JPWO2021005450A1 - - Google Patents
Info
- Publication number
- JPWO2021005450A1 JPWO2021005450A1 JP2021530329A JP2021530329A JPWO2021005450A1 JP WO2021005450 A1 JPWO2021005450 A1 JP WO2021005450A1 JP 2021530329 A JP2021530329 A JP 2021530329A JP 2021530329 A JP2021530329 A JP 2021530329A JP WO2021005450 A1 JPWO2021005450 A1 JP WO2021005450A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
- G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/44—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/779—Circuitry for scanning or addressing the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/7795—Circuitry for generating timing or clock signals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Multimedia (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Electromagnetism (AREA)
- Computer Security & Cryptography (AREA)
- Software Systems (AREA)
- Computer Networks & Wireless Communication (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019129555 | 2019-07-11 | ||
PCT/IB2020/056156 WO2021005450A1 (ja) | 2019-07-11 | 2020-06-30 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021005450A1 true JPWO2021005450A1 (ja) | 2021-01-14 |
JPWO2021005450A5 JPWO2021005450A5 (ja) | 2023-06-14 |
Family
ID=74114967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021530329A Pending JPWO2021005450A1 (ja) | 2019-07-11 | 2020-06-30 |
Country Status (6)
Country | Link |
---|---|
US (2) | US11741209B2 (ja) |
JP (1) | JPWO2021005450A1 (ja) |
KR (1) | KR20220031570A (ja) |
CN (1) | CN114097087A (ja) |
DE (1) | DE112020003300T5 (ja) |
WO (1) | WO2021005450A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114430833A (zh) | 2019-09-27 | 2022-05-03 | 株式会社半导体能源研究所 | 电子设备及程序 |
JPWO2021214617A1 (ja) | 2020-04-24 | 2021-10-28 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002203397A (ja) * | 2000-10-24 | 2002-07-19 | Alps Electric Co Ltd | シフトレジスタ回路、表示装置およびイメージセンサ |
US7566010B2 (en) | 2003-12-26 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Securities, chip mounting product, and manufacturing method thereof |
US8736587B2 (en) | 2008-07-10 | 2014-05-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
TWI693606B (zh) | 2014-02-21 | 2020-05-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置及電子裝置 |
US10199006B2 (en) | 2014-04-24 | 2019-02-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display module, and electronic device |
KR102364744B1 (ko) * | 2015-08-20 | 2022-02-21 | 삼성디스플레이 주식회사 | 게이트 구동부, 이를 포함하는 표시 장치 및 표시 장치의 구동 방법 |
CN108109592B (zh) | 2016-11-25 | 2022-01-25 | 株式会社半导体能源研究所 | 显示装置及其工作方法 |
JP2019079415A (ja) | 2017-10-26 | 2019-05-23 | 京セラ株式会社 | 電子機器、制御装置、制御プログラム及び電子機器の動作方法 |
CN112673488B (zh) | 2018-09-14 | 2024-07-16 | 株式会社半导体能源研究所 | 显示装置、显示模块及电子设备 |
US11394014B2 (en) | 2019-08-29 | 2022-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Display unit, display module, and electronic device |
TW202117694A (zh) | 2019-09-27 | 2021-05-01 | 日商半導體能源研究所股份有限公司 | 顯示裝置、識別方法及程式 |
-
2020
- 2020-06-30 DE DE112020003300.7T patent/DE112020003300T5/de active Pending
- 2020-06-30 WO PCT/IB2020/056156 patent/WO2021005450A1/ja active Application Filing
- 2020-06-30 JP JP2021530329A patent/JPWO2021005450A1/ja active Pending
- 2020-06-30 CN CN202080050203.5A patent/CN114097087A/zh active Pending
- 2020-06-30 KR KR1020217042706A patent/KR20220031570A/ko active Search and Examination
- 2020-06-30 US US17/623,294 patent/US11741209B2/en active Active
-
2023
- 2023-08-24 US US18/237,437 patent/US20240028680A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20220327187A1 (en) | 2022-10-13 |
US20240028680A1 (en) | 2024-01-25 |
DE112020003300T5 (de) | 2022-08-18 |
US11741209B2 (en) | 2023-08-29 |
WO2021005450A1 (ja) | 2021-01-14 |
CN114097087A (zh) | 2022-02-25 |
KR20220031570A (ko) | 2022-03-11 |
Similar Documents
Legal Events
Date | Code | Title | Description |
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A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230606 |
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230606 |