JPWO2020196770A1 - - Google Patents
Info
- Publication number
- JPWO2020196770A1 JPWO2020196770A1 JP2021509600A JP2021509600A JPWO2020196770A1 JP WO2020196770 A1 JPWO2020196770 A1 JP WO2020196770A1 JP 2021509600 A JP2021509600 A JP 2021509600A JP 2021509600 A JP2021509600 A JP 2021509600A JP WO2020196770 A1 JPWO2020196770 A1 JP WO2020196770A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/44—Squeegees or doctors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Screen Printers (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019061603 | 2019-03-27 | ||
JP2019061603 | 2019-03-27 | ||
PCT/JP2020/013738 WO2020196770A1 (en) | 2019-03-27 | 2020-03-26 | Printing method, and method for manufacturing hole-filled board and circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020196770A1 true JPWO2020196770A1 (en) | 2020-10-01 |
JP7435595B2 JP7435595B2 (en) | 2024-02-21 |
Family
ID=72611505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021509600A Active JP7435595B2 (en) | 2019-03-27 | 2020-03-26 | Printing method and method for manufacturing hole filling board and circuit board |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7435595B2 (en) |
TW (1) | TW202106128A (en) |
WO (1) | WO2020196770A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023123169A (en) * | 2022-02-24 | 2023-09-05 | 味の素株式会社 | resin composition |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002158441A (en) * | 2000-09-06 | 2002-05-31 | Ngk Spark Plug Co Ltd | Method of manufacturing wiring board |
JP2002164649A (en) * | 2000-11-28 | 2002-06-07 | Ngk Spark Plug Co Ltd | Method for manufacturing printed wiring board |
TW552832B (en) * | 2001-06-07 | 2003-09-11 | Lg Electronics Inc | Hole plugging method for printed circuit boards, and hole plugging device |
WO2007044959A1 (en) * | 2005-10-13 | 2007-04-19 | Inframat Corporation | Patterned magnetic inductors |
KR101148392B1 (en) * | 2010-07-13 | 2012-05-21 | 삼성전기주식회사 | Method for manufacturing semiconductor package substrate |
JP2017171974A (en) * | 2016-03-23 | 2017-09-28 | 株式会社豊田中央研究所 | Polymer coated iron nickel alloy fine particle, manufacturing method therefor, composition for printing and magnetic body film using the same |
JP2017183327A (en) * | 2016-03-28 | 2017-10-05 | 三菱電機株式会社 | Method of manufacturing solar battery and printing device |
-
2020
- 2020-03-26 WO PCT/JP2020/013738 patent/WO2020196770A1/en active Application Filing
- 2020-03-26 TW TW109110160A patent/TW202106128A/en unknown
- 2020-03-26 JP JP2021509600A patent/JP7435595B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW202106128A (en) | 2021-02-01 |
WO2020196770A1 (en) | 2020-10-01 |
JP7435595B2 (en) | 2024-02-21 |
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