JPWO2020241574A1 - - Google Patents

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Publication number
JPWO2020241574A1
JPWO2020241574A1 JP2020552045A JP2020552045A JPWO2020241574A1 JP WO2020241574 A1 JPWO2020241574 A1 JP WO2020241574A1 JP 2020552045 A JP2020552045 A JP 2020552045A JP 2020552045 A JP2020552045 A JP 2020552045A JP WO2020241574 A1 JPWO2020241574 A1 JP WO2020241574A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2020552045A
Other languages
Japanese (ja)
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JP7104353B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2020241574A1 publication Critical patent/JPWO2020241574A1/ja
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Publication of JP7104353B2 publication Critical patent/JP7104353B2/en
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Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2020552045A 2019-05-27 2020-05-25 Solder paste and flux for solder paste Active JP7104353B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019098936 2019-05-27
JP2019098936 2019-05-27
PCT/JP2020/020549 WO2020241574A1 (en) 2019-05-27 2020-05-25 Solder paste and flux for solder paste

Publications (2)

Publication Number Publication Date
JPWO2020241574A1 true JPWO2020241574A1 (en) 2020-12-03
JP7104353B2 JP7104353B2 (en) 2022-07-21

Family

ID=73552178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020552045A Active JP7104353B2 (en) 2019-05-27 2020-05-25 Solder paste and flux for solder paste

Country Status (3)

Country Link
JP (1) JP7104353B2 (en)
TW (1) TWI817013B (en)
WO (1) WO2020241574A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11114691A (en) * 1997-10-07 1999-04-27 Uchihashi Estec Co Ltd Solder alloy
JP2006016681A (en) * 2004-07-05 2006-01-19 Nosaku:Kk Metallic vessel, metallic product composed of metal used for the metallic product and method for producing the same
JP2006181637A (en) * 2004-12-03 2006-07-13 Tamura Seisakusho Co Ltd Flux, and soldering method using the same
JP2013214704A (en) * 2012-03-06 2013-10-17 Mitsubishi Materials Corp Method for producing solder bump
JP2015098052A (en) * 2013-10-16 2015-05-28 三井金属鉱業株式会社 Solder alloy and solder powder

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2013009113A (en) * 2012-05-10 2013-11-01 Senju Metal Industry Co Solder alloy for acoustic device.
MY179941A (en) * 2012-10-09 2020-11-19 Alpha Metals Lead-free and antimony-free tin solder reliable at high temperatures
WO2015118611A1 (en) * 2014-02-04 2015-08-13 千住金属工業株式会社 Cu BALL, Cu CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM
JP6047214B1 (en) * 2015-11-02 2016-12-21 田中電子工業株式会社 Precious metal coated copper wire for ball bonding

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11114691A (en) * 1997-10-07 1999-04-27 Uchihashi Estec Co Ltd Solder alloy
JP2006016681A (en) * 2004-07-05 2006-01-19 Nosaku:Kk Metallic vessel, metallic product composed of metal used for the metallic product and method for producing the same
JP2006181637A (en) * 2004-12-03 2006-07-13 Tamura Seisakusho Co Ltd Flux, and soldering method using the same
JP2013214704A (en) * 2012-03-06 2013-10-17 Mitsubishi Materials Corp Method for producing solder bump
JP2015098052A (en) * 2013-10-16 2015-05-28 三井金属鉱業株式会社 Solder alloy and solder powder

Also Published As

Publication number Publication date
JP7104353B2 (en) 2022-07-21
TWI817013B (en) 2023-10-01
WO2020241574A1 (en) 2020-12-03
TW202106889A (en) 2021-02-16

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