JPWO2020262519A1 - - Google Patents
Info
- Publication number
- JPWO2020262519A1 JPWO2020262519A1 JP2021527721A JP2021527721A JPWO2020262519A1 JP WO2020262519 A1 JPWO2020262519 A1 JP WO2020262519A1 JP 2021527721 A JP2021527721 A JP 2021527721A JP 2021527721 A JP2021527721 A JP 2021527721A JP WO2020262519 A1 JPWO2020262519 A1 JP WO2020262519A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
- C04B35/587—Fine ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019119570 | 2019-06-27 | ||
JP2019119570 | 2019-06-27 | ||
PCT/JP2020/024964 WO2020262519A1 (ja) | 2019-06-27 | 2020-06-25 | 窒化ケイ素基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020262519A1 true JPWO2020262519A1 (ja) | 2020-12-30 |
JP7430184B2 JP7430184B2 (ja) | 2024-02-09 |
Family
ID=74061725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021527721A Active JP7430184B2 (ja) | 2019-06-27 | 2020-06-25 | 窒化ケイ素基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7430184B2 (ja) |
WO (1) | WO2020262519A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005213131A (ja) * | 2004-02-02 | 2005-08-11 | Isuzu Motors Ltd | セラミックス及びその製造方法 |
JP2012092006A (ja) * | 2010-09-29 | 2012-05-17 | Kyocera Corp | 窒化珪素質焼結体およびこれを用いた回路基板ならびに電子装置 |
JP2014005190A (ja) * | 2012-05-31 | 2014-01-16 | Kyocera Corp | セラミック焼結体,これを用いた耐食性部材およびフィルターならびにハレーション防止部材 |
WO2015147071A1 (ja) * | 2014-03-25 | 2015-10-01 | 京セラ株式会社 | 流路部材および半導体モジュール |
-
2020
- 2020-06-25 WO PCT/JP2020/024964 patent/WO2020262519A1/ja active Application Filing
- 2020-06-25 JP JP2021527721A patent/JP7430184B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005213131A (ja) * | 2004-02-02 | 2005-08-11 | Isuzu Motors Ltd | セラミックス及びその製造方法 |
JP2012092006A (ja) * | 2010-09-29 | 2012-05-17 | Kyocera Corp | 窒化珪素質焼結体およびこれを用いた回路基板ならびに電子装置 |
JP2014005190A (ja) * | 2012-05-31 | 2014-01-16 | Kyocera Corp | セラミック焼結体,これを用いた耐食性部材およびフィルターならびにハレーション防止部材 |
WO2015147071A1 (ja) * | 2014-03-25 | 2015-10-01 | 京セラ株式会社 | 流路部材および半導体モジュール |
Also Published As
Publication number | Publication date |
---|---|
JP7430184B2 (ja) | 2024-02-09 |
WO2020262519A1 (ja) | 2020-12-30 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230206 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230912 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231016 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240116 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240130 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7430184 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |