a kind of richness resin copper-clad plate.
Background technique
The production of copper-clad plate is usually that reinforcing material (such as glass fabric, wood pulp paper) is used resin dip-coating, by drying
Roasting forms semi-solid preparation film and several semi-solid preparation films is superimposed together according to the technological requirements, then in its two-sided or single side
Copper-clad laminate is formed with the laminating hot pressing of copper foil.Traditional FR-4 copper-clad plate is using 1080 type glass cloth, 2116 type glass
Glass cloth or 7628 type glass cloth and other relatively thin glass fabrics are as reinforcing material.Half when for multi-layer board pressing is solid
Change piece, 1080 type prepreg resin contents not more than 70%, 2116 type prepreg resin contents are not more than
60%, 7628 type prepreg resin contents not more than 50%, and be used for copper-clad plate production when, then resin content can also phase
Reduce with answering, good process for pressing could be maintained in this way.
However, for the electronic and electrical equipment used under some wet environments, under high voltage condition, when the suction of plate
When aqueous larger, the decaying of pcb board insulation performance will lead to, to influence the stability of electronic and electrical equipment.Meanwhile when copper sheet is met
It can give off poisonous gas, and sustained combustion also results in short circuit, cause further dangerous to open fire burning.So development is covered
The heat-resisting of copper sheet, flame retardant property are also very necessary.
Therefore, it still needs to develop a kind of low water absorption, is adapted to high humidity, the copper-clad plate that hyperbaric environment uses.
Utility model content
To solve problems of the prior art, the utility model provides a kind of rich resin copper-clad plate.
To achieve the above object, the utility model uses following technical scheme:
A kind of richness resin copper-clad plate is included in several semi-solid preparation layers that middle position is stacked and in middle position
The copper foil layer of two sides setting；
The semi-solid preparation layer includes hydrophobic resin layer and the glass layer for being embedded in hydrophobic resin layer；
The glass layer includes 7628 type glass fabric layers and/or 1080 type glass fabric layers.
Preferably, the hydrophobic resin layer is macromolecular hydrophobic resin layer.
Preferably, in the semi-solid preparation layer, the quantity of glass layer is less equal than the quantity of hydrophobic resin layer.
Preferably, the semi-solid preparation layer includes the first semi-solid preparation layer and the second semi-solid preparation layer, the glass in the first semi-solid preparation layer
Glass fibrous layer is 7628 fiber type layer of cloths, and the glass layer in the second semi-solid preparation layer is 1080 fiber type layer of cloths.
It is further preferred that the first semi-solid preparation layer is set to middle part, and quantity is at least two layers in the semi-solid preparation layer.
It is further preferred that the second semi-solid preparation layer is set to middle part, and quantity is at least two layers in the semi-solid preparation layer.
It is further preferred that the first semi-solid preparation layer is set to middle part in the semi-solid preparation layer, the second semi-solid preparation layer is set to
First semi-solid preparation layer two sides.
It is further preferred that the second semi-solid preparation layer is set to middle part in the semi-solid preparation layer, the first semi-solid preparation layer is set to
Second semi-solid preparation layer two sides.
It is further preferred that the first semi-solid preparation layer and the second semi-solid preparation layer intersecting are arranged in the semi-solid preparation layer.
Preferably, the copper foil layer with a thickness of 0.01~0.04mm.
Richness resin structure for covering copper plate provided by the utility model, hydrophobic resin content ratio, which is greater than, in whole plate passes
It unites copper-clad plate content, i.e., in plate construction, overall resin content is higher than the 55% of plate gross mass, in conventional structure for covering copper plate,
Resin content is relatively low, and hundred parts of contents of run-of-the-mill are less than 50%.Rich resin content copper-clad plate, due to its resin content compared with
Height, glass fibre completely by resin it is coated, be impregnated with, without capillary gap in plate construction, therefore, there are extremely low water absorbing properties,
Under high humidity environment, good electric property remain.Simultaneously as resin content is higher, the density of resin is compared with glass fibre
Cloth is low, then, the glass fabric quantity of the plate of condition of equivalent thickness, use is relatively small, therefore, correspondingly reduces plate
Manufacturing cost.
The beneficial effects of the utility model
1, rich resin structure for covering copper plate provided by the utility model, hydrophobic resin content ratio is greater than in whole plate
Traditional copper-clad plate content, overall resin content are higher than the 55% of plate gross mass, are adapted to hyperbaric environment use；
2, rich resin content copper-clad plate provided by the utility model, since its resin content is higher, glass fabric layer quilt completely
Hydrophobic resin layer is coated, is impregnated with, and without capillary gap in plate construction, therefore, has extremely low water absorbing properties, plate is in humidity
It is used in environment, sheet resistance, volume resistivity are all more stable, and the reliability of every electric property is effectively mentioned
It rises；
3, rich resin content copper-clad plate provided by the utility model, since its resin content is higher, the density of resin is compared with glass
Glass cloth is low, the plate of condition of equivalent thickness, and the glass cloth quantity of use is relatively small, therefore, correspondingly reduce the manufacture of plate at
This.
Detailed description of the invention
Fig. 1 is the layer structure schematic diagram of the rich resin copper-clad plate of embodiment 1.
Fig. 2 is the layer structure schematic diagram of the rich resin copper-clad plate of embodiment 2.
Fig. 3 is the layer structure schematic diagram of the rich resin copper-clad plate of embodiment 3.
Fig. 4 is the layer structure schematic diagram of the rich resin copper-clad plate of comparative example 1.
Specific embodiment
Specific embodiment of the utility model below, and be described with reference to the drawings to the technical solution of the utility model make into
The description of one step, but the utility model is not limited to these examples.
Embodiment 1
It is 1.6mm with plate thickness, for copper thickness is the rich resin copper-clad plate of 0.018mm:
Semi-solid preparation layer is the first semi-solid preparation layer 1, and the glass fabric layer in the first semi-solid preparation layer 1 uses 7628 type glass fabric layers,
Glass fabric layer dip-coating macromolecular asphalt mixtures modified by epoxy resin glue, is made the semi-solid preparation layer of rich resin content after baked, semi-solid preparation layer resin contains
Amount is 58~60%, and single thickness is 0.25~0.26mm after cured molding,
As shown in Figure 1,6 the first semi-solid preparation layers 1 stack, upper and lower surface or single side respectively cover one with a thickness of
The electrolytic copper foil 2 of 0.018mm, by the hot-forming rich resin copper-clad plate to get 1.6mm thickness.
Embodiment 2
It is 1.1mm with plate thickness, for copper thickness is the rich resin copper-clad plate of 0.035mm:
Semi-solid preparation layer includes the first semi-solid preparation layer 1 and the second semi-solid preparation layer 3, and the glass fabric layer in the first semi-solid preparation layer 1 is adopted
With 7628 type glass fabric layers, the glass fabric layer in the second semi-solid preparation layer 3 uses 21080 type glass fabric layers, two kinds of glass fabric layers point
The prepreg 1 of rich resin content, resin in the first semi-solid preparation layer 1 is made in other dip-coating macromolecular asphalt mixtures modified by epoxy resin glue after baked
Content is 50~52%, and the thickness after curing molding is about 0.20~0.22mm, and resin content is 76 in the second semi-solid preparation layer 3
~78%, curing molding is with a thickness of 0.09~0.11mm.
As shown in Fig. 2, 4 the first semi-solid preparation layers 1 stack, two sides stack unifies the second semi-solid preparation of layer layer 3, then,
Cover one respectively in 3 upper and lower surface of the second semi-solid preparation layer with a thickness of the electrolytic copper foil 2 of 0.035mm, by it is hot-forming to get
The rich resin copper-clad plate of 1.5mm thickness.
Embodiment 3
It is 1.1mm with plate thickness, for copper thickness is the rich resin copper-clad plate of 0.035mm:
Semi-solid preparation layer includes the first semi-solid preparation layer 1 and the second semi-solid preparation layer 3, and the glass fabric layer in the first semi-solid preparation layer 1 is adopted
With 7628 type glass fabric layers, the glass fabric layer in the second semi-solid preparation layer 3 uses 21080 type glass fabric layers, two kinds of glass fabric layers point
The prepreg 1 of rich resin content, resin in the first semi-solid preparation layer 1 is made in other dip-coating macromolecular asphalt mixtures modified by epoxy resin glue after baked
Content is 50~52%, and the thickness after curing molding is about 0.20~0.22mm, and resin content is 76 in the second semi-solid preparation layer 3
~78%, curing molding is with a thickness of 0.09~0.11mm.
As shown in figure 3,1 the first semi-solid preparation layer 1 is located at middle part, two sides respectively overlaps four layer of second semi-solid preparation layer 3, then,
Cover one respectively in 3 upper and lower surface of the second semi-solid preparation layer with a thickness of the electrolytic copper foil 2 of 0.035mm, by it is hot-forming to get
The rich resin copper-clad plate of 1.5mm thickness.
Comparative example 1
It is 1.6mm with plate thickness, for copper thickness is the rich resin copper-clad plate of 0.018mm:
Glass fabric layer uses 7628 type glass fabric layers in first semi-solid preparation layer 1, and glass fabric layer dip-coating ordinary resin is baked
The first semi-solid preparation layer 1 is made afterwards, resin content is 45% in the first semi-solid preparation layer 1, and single thickness is 0.13- after cured molding
0.15mm。
As shown in figure 4, needing to reach the plate thickness of 1.6mm, then the first semi-solid preparation layer 1 by 10 or so is needed to be stacked in one
It rises, upper and lower surface or single side respectively cover an electrolytic copper foil 2 with a thickness of 0.018mm again, and process is hot-forming, and it is thick just to obtain 1.6mm
The copper-clad plate of degree, and in embodiment 1, it is only necessary to the thickness can be realized in 6 the first semi-solid preparation layers 1.
Claims (6)
1. a kind of richness resin copper-clad plate, which is characterized in that be included in several semi-solid preparation layers that middle position is stacked and in
The copper foil layer of the two sides setting in middle position；
The semi-solid preparation layer includes hydrophobic resin layer and the glass layer for being embedded in hydrophobic resin layer；
The hydrophobic resin layer is macromolecular hydrophobic resin layer；
In the semi-solid preparation layer, the quantity of glass layer is less equal than the quantity of hydrophobic resin layer；
The semi-solid preparation layer includes the first semi-solid preparation layer and the second semi-solid preparation layer, and the glass layer in the first semi-solid preparation layer is
7628 fiber type layer of cloths, the glass layer in the second semi-solid preparation layer are 1080 fiber type layer of cloths；
The copper foil layer with a thickness of 0.01~0.04mm.
2. richness resin copper-clad plate according to claim 1, which is characterized in that in the semi-solid preparation layer, the first semi-solid preparation layer
It is set to middle part, and quantity is at least two layers.
3. richness resin copper-clad plate according to claim 1, which is characterized in that in the semi-solid preparation layer, the second semi-solid preparation layer
It is set to middle part, and quantity is at least two layers.
4. richness resin copper-clad plate according to claim 1, which is characterized in that in the semi-solid preparation layer, the first semi-solid preparation layer
It is set to middle part, the second semi-solid preparation layer is set to the first semi-solid preparation layer two sides.
5. richness resin copper-clad plate according to claim 1, which is characterized in that in the semi-solid preparation layer, the second semi-solid preparation layer
It is set to middle part, the first semi-solid preparation layer is set to the second semi-solid preparation layer two sides.
6. richness resin copper-clad plate according to claim 1, which is characterized in that in the semi-solid preparation layer, the first semi-solid preparation layer
It is arranged with the second semi-solid preparation layer intersecting.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821099010.5U CN208962621U (en) | 2018-07-11 | 2018-07-11 | A kind of richness resin copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821099010.5U CN208962621U (en) | 2018-07-11 | 2018-07-11 | A kind of richness resin copper-clad plate |
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| CN208962621U true CN208962621U (en) | 2019-06-11 |
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| CN201821099010.5U Active CN208962621U (en) | 2018-07-11 | 2018-07-11 | A kind of richness resin copper-clad plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021039299A1 (en) * | 2019-08-26 | 2021-03-04 |
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2018
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021039299A1 (en) * | 2019-08-26 | 2021-03-04 | ||
| WO2021039299A1 (en) * | 2019-08-26 | 2021-03-04 | 三菱電機株式会社 | Two-sided metal-clad layered plate, printed wiring substrate, and printed wiring device |
| JP7250149B2 (en) | 2019-08-26 | 2023-03-31 | 三菱電機株式会社 | Double-sided metal-clad laminates, printed wiring boards, printed wiring devices |
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