JPWO2020250755A1 - - Google Patents

Info

Publication number
JPWO2020250755A1
JPWO2020250755A1 JP2021526023A JP2021526023A JPWO2020250755A1 JP WO2020250755 A1 JPWO2020250755 A1 JP WO2020250755A1 JP 2021526023 A JP2021526023 A JP 2021526023A JP 2021526023 A JP2021526023 A JP 2021526023A JP WO2020250755 A1 JPWO2020250755 A1 JP WO2020250755A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021526023A
Other versions
JP7141532B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020250755A1 publication Critical patent/JPWO2020250755A1/ja
Application granted granted Critical
Publication of JP7141532B2 publication Critical patent/JP7141532B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
JP2021526023A 2019-06-11 2020-06-02 ハウジング及び加工装置の取扱方法 Active JP7141532B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019108436 2019-06-11
JP2019108436 2019-06-11
PCT/JP2020/021819 WO2020250755A1 (ja) 2019-06-11 2020-06-02 ハウジング及び加工装置の取扱方法

Publications (2)

Publication Number Publication Date
JPWO2020250755A1 true JPWO2020250755A1 (ja) 2020-12-17
JP7141532B2 JP7141532B2 (ja) 2022-09-22

Family

ID=73780884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021526023A Active JP7141532B2 (ja) 2019-06-11 2020-06-02 ハウジング及び加工装置の取扱方法

Country Status (5)

Country Link
US (1) US20220226936A1 (ja)
JP (1) JP7141532B2 (ja)
CN (1) CN113950614B (ja)
CA (1) CA3143009C (ja)
WO (1) WO2020250755A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022165670A (ja) * 2021-04-20 2022-11-01 株式会社神戸製鋼所 溶接装置および温度測定装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002005737A (ja) * 2000-06-20 2002-01-09 Komatsu Ltd 光検出装置
CN201371319Y (zh) * 2009-03-11 2009-12-30 深圳市大族激光科技股份有限公司 扫描镜装置
WO2015129249A1 (ja) * 2014-02-25 2015-09-03 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッドおよびレーザ加工システム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000072120A (ja) * 1998-08-26 2000-03-07 Tsukasa Kogyo Kk 遠心式自動開袋装置
US6984839B2 (en) * 2002-11-22 2006-01-10 Tdk Corporation Wafer processing apparatus capable of mapping wafers
CN101263386A (zh) * 2005-05-10 2008-09-10 森萨塔科技荷兰有限公司 传感器模块封装
JP5868118B2 (ja) * 2011-10-26 2016-02-24 株式会社ディスコ レーザー加工装置
CN103813834B (zh) * 2011-11-01 2016-04-06 新东工业株式会社 集尘装置及集尘装置的火灾检测方法
CN107238137B (zh) * 2017-08-13 2021-12-03 徐州百艾电子科技有限公司 一种环保空气污染净化器
TWI650545B (zh) * 2017-08-22 2019-02-11 研能科技股份有限公司 致動傳感模組
CN208187919U (zh) * 2018-04-26 2018-12-04 焦作子亮红外传感有限公司 一种激光粉尘传感器的风道结构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002005737A (ja) * 2000-06-20 2002-01-09 Komatsu Ltd 光検出装置
CN201371319Y (zh) * 2009-03-11 2009-12-30 深圳市大族激光科技股份有限公司 扫描镜装置
WO2015129249A1 (ja) * 2014-02-25 2015-09-03 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッドおよびレーザ加工システム

Also Published As

Publication number Publication date
CN113950614B (zh) 2023-10-24
CA3143009C (en) 2023-09-12
JP7141532B2 (ja) 2022-09-22
WO2020250755A1 (ja) 2020-12-17
CN113950614A (zh) 2022-01-18
CA3143009A1 (en) 2020-12-17
US20220226936A1 (en) 2022-07-21

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