JPWO2020241544A1 - - Google Patents
Info
- Publication number
- JPWO2020241544A1 JPWO2020241544A1 JP2020552047A JP2020552047A JPWO2020241544A1 JP WO2020241544 A1 JPWO2020241544 A1 JP WO2020241544A1 JP 2020552047 A JP2020552047 A JP 2020552047A JP 2020552047 A JP2020552047 A JP 2020552047A JP WO2020241544 A1 JPWO2020241544 A1 JP WO2020241544A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019098934 | 2019-05-27 | ||
| JP2019098934 | 2019-05-27 | ||
| PCT/JP2020/020464 WO2020241544A1 (en) | 2019-05-27 | 2020-05-25 | Solder paste and flux for solder paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020241544A1 true JPWO2020241544A1 (en) | 2020-12-03 |
| JP7057533B2 JP7057533B2 (en) | 2022-04-20 |
Family
ID=73553433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020552047A Active JP7057533B2 (en) | 2019-05-27 | 2020-05-25 | Solder paste and flux for solder paste |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7057533B2 (en) |
| TW (1) | TWI821565B (en) |
| WO (1) | WO2020241544A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002224881A (en) * | 2001-02-05 | 2002-08-13 | Hitachi Metals Ltd | Solder ball |
| JP2015098052A (en) * | 2013-10-16 | 2015-05-28 | 三井金属鉱業株式会社 | Solder alloy and solder powder |
| JP2016500578A (en) * | 2012-10-09 | 2016-01-14 | アルファ・メタルズ・インコーポレイテッドＡｌｐｈａ Ｍｅｔａｌｓ，Ｉｎｃ． | Lead-free and antimony-free high-temperature reliable tin solder |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013252548A (en) * | 2012-06-08 | 2013-12-19 | Nihon Almit Co Ltd | Solder paste for joining micro component |
| JP2014024082A (en) * | 2012-07-26 | 2014-02-06 | Sumitomo Metal Mining Co Ltd | Solder alloy |
| JP5534122B1 (en) * | 2014-02-04 | 2014-06-25 | 千住金属工業株式会社 | Core ball, solder paste, foam solder, flux coated core ball and solder joint |
| JP6521161B1 (en) * | 2018-07-20 | 2019-05-29 | 千住金属工業株式会社 | Solder alloy, solder powder, solder paste, and solder joint using them |
-
2020
- 2020-05-25 WO PCT/JP2020/020464 patent/WO2020241544A1/en active Application Filing
- 2020-05-25 TW TW109117352A patent/TWI821565B/en active
- 2020-05-25 JP JP2020552047A patent/JP7057533B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002224881A (en) * | 2001-02-05 | 2002-08-13 | Hitachi Metals Ltd | Solder ball |
| JP2016500578A (en) * | 2012-10-09 | 2016-01-14 | アルファ・メタルズ・インコーポレイテッドＡｌｐｈａ Ｍｅｔａｌｓ，Ｉｎｃ． | Lead-free and antimony-free high-temperature reliable tin solder |
| JP2015098052A (en) * | 2013-10-16 | 2015-05-28 | 三井金属鉱業株式会社 | Solder alloy and solder powder |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020241544A1 (en) | 2020-12-03 |
| TW202106888A (en) | 2021-02-16 |
| TWI821565B (en) | 2023-11-11 |
| JP7057533B2 (en) | 2022-04-20 |
Similar Documents
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