JPWO2021010210A1 - - Google Patents
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- Publication number
- JPWO2021010210A1 JPWO2021010210A1 JP2021532798A JP2021532798A JPWO2021010210A1 JP WO2021010210 A1 JPWO2021010210 A1 JP WO2021010210A1 JP 2021532798 A JP2021532798 A JP 2021532798A JP 2021532798 A JP2021532798 A JP 2021532798A JP WO2021010210 A1 JPWO2021010210 A1 JP WO2021010210A1
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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