JPWO2020255474A1 - - Google Patents

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Publication number
JPWO2020255474A1
JPWO2020255474A1 JP2021527343A JP2021527343A JPWO2020255474A1 JP WO2020255474 A1 JPWO2020255474 A1 JP WO2020255474A1 JP 2021527343 A JP2021527343 A JP 2021527343A JP 2021527343 A JP2021527343 A JP 2021527343A JP WO2020255474 A1 JPWO2020255474 A1 JP WO2020255474A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021527343A
Other versions
JP7265729B2 (ja
JPWO2020255474A5 (ja
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Publication of JPWO2020255474A1 publication Critical patent/JPWO2020255474A1/ja
Publication of JPWO2020255474A5 publication Critical patent/JPWO2020255474A5/ja
Application granted granted Critical
Publication of JP7265729B2 publication Critical patent/JP7265729B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/093—Conductive package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/037—Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2021527343A 2019-06-19 2020-02-04 共振装置及び共振装置製造方法 Active JP7265729B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019113800 2019-06-19
JP2019113800 2019-06-19
PCT/JP2020/004014 WO2020255474A1 (ja) 2019-06-19 2020-02-04 共振装置及び共振装置製造方法

Publications (3)

Publication Number Publication Date
JPWO2020255474A1 true JPWO2020255474A1 (ja) 2020-12-24
JPWO2020255474A5 JPWO2020255474A5 (ja) 2022-01-20
JP7265729B2 JP7265729B2 (ja) 2023-04-27

Family

ID=74039994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021527343A Active JP7265729B2 (ja) 2019-06-19 2020-02-04 共振装置及び共振装置製造方法

Country Status (4)

Country Link
US (1) US20210403316A1 (ja)
JP (1) JP7265729B2 (ja)
CN (1) CN113632375A (ja)
WO (1) WO2020255474A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11601111B2 (en) * 2020-06-26 2023-03-07 Xiang Zheng Tu Piezoelectric MEMS resonators based on porous silicon technologies
EP4324785A1 (en) 2022-08-03 2024-02-21 STMicroelectronics S.r.l. Mems device with an improved cap and related manufacturing process

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242795A (ja) * 1997-02-26 1998-09-11 Matsushita Electric Ind Co Ltd 圧電素子とその製造方法
JP2001267875A (ja) * 2000-03-22 2001-09-28 Seiko Epson Corp 水晶振動子及びその製造方法
JP2005286510A (ja) * 2004-03-29 2005-10-13 Toshiba Corp 薄膜圧電共振器及びその製造方法
JP2009055294A (ja) * 2007-08-27 2009-03-12 Seiko Instruments Inc 発振子、発振子の製造方法、及び発振器
JP2013055632A (ja) * 2011-08-11 2013-03-21 Nippon Dempa Kogyo Co Ltd 気密封止パッケージ及びこの気密封止パッケージの製造方法
WO2017047663A1 (ja) * 2015-09-17 2017-03-23 株式会社村田製作所 Ｍｅｍｓデバイス、及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005276978A (ja) * 2004-03-24 2005-10-06 Nissan Motor Co Ltd オーミック電極構造体の製造方法、オーミック電極構造体、半導体装置の製造方法および半導体装置
JP4933866B2 (ja) * 2006-08-31 2012-05-16 シチズンファインテックミヨタ株式会社 圧電振動子の製造方法
WO2016158056A1 (ja) * 2015-03-31 2016-10-06 株式会社村田製作所 共振装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242795A (ja) * 1997-02-26 1998-09-11 Matsushita Electric Ind Co Ltd 圧電素子とその製造方法
JP2001267875A (ja) * 2000-03-22 2001-09-28 Seiko Epson Corp 水晶振動子及びその製造方法
JP2005286510A (ja) * 2004-03-29 2005-10-13 Toshiba Corp 薄膜圧電共振器及びその製造方法
JP2009055294A (ja) * 2007-08-27 2009-03-12 Seiko Instruments Inc 発振子、発振子の製造方法、及び発振器
JP2013055632A (ja) * 2011-08-11 2013-03-21 Nippon Dempa Kogyo Co Ltd 気密封止パッケージ及びこの気密封止パッケージの製造方法
WO2017047663A1 (ja) * 2015-09-17 2017-03-23 株式会社村田製作所 Ｍｅｍｓデバイス、及びその製造方法

Also Published As

Publication number Publication date
CN113632375A (zh) 2021-11-09
JP7265729B2 (ja) 2023-04-27
WO2020255474A1 (ja) 2020-12-24
US20210403316A1 (en) 2021-12-30

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