JPWO2020241505A1 - - Google Patents
Info
- Publication number
- JPWO2020241505A1 JPWO2020241505A1 JP2021522318A JP2021522318A JPWO2020241505A1 JP WO2020241505 A1 JPWO2020241505 A1 JP WO2020241505A1 JP 2021522318 A JP2021522318 A JP 2021522318A JP 2021522318 A JP2021522318 A JP 2021522318A JP WO2020241505 A1 JPWO2020241505 A1 JP WO2020241505A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019103343 | 2019-05-31 | ||
PCT/JP2020/020336 WO2020241505A1 (ja) | 2019-05-31 | 2020-05-22 | シート状封止材、封止用シート及び半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020241505A1 true JPWO2020241505A1 (zh) | 2020-12-03 |
Family
ID=73552157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021522318A Pending JPWO2020241505A1 (zh) | 2019-05-31 | 2020-05-22 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2020241505A1 (zh) |
TW (1) | TW202121615A (zh) |
WO (1) | WO2020241505A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115625958B (zh) * | 2022-11-10 | 2024-06-14 | 广东生益科技股份有限公司 | 一种空腔滤波器用复合膜及空腔滤波器 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4872587B2 (ja) * | 2006-10-12 | 2012-02-08 | 日立化成工業株式会社 | 封止フィルム、及びこれを用いた半導体装置 |
JP6393092B2 (ja) * | 2013-08-07 | 2018-09-19 | 日東電工株式会社 | 中空型電子デバイス封止用樹脂シート及び中空型電子デバイスパッケージの製造方法 |
JP6259608B2 (ja) * | 2013-08-09 | 2018-01-10 | 日東電工株式会社 | 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法 |
JP2019046930A (ja) * | 2017-08-31 | 2019-03-22 | 日東電工株式会社 | 封止用シート |
TWI757551B (zh) * | 2017-09-29 | 2022-03-11 | 日商長瀨化成股份有限公司 | 安裝結構體之製造方法及使用於其之片材 |
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2020
- 2020-05-22 WO PCT/JP2020/020336 patent/WO2020241505A1/ja active Application Filing
- 2020-05-22 JP JP2021522318A patent/JPWO2020241505A1/ja active Pending
- 2020-05-27 TW TW109117705A patent/TW202121615A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202121615A (zh) | 2021-06-01 |
WO2020241505A1 (ja) | 2020-12-03 |