JPWO2020230786A1 - - Google Patents
Info
- Publication number
- JPWO2020230786A1 JPWO2020230786A1 JP2021519441A JP2021519441A JPWO2020230786A1 JP WO2020230786 A1 JPWO2020230786 A1 JP WO2020230786A1 JP 2021519441 A JP2021519441 A JP 2021519441A JP 2021519441 A JP2021519441 A JP 2021519441A JP WO2020230786 A1 JPWO2020230786 A1 JP WO2020230786A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019090991 | 2019-05-13 | ||
PCT/JP2020/018978 WO2020230786A1 (fr) | 2019-05-13 | 2020-05-12 | Composition durcissable et son produit durci |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020230786A1 true JPWO2020230786A1 (fr) | 2020-11-19 |
Family
ID=73289462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021519441A Pending JPWO2020230786A1 (fr) | 2019-05-13 | 2020-05-12 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2020230786A1 (fr) |
WO (1) | WO2020230786A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021178888A (ja) * | 2020-05-11 | 2021-11-18 | 学校法人 関西大学 | ポリオルガノシルセスキオキサン、それを含む硬化性組成物、及びその硬化物 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007302771A (ja) * | 2006-05-10 | 2007-11-22 | Shin Etsu Chem Co Ltd | 封止用エポキシ樹脂組成物 |
JP6048193B2 (ja) * | 2013-02-13 | 2016-12-21 | 味の素株式会社 | 樹脂組成物 |
JP6375140B2 (ja) * | 2014-04-30 | 2018-08-15 | 日東電工株式会社 | 熱伝導性ポリマー組成物及び熱伝導性成形体 |
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2020
- 2020-05-12 JP JP2021519441A patent/JPWO2020230786A1/ja active Pending
- 2020-05-12 WO PCT/JP2020/018978 patent/WO2020230786A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2020230786A1 (fr) | 2020-11-19 |
Similar Documents
Legal Events
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A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20210715 |
|
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