JPWO2021033600A1 - - Google Patents
Info
- Publication number
- JPWO2021033600A1 JPWO2021033600A1 JP2021540741A JP2021540741A JPWO2021033600A1 JP WO2021033600 A1 JPWO2021033600 A1 JP WO2021033600A1 JP 2021540741 A JP2021540741 A JP 2021540741A JP 2021540741 A JP2021540741 A JP 2021540741A JP WO2021033600 A1 JPWO2021033600 A1 JP WO2021033600A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019151092 | 2019-08-21 | ||
PCT/JP2020/030611 WO2021033600A1 (en) | 2019-08-21 | 2020-08-11 | Control module and semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021033600A1 true JPWO2021033600A1 (en) | 2021-02-25 |
Family
ID=74660828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021540741A Pending JPWO2021033600A1 (en) | 2019-08-21 | 2020-08-11 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2021033600A1 (en) |
CN (1) | CN114270679A (en) |
DE (1) | DE212020000607U1 (en) |
WO (1) | WO2021033600A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023243464A1 (en) * | 2022-06-17 | 2023-12-21 | ローム株式会社 | Semiconductor device, semiconductor module, and semiconductor module mounting structure |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2725952B2 (en) * | 1992-06-30 | 1998-03-11 | 三菱電機株式会社 | Semiconductor power module |
JP2004063604A (en) * | 2002-07-26 | 2004-02-26 | Hitachi Home & Life Solutions Inc | Power module and refrigerator employing the power module |
JP6408857B2 (en) * | 2014-10-20 | 2018-10-17 | ローム株式会社 | Gate driver unit and power module |
JP6397861B2 (en) | 2016-08-22 | 2018-09-26 | 高周波熱錬株式会社 | Power semiconductor module and induction heating power supply device |
JP6360865B2 (en) * | 2016-09-28 | 2018-07-18 | 高周波熱錬株式会社 | Snubber circuit, power semiconductor module, and induction heating power supply device |
JP6770456B2 (en) * | 2017-02-17 | 2020-10-14 | ルネサスエレクトロニクス株式会社 | Electronic device |
-
2020
- 2020-08-11 JP JP2021540741A patent/JPWO2021033600A1/ja active Pending
- 2020-08-11 WO PCT/JP2020/030611 patent/WO2021033600A1/en active Application Filing
- 2020-08-11 DE DE212020000607.5U patent/DE212020000607U1/en active Active
- 2020-08-11 CN CN202080058152.0A patent/CN114270679A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2021033600A1 (en) | 2021-02-25 |
DE212020000607U1 (en) | 2021-12-14 |
CN114270679A (en) | 2022-04-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230602 |