JPWO2020229318A5 - - Google Patents

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Publication number
JPWO2020229318A5
JPWO2020229318A5 JP2021566957A JP2021566957A JPWO2020229318A5 JP WO2020229318 A5 JPWO2020229318 A5 JP WO2020229318A5 JP 2021566957 A JP2021566957 A JP 2021566957A JP 2021566957 A JP2021566957 A JP 2021566957A JP WO2020229318 A5 JPWO2020229318 A5 JP WO2020229318A5
Authority
JP
Japan
Prior art keywords
acid
mol
bis
polyamide
cooh
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021566957A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022532708A (ja
Publication date
Priority claimed from EP19198924.3A external-priority patent/EP3795611A1/fr
Application filed filed Critical
Priority claimed from PCT/EP2020/062781 external-priority patent/WO2020229318A1/fr
Publication of JP2022532708A publication Critical patent/JP2022532708A/ja
Publication of JPWO2020229318A5 publication Critical patent/JPWO2020229318A5/ja
Pending legal-status Critical Current

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JP2021566957A 2019-05-14 2020-05-07 ポリアミド並びに対応するポリマー組成物及び物品 Pending JP2022532708A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962847409P 2019-05-14 2019-05-14
US62/847,409 2019-05-14
EP19198924.3A EP3795611A1 (fr) 2019-09-23 2019-09-23 Polyamides et compositions et articles de polymères correspondants
EP19198924.3 2019-09-23
PCT/EP2020/062781 WO2020229318A1 (fr) 2019-05-14 2020-05-07 Polyamides et compositions et articles polymères correspondants

Publications (2)

Publication Number Publication Date
JP2022532708A JP2022532708A (ja) 2022-07-19
JPWO2020229318A5 true JPWO2020229318A5 (fr) 2023-04-17

Family

ID=70554101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021566957A Pending JP2022532708A (ja) 2019-05-14 2020-05-07 ポリアミド並びに対応するポリマー組成物及び物品

Country Status (6)

Country Link
US (1) US20220220255A1 (fr)
EP (1) EP3969500A1 (fr)
JP (1) JP2022532708A (fr)
KR (1) KR20220007728A (fr)
CN (1) CN113825784B (fr)
WO (1) WO2020229318A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285553A (ja) * 2009-06-12 2010-12-24 Mitsubishi Gas Chemical Co Inc 耐熱性ポリアミド樹脂
EP2727951A1 (fr) * 2012-11-06 2014-05-07 Solvay Specialty Polymers USA, LLC. Dispositifs électroniques mobiles constitués de polyamide amorphes
EP3358411B1 (fr) * 2015-09-28 2020-05-06 Toyobo Co., Ltd. Composition de résine photosensible pour plaque originale d'impression en relief et plaque originale d'impression en relief obtenue à partir de celle-ci
FR3064271B1 (fr) * 2017-03-24 2021-04-30 Arkema France Composition de polyamide semi-cristallin de haute temperature de transition vitreuse et haute temperature de fusion pour materiau thermoplastique, son procede de fabrication et ses utilisations

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