WO2020196770A1

WO2020196770A1 - Printing method, and method for manufacturing hole-filled board and circuit board

Info

Publication number: WO2020196770A1
Application number: PCT/JP2020/013738
Authority: WO
Inventors: 田中　孝幸; 達也本間
Original assignee: 味の素株式会社
Priority date: 2019-03-27
Filing date: 2020-03-26
Publication date: 2020-10-01
Also published as: TW202106128A; JP7435595B2; JPWO2020196770A1

Abstract

This printing method includes: a placement step for placing a mask in which a hollow opening section is formed on a support substrate having a plurality of through holes formed therein, such that the single opening section is in communication with two or more of the through holes; a supply step for supplying a resin composition to a surface of the mask on the reverse side from the support substrate; a first printing step for filling the resin composition in the through holes by moving a first squeegee on the surface of the mask and relatively along said surface such that the first squeegee is partially pressed into the opening section; and a second printing step for applying a resin composition upon the resin composition that has been filled in the through holes by moving a second squeegee on the surface of the mask and relatively along said surface.

Description

Printing method and manufacturing method of fill-in-the-blank board and circuit board

The present invention relates to a printing method for printing a resin composition on a support substrate having through holes formed therein, and a method for manufacturing a hole-filling substrate and a circuit board using the above printing method.

As a member used for applications such as a core substrate for a circuit board, there is a member provided with a support substrate having through holes penetrating the front and back surfaces and a filling layer for filling the through holes. In the present application, this member may be referred to as a "fill-in-the-blank substrate". The packed bed is usually formed by filling through holes with a curable resin composition and curing the filled resin composition. As a method of filling the through hole with the resin composition, for example, there is a screen printing method (Patent Document 1).

In the screen printing method, a screen mask having a mask portion that does not allow the resin composition to pass through and a mesh portion that allows the resin composition to pass through is generally used. The mesh portion is a hole provided with a mesh, and since the resin composition can pass through between the wire rods of the mesh, it can function as a passage through which the resin composition can flow. This mesh portion is formed so that, for example, one mesh portion communicates with one through hole of the support substrate. Therefore, by installing the screen mask on the support substrate and printing the resin composition through the screen mask, the through holes can be filled with the resin composition through the mesh portion.

Japanese Unexamined Patent Publication No. 2006-241449

Conventionally, inductors have generally been mounted on circuit boards as independent inductor components. However, in recent years, a method of providing an inductor inside a circuit board by forming a coil with a conductor pattern of the circuit board has been proposed. When manufacturing a circuit board having an inductor inside as described above, it is conceivable to adopt a packing layer containing magnetic powder as a packing layer for filling through holes. By making the packing layer containing the magnetic powder function as the core of the inductor, an inductor with high inductance can be realized.

Therefore, the present inventor tried to fill the through holes of the support substrate with the resin composition containing the magnetic powder by the screen printing method. At this time, if a screen mask capable of communicating only one mesh portion of the screen mask with one through hole as in the conventional case is used, the alignment between the through hole and the mesh portion is complicated. Therefore, the present inventor has formed a large mesh portion so that one mesh portion can communicate with two or more through holes from the viewpoint of facilitating alignment and facilitating filling. Then, a screen mask was placed on the support substrate so that one mesh portion covered the plurality of through holes, and each through hole was filled with the resin composition through the mesh portion.

However, in the above method, the filling property of the resin composition was inferior. Specifically, in some or all of the plurality of through holes, the resin composition could not enter deep into the through holes, and a portion where the resin composition was not filled was likely to remain near the outlet in the through holes. .. In particular, while many resin compositions are filled in the through holes near the outer edge of the mesh portion, the amount of resin composition filled in the through holes tends to be small near the center of the mesh portion far from the outer edge. there were.

Further, in the above method, a dent is likely to be formed on the surface of the layer of the resin composition at the entrance of the through hole. The recess of the resin composition layer means a structure in which a part or all of the surface of the resin composition layer is located inside the through hole with respect to the surface of the support substrate. This recess was usually formed due to poor plate release when the screen mask was removed after printing. The "plate release property" means a property that when the screen mask is removed after printing, the printed resin composition is easily separated from the screen mask and is not removed from the support substrate. When the plate release property is inferior, the resin composition near the entrance of the through hole adheres to the mesh of the mesh portion and is removed, and as a result, a dent is formed on the surface of the layer of the resin composition filled in the through hole. Been formed. In particular, in a high-viscosity resin composition having a large content of magnetic powder, the resin composition tends to adhere to the mesh and be easily removed.

According to the study of the present inventor, it is considered that the above-mentioned problems can occur even in the case of manufacturing a circuit board other than the one containing the inductor.

The present invention has been devised in view of the above problems, and can easily and easily fill a plurality of through holes of a support substrate with a resin composition with good filling properties, and further, a resin composition filled in the through holes. It is an object of the present invention to provide a printing method capable of suppressing dents in layers; a method for manufacturing a through-hole substrate including the printing method; and a method for manufacturing a circuit board including the printing method.

The present inventor has diligently studied to solve the above-mentioned problems. As a result, the present inventor, when using a mask opened across two or more through holes and printing the resin composition twice or more under predetermined conditions, said the above. The present invention has been completed by finding that the following problems can be solved.
That is, the present invention includes the following.

[1] An installation step of installing a mask having hollow openings formed on a support substrate having a plurality of through holes so that one opening communicates with two or more through holes. When,
A supply step of supplying a resin composition containing an inorganic filler and a thermosetting resin to a surface of the mask opposite to the support substrate.
The first squeegee is moved relatively along the surface of the mask so that a part of the first squeegee is pushed into the opening, and the resin is inserted into the through hole. The first printing step of filling the composition and
A second squeegee that is the same as or different from the first squeegee is moved relative to the surface of the mask along the surface, and the resin composition is placed on the resin composition filled in the through holes. A printing method comprising a second printing step of applying an object.
[2] According to [1], in the first printing step, the first squeegee is relatively moved on the surface of the mask so that the part of the first squeegee is in contact with the support substrate. Printing method.
[3] The printing method according to [1] or [2], wherein the elastic modulus of the second squeegee is larger than the elastic modulus of the first squeegee.
[4] The relative moving speed of the second squeegee in the second printing step is faster than the relative moving speed of the first squeegee in the first printing step, [1] to [3]. The printing method according to any one of the items.
[5] The printing method according to any one of [1] to [4], wherein the resin composition applied in the second printing step remains at a position on the mask side of the through hole.
[6] The printing method according to any one of [1] to [5], wherein the mask is a metal mask.
[7] The printing method according to any one of [1] to [6], wherein the inorganic filler contains magnetic powder.
[8] The printing method according to [7], wherein the magnetic powder contains at least one type selected from the group consisting of iron oxide powder and iron alloy-based metal powder.
[9] The printing method according to any one of [1] to [8], wherein the resin composition in the first printing step and the second printing step has a viscosity of 50 Pa · s or more.
[10] A method for manufacturing a hole-filling substrate including a support substrate having a plurality of through holes formed therein and a filling layer formed of a cured product of a resin composition in the through holes.
A step of printing the resin composition on the support substrate by the printing method according to any one of [1] to [9].
A method for manufacturing a fill-in-the-blank substrate, which comprises a step of curing a resin composition.
[11] The method for manufacturing a hole-filling substrate according to [10], which comprises a step of polishing the packed bed.
[12] A step of manufacturing a hole-filling substrate by the manufacturing method according to [10] or [11], and
A method for manufacturing a circuit board, which comprises a step of forming a conductor layer on the hole-filling board.

According to the present invention, a printing method capable of filling a plurality of through holes of a support substrate with a resin composition easily and with good filling properties, and further suppressing dents in a layer of the resin composition filled in the through holes; A method for manufacturing a through-hole substrate including the printing method; and a method for manufacturing a circuit board including the printing method; can be provided.

FIG. 1 is a perspective view schematically showing a support substrate and a mask used in the printing method according to the embodiment of the present invention. FIG. 2 is a perspective view schematically showing a support substrate on which a mask is installed in the installation process of the printing method according to the embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing a cross section of a support substrate and a mask in the supply process of the printing method according to the embodiment of the present invention. FIG. 4 is a cross-sectional view schematically showing a cross section of a support substrate and a mask in the first printing step of the printing method according to the embodiment of the present invention. FIG. 5 shows the support substrate, the mask, and the first squeegee at the time when the first squeegee crosses the opening of the mask in the first printing step of the printing method according to the embodiment of the present invention. It is sectional drawing which shows typically the cross section cut by the plane perpendicular to the moving direction X of. FIG. 6 is a cross-sectional view schematically showing a cross section of a support substrate and a mask immediately after the first printing step of the printing method according to the embodiment of the present invention. FIG. 7 is a cross-sectional view schematically showing a cross section of a support substrate and a mask in the second printing step of the printing method according to the embodiment of the present invention. FIG. 8 is a cross-sectional view schematically showing a cross section of a support substrate and a mask immediately after the second printing step of the printing method according to the embodiment of the present invention. FIG. 9 is a cross-sectional view schematically showing a hole-filling substrate obtained immediately after the resin composition is cured in the method for producing a hole-filling substrate according to an embodiment of the present invention. FIG. 10 is a cross-sectional view schematically showing a hole-filling substrate after removing an excess cured product layer by polishing in the method for manufacturing a hole-filling substrate according to an embodiment of the present invention. FIG. 11 is a diagram schematically showing how the resin composition is filled in the through holes of the support substrate by the screen printing method as an example.

Hereinafter, the present invention will be described in detail by showing embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and can be arbitrarily modified and implemented without departing from the scope of claims of the present invention and the equivalent scope thereof.

[1. Overview of printing method]
The method for printing the resin composition according to the embodiment of the present invention is
An installation process in which a mask having a hollow opening is installed on a support substrate having a plurality of through holes formed;
With the supply process of supplying the resin composition to the surface of the mask opposite to the support substrate;
With the first printing step in which the first squeegee is moved relative to the surface of the mask along the surface to fill the through holes with the resin composition;
A second printing step of applying the resin composition by moving a second squeegee, which is the same as or different from the first squeegee, relative to the surface of the mask along the surface;

In the installation process, the mask is installed on the support substrate so that one opening communicates with two or more through holes. If such an installation is allowed, the accuracy of alignment between the mask opening and the through hole of the support substrate may be low. Therefore, the alignment can be easily performed.

Further, in the first printing process, the first squeegee is moved relative to the support substrate and the mask so that a part of the first squeegee is pushed into the opening of the mask. As a result, it becomes easy to fill the resin composition up to the outlet of the through hole, and good filling property can be achieved.

Further, in the second printing process, the resin composition is applied onto the resin composition filled in the through holes by the second squeegee. Since the through holes are filled with the resin composition by the first printing step, a layer of the resin composition is formed in the through holes. However, at the entrance of the through hole, a depression may be formed on the surface of the layer of the resin composition. On the other hand, when the resin composition is applied onto the resin composition filled in the through holes in the second printing step, the dents can be filled with the resin composition. Therefore, the dent can be suppressed.

Therefore, according to the method for printing the resin composition according to the embodiment of the present invention, the resin composition can be easily and easily filled in the plurality of through holes of the support substrate with good filling properties, and further, the through holes are filled. It is possible to suppress the depression of the layer of the resin composition.

Here, the above-mentioned "entrance of the through hole" means an opening formed on the front surface of the support substrate among the openings of the through hole. Further, the “front surface of the support substrate” refers to the surface of the support substrate on the mask side. On the other hand, the above-mentioned "outlet of the through hole" means an opening formed on the back surface of the support substrate among the openings of the through hole. Further, the “back surface of the support substrate” refers to the surface of the support substrate opposite to the mask.

Hereinafter, the printing method according to this embodiment will be described with reference to the drawings. However, each drawing merely outlines the shape, size, and arrangement of the components to the extent that the invention can be understood.

[2. Preparation of support board]
FIG. 1 is a perspective view schematically showing a support substrate 100 and a mask 200 used in the printing method according to the embodiment of the present invention. The printing method according to the present embodiment usually includes a step of preparing the support substrate 100 as shown in FIG.

The support substrate 100 is a substrate on which a plurality of through holes 110 are formed. In one aspect, the support substrate 100 can be flat. Further, in one embodiment, the support substrate 100 may be provided with a conductor layer (not shown) on one side or both sides of the support substrate 100. Further, in one aspect, the support substrate 100 may be provided with an insulating layer (not shown) as a core layer, or may be provided with a conductor layer on the insulating layer. Examples of the insulating layer include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, and the like. The conductor layer may or may not have a circuit formed. The support substrate 100 may be a so-called single-sided substrate, a two-layer substrate (double-sided substrate), or a multilayer substrate such as a four-layer substrate including a conductor layer in which a circuit is formed. May be good. An insulating layer may be provided on the surface of the support substrate 100, but in a printing method in which a through hole 110 is filled with a resin composition, a conductor layer is generally provided. The conductor layer on the surface of the support substrate 100 may be circuit-formed, but in the printing method of filling the through holes 110 with the resin composition, the conductor layer on the outermost surface of the support substrate 100 is not circuit-formed. Is common. The surface of the support substrate 100 having the conductor layer on which the circuit is not formed on the outermost surface can be a flat flat surface. Therefore, the surface of the support substrate 100 can be a flat surface of the conductor layer in which no circuit is formed. In the present embodiment, an example will be described in which a support substrate 100 having an insulating layer and a conductor layer as an outermost layer provided on the insulating layer, and having a flat front surface 100U and a back surface 100D is used.

The thickness T ₁₀₀ of the support substrate 100 is not particularly limited.

The through hole 110 is a hole that penetrates the support substrate 100. Therefore, each through hole 110 has an inlet 110 _IN opened on the front surface 100U of the support substrate 100 and an outlet (outlet 110 _OUT described later; see FIG. 3) opened on the back surface 100D of the support substrate 100. The through hole 110 is generally formed so as to penetrate the support substrate 100 in the thickness direction thereof. Therefore, the depth of the through hole 110 usually corresponds to the thickness of the support substrate 100.

The shape of the through hole 110 is arbitrary, but is generally cylindrical. The diameter W ₁₁₀ of the through hole 110 is not particularly limited. However, in general, it is difficult for the resin composition to enter the through hole 110 having a small diameter W ₁₁₀ , and it is possible that the resin composition cannot be filled deep into the through hole 110 by the conventional screen printing method. Therefore, the larger the aspect ratio of the through holes 110, the poorer the filling property of the resin composition in the conventional screen printing method. The aspect ratio of the through hole 110 represents the ratio between the depth of the through hole 110 and the diameter W ₁₁₀ . Further, since the depth of the through hole 110 usually corresponds to the thickness T ₁₀₀ of the support substrate 100, the aspect ratio is represented by the ratio T ₁₀₀ / W ₁₁₀ . On the other hand, according to the printing method according to the present embodiment, the resin composition can be easily filled deep into the through hole 110. Therefore, from the viewpoint of utilizing the excellent filling property of the printing method according to the present embodiment, the aspect ratio T ₁₀₀ / W ₁₁₀ of the through hole 110 is preferably large. Specifically, the aspect ratio T ₁₀₀ / W ₁₁₀ of the through hole 110 is preferably 1.0 or more, more preferably 1.5 or more, and particularly preferably 2.0 or more. Although there is no limit to the upper limit of the aspect ratio _T 100 _{/ W 110,} the viewpoint to easily perform formation of the through hole 110, and, in terms of facilitating the filling of the resin composition into the through-hole 110, the aspect ratio _{T 100} / W ₁₁₀ can be 50 or less, 20 or less, 10 or less, and the like. The shape, dimensions, and aspect ratio of the through holes 110 may be the same or different.

The printing method according to this embodiment is usually performed by an appropriate printing device (not shown) that can prepare an environment suitable for printing. Therefore, the prepared support substrate 100 can be attached to the printing apparatus. At this time, the support substrate 100 is usually attached so that the front surface 100U faces upward in the gravity direction and the back surface 100D faces downward in the gravity direction. In the present embodiment, the support substrate 100 is attached so that the front surface 100U and the back surface 100D are parallel to each other in the horizontal direction, the front surface 100U faces upward in the gravity direction, and the back surface 100D faces downward in the gravity direction. An example will be described.

[3. Installation process]
In the printing method according to the present embodiment, after the support substrate 100 is prepared, an installation step of installing the mask 200 on the support substrate 100 is performed. Specifically, the mask 200 is installed on the front surface 100U of the support substrate 100. Normally, the mask 200 is in contact with the front surface 100U of the support substrate 100 so that a gap through which the resin composition can enter is not formed between the support substrate 100 and the mask 200 in the first printing step and the second printing step. It is installed as.

The mask 200 is a member made of a material that does not allow the resin composition to pass through, and is usually formed in a plate shape. In order to improve the handleability of the mask 200, the mask 200 is preferably made of a material having excellent rigidity. Among them, a metal mask made of a metal material is preferable because it has excellent durability and can be applied to a wide variety of resin compositions.

The thickness T _{200 of the} mask 200 is not particularly limited. However, from the viewpoint of easily avoiding contact between the second squeegee 500 (see FIG. 7) and the support substrate 100 in the second printing step described later, the thickness T _{200 of the} mask 200 is preferably larger than a predetermined value. Specifically, the thickness T _{200 of the} mask 200 is preferably 5 μm or more, more preferably 10 μm or more, and particularly preferably 20 μm or more. Further, from the viewpoint of easily achieving contact between the first squeegee 400 (see FIG. 4) and the support substrate 100 in the first printing step described later, the thickness T _{200 of the} mask 200 is preferably as small as a predetermined value or less. Specifically, the thickness T _{200 of the} mask 200 is preferably 500 μm or less, more preferably 400 μm or less, and particularly preferably 300 μm or less.

The mask 200 is formed with an opening 210 as a hollow hole that penetrates the mask 200 in the thickness direction. Since it is hollow, the opening 210 does not have a mesh like the mesh portion of the screen mask. Therefore, since the opening 210 can be passed by any member, the resin composition can be passed through.

FIG. 2 is a perspective view schematically showing the support substrate 100 on which the mask 200 is installed in the installation process of the printing method according to the present embodiment. As shown in FIG. 2, the mask 200 is installed so that one opening 210 communicates with two or more through holes 110. Therefore, when viewed from the thickness direction of the support substrate 100, normally, the opening 210 includes a part of the front surface 100U of the support substrate 100 and two or more through holes 110 formed in this area. appear. When the mask 200 is installed in this way, the opening 210 of the mask 200 can be formed to be sufficiently large, so that the opening 210 and the through hole 110 can be communicated with each other without precise alignment. Therefore, since the alignment can be easily performed, it is possible to realize simple printing.

The planar shape of the opening 210 formed in the mask 200 (that is, the shape seen from the thickness direction of the mask 200) is arbitrary. Further, the number of openings 210 formed in the mask 200 may be one or two or more. In the mask 200 in which the two or more openings 210 are formed, at least one of the openings 210 may communicate with the two or more through holes 110, but all of the openings 210 are individually 2. It is preferable to communicate with one or more through holes 110. In the present embodiment, the mask 200 has one opening 210 having a rectangular planar shape, and the opening 210 is large enough to communicate with all the through holes 110 formed in the support substrate 100. .. Therefore, in the example shown in this embodiment, one opening 210 of the mask 200 installed on the support substrate 100 communicates with all the through holes 110.

Normally, the thickness direction of the support substrate 100 and the thickness direction of the mask 200 installed on the support substrate 100 coincide with each other. Therefore, in the following description, the thickness direction of the support substrate 100 and the thickness direction of the mask 200 installed on the support substrate 100 may be indicated by a common reference numeral "Z".

[4. Supply process]
FIG. 3 is a cross-sectional view schematically showing a cross section of the support substrate 100 and the mask 200 in the supply process of the printing method according to the present embodiment. As shown in FIG. 3, in the printing method according to the present embodiment, after the installation step, a supply step of supplying the resin composition is performed on the mask 200 installed on the support substrate 100. Specifically, the resin composition is supplied to the surface 200U of the mask 200 opposite to the support substrate 100. As a result, a liquid pool 300 of the resin composition is formed on the surface 200U of the mask 200.

The resin composition is a composition containing an inorganic filler and a thermosetting resin. This resin composition is a composition that can be in the form of a paste in the first printing step and the second printing step, and can usually be cured by undergoing heat treatment.

The method of supplying the resin composition is arbitrary. For example, the resin composition may be supplied by discharging the resin composition onto the mask 200 from a syringe (not shown) containing the resin composition.

[5. First printing process]
FIG. 4 is a cross-sectional view schematically showing a cross section of the support substrate 100 and the mask 200 in the first printing step of the printing method according to the present embodiment. As shown in FIG. 4, in the printing method according to the present embodiment, after the supply step, the first squeegee 400 is relatively moved on the surface 200U of the mask 200 along the surface 200U and through. The first printing step of filling the holes 110 with the resin composition is performed.

The first squeegee 400 normally extends in a direction intersecting the moving direction X of the first squeegee 400. Therefore, the first squeegee 400 is usually provided with a shape continuous in a certain direction, and the direction in which the first squeegee 400 is continuous intersects the moving direction X of the first squeegee 400. ing. In the present embodiment, an example in which a rectangular plate-shaped squeegee extending in a direction Y (see FIG. 2) perpendicular to both the moving direction X and the thickness direction Z of the first squeegee 400 is used as the first squeegee 400 will be described. To do. The length of the first squeegee 400 is usually formed to be larger than the dimension of the opening 210 in the direction in which the first squeegee 400 extends so as to reach the entire opening 210 of the mask 200.

In the first printing step, the first squeegee 400 is arranged near the end of the mask 200 so that the liquid pool 300 of the resin composition is located between the first squeegee 400 and the opening 210. At this time, from the viewpoint of effectively filling the through hole 110 with the resin composition, the first squeegee 400 is inclined so as to form a predetermined attack angle θ ₄₀₀ with the surface 200U of the mask 200. It can be arranged to contact 200U. Here, the attack angle θ ₄₀₀ represents an angle formed by the first squeegee 400 in front of the moving direction X with the surface 200U of the mask 200. The tip of the first squeegee 400 may bend due to friction between the support substrate 100 or the mask 200. In this case, the attack angle θ ₄₀₀ is other than the bent tip of the first squeegee 400. Represents the angle formed between the portion and the surface 200U of the mask 200. Further, the first squeegee 400 can be arranged in a state of being pressed against the mask 200 with a predetermined printing pressure. Here, the printing pressure of the first squeegee 400 represents the pressure at which the first squeegee 400 is pressed against the mask 200.

The first squeegee 400 is moved relatively on the surface 200U of the mask 200 in the moving direction X along the surface 200U while maintaining the attack angle θ ₄₀₀ and the printing pressure. In order to realize the relative movement, the first squeegee 400 may be moved, the support substrate 100 and the mask 200 may be moved, or all of them may be moved. In this embodiment, an example of moving the first squeegee 400 will be described.

The movement of the first squeegee 400 is performed so that the first squeegee 400 crosses the opening 210 of the mask 200. Since it is pushed by the moving first squeegee 400, the liquid pool 300 of the resin composition also moves in the moving direction X. Then, when the first squeegee 400 crosses the opening 210, the through hole 110 of the support substrate 100 is filled with the resin composition through the opening 210, and the layer 310 of the resin composition is formed in the through hole 110.

FIG. 5 shows the support substrate 100, the mask 200, and the first squeegee 400 at the time when the first squeegee 400 crosses the opening 210 of the mask 200 in the first printing step of the printing method according to the present embodiment. It is sectional drawing which shows typically the cross section cut by the plane perpendicular to the moving direction X of the 1st squeegee 400. As shown in FIG. 5, the movement of the first squeegee 400 in the first printing step is performed so that a part of the first squeegee 400 is pushed into the opening 210 of the mask 200. When a part of the first squeegee 400 is pushed into the opening 210 of the mask 200, the part of the first squeegee 400 pushed into the opening 210 is in a state of being sunk into the opening 210. Therefore, the through hole 110 can be filled with the resin composition with sufficient pressure, so that good filling property can be achieved.

Further, in the movement of the first squeegee 400 in the first printing step, the support substrate 100 in which the part of the first squeegee 400 pushed into the opening 210 of the mask 200 appears in the opening 210 of the mask 200. It is preferable to carry out in contact with. The first squeegee 400 preferably contacts at least a part of the support substrate 100 that appears in the opening 210 of the mask 200, and more preferably contacts the support substrate 100 around the inlet 110 _IN of one or more through holes 110. preferable. Above all, since the pressure for pushing the resin composition into the through hole 110 tends to be low near the center of the opening 210, the first squeegee 400 may come into contact with the support substrate 100 near the center of the opening 210. Especially preferable. In this embodiment, an example is shown in which the first squeegee 400 is moved so that the first squeegee 400 is in contact with the area around all the through holes 110 in the front surface 100U of the support substrate 100.

When the first squeegee 400 moves so as to be in contact with the support substrate 100, the first squeegee 400 can push the resin composition into the through hole 110 while closing the entrance 110 _IN of the through hole 110. Therefore, since the pressure escaping to the outside of the through hole 110 along the front surface 100U of the support substrate 100 can be reduced, the pressure applied to the resin composition from the first squeegee 400 is effectively directed toward the back of the through hole 110. I can tell. Therefore, it becomes easy to fill the resin composition up to the outlet 110 _OUT of the through hole 110, and particularly good filling property can be achieved.

The excellent filling property of the printing method of the present embodiment will be described in more detail in comparison with the screen printing method. FIG. 11 is a diagram schematically showing how the through holes 110 of the support substrate 100 are filled with the resin composition by a screen printing method as an example. In FIG. 11, the first printing step shown in FIG. 5 is shown in FIG. 5, except that the screen mask 900 having the mesh portion 910 provided with the mesh 920 is installed on the support substrate 100 instead of the mask 200 having the opening 210. The cross sections of the support substrate 100, the screen mask 900, and the first squeegee 400 when the same operation as in the above are performed are schematically shown.

As shown in FIG. 11, in the screen printing method using the screen mask 900, the first squeegee 400 cannot come into contact with the support substrate 100 because the mesh 920 of the mesh portion 910 interferes with it. On the other hand, the resin composition can pass between the wires of the mesh 920. Therefore, a flow path through which the resin composition can flow can be formed between the support substrate 100 and the first squeegee 400 by the thickness of the mesh 920. Then, the resin composition was pressed by the first squeegee 400, as shown by arrow A _11, can flow toward the outer edge of the mesh portion 910 along the front surface 100U of the supporting substrate 100. Therefore, since the pressure applied from the first squeegee 400 escapes to the outer edge portion by the action of the flow of the resin composition, the resin composition is pushed into the through hole 110 in the vicinity of the center far from the outer edge portion of the mesh portion 910. Pressure is likely to be insufficient. As a result, the resin composition may not be filled up to the outlet 110 _OUT of the through hole 110. Further, even in the through hole 110 in which the resin composition is sufficiently filled, the amount of the supplied resin composition is non-uniform, so that the layer 320 formed by the resin composition flowing out from the outlet 110 _OUT of the through hole 110 The thickness of the was uneven.

On the other hand, as shown in FIG. 5, when a part of the first squeegee 400 pushed into the opening 210 of the mask 200 comes into contact with the support substrate 100, it is between the support substrate 100 and the first squeegee 400. The flow path that can be formed can be made small, and preferably the flow path can not be formed. Therefore, the pressure applied to the resin composition from the first squeegee 400 can be effectively transmitted toward the back of the through hole 110, so that good filling property can be achieved. Further, usually, the pressure at which the first squeegee 400 pushes the resin composition into the through holes 110 can be made uniform in each through hole 110, so that the layer formed by the resin composition flowing out from the outlet 110 _OUT of the through hole 110. The thickness of 320 can be made uniform.

It can be realized by various methods that a part of the first squeegee 400 that moves relatively is pushed into the opening 210 of the mask 200.

As a method of causing a part of the first squeegee 400 to be pushed into the opening 210 of the mask 200, for example, a method of using a squeegee having a large flexibility as the first squeegee 400 can be mentioned. Since the highly flexible squeegee can be deformed when subjected to an appropriate printing pressure, it can be pushed into the opening 210 of the mask 200, and preferably can be in contact with the support substrate 100. In this case, a material having high flexibility is usually used as the material of the first squeegee 400. As the material having high flexibility, an elastic material having a low elastic modulus is preferable because the contact of the first squeegee 400 with the support substrate 100 can be realized particularly easily. Examples of such an elastic material include rubber, and therefore rubber squeegee is preferable as the first squeegee 400.

The rubber hardness of the elastic material can be arbitrarily set within a range in which a part of the first squeegee 400 can be pushed into the opening 210 of the mask 200. As an example of a specific range, the rubber hardness is preferably 50 degrees or more, and preferably 100 degrees or less.
The rubber hardness can be measured by a durometer (type A) under the same temperature conditions as in the first printing process.

As another method of allowing a part of the first squeegee 400 to be pushed into the opening 210 of the mask 200, for example, a method of increasing the printing pressure of the first squeegee 400 can be mentioned. When the printing pressure of the first squeegee 400 is large, the first squeegee 400 can be easily deformed along the shape of the mask 200 and can be pushed into the opening 210 of the mask 200, preferably on the support substrate 100. Can be touched.

As yet another method of causing a part of the first squeegee 400 to be pushed into the opening 210 of the mask 200, for example, a method of reducing the attack angle θ ₄₀₀ of the first squeegee 400 can be mentioned. When the attack angle θ ₄₀₀ of the first squeegee 400 is small, the first squeegee 400 is easily deformed by receiving a large stress in the thickness direction of the first squeegee 400 and may be pushed into the opening 210 of the mask 200. It can be, preferably in contact with the support substrate 100.

The attack angle θ ₄₀₀ of the first squeegee 400 can be arbitrarily set within a range in which a part of the first squeegee 400 can be pushed into the opening 210 of the mask 200. As an example of a specific range, the attack angle θ ₄₀₀ is preferably 5 ° or more, more preferably 7 ° or more, particularly preferably 10 ° or more, preferably 90 ° or less, more preferably 80 ° or less. , Especially preferably 70 ° or less.

Yet another method of allowing a portion of the first squeegee 400 to be pushed into the opening 210 of the mask 200 is, for example, slowing the relative moving speed of the first squeegee 400 with respect to the support substrate 100 and the mask 200. There is a way to do it. The relative moving speed may be hereinafter appropriately referred to as “printing speed”. When the printing speed of the first squeegee 400 is slow, the resistance of the resin composition can be reduced, so that the first squeegee 400 can be pushed into the opening 210 of the mask 200 without being hindered by the resin composition, which is preferable. Can be in contact with the support substrate 100.

The printing speed of the first squeegee 400 can be arbitrarily set within a range in which a part of the first squeegee 400 can be pushed into the opening 210 of the mask 200. As an example of a specific range, the printing speed of the first squeegee 400 is preferably 1 mm / sec or more, more preferably 2 mm / sec or more, particularly preferably 3 mm / sec or more, and preferably 100 mm / sec or less. , More preferably 80 mm / sec or less, and particularly preferably 60 mm / sec or less.

The above-mentioned method exemplified as a method for causing a part of the first squeegee 400 to be pushed into the opening 210 of the mask 200 may be carried out in any combination.

The first printing step may be performed only once, or may be performed twice or more under the same or different conditions.

FIG. 6 is a cross-sectional view schematically showing a cross section of the support substrate 100 and the mask 200 immediately after the first printing step of the printing method according to the present embodiment. As shown in FIG. 6, when the through hole 110 is filled with the resin composition in the first printing step, the layer 310 of the resin composition is formed in the through hole 110. Normally, a part of the filled resin composition flows out through the outlet 110 _OUT of the through hole 110, so that the outflowing resin composition also forms the layer 320 of the resin composition on the back surface 100D of the support substrate 100. Will be done. The layer 320 of the resin composition is formed of the resin composition at a position lower in the drawing than the back surface 100D of the support substrate 100 (that is, a position far from the mask 200) in the thickness direction Z.

In the first printing step of the present embodiment, the pressure at which the first squeegee 400 pushes the resin composition into the through holes 110 can be made uniform in each through hole 110. Therefore, the amount of the resin composition flowing out through the outlet 110 _OUT of the through holes 110 can be made uniform in each through hole 110. Therefore, normally, the thickness of the layer 320 of the resin composition formed on the back surface 100D of the support substrate 100 can be made uniform.

On the other hand, at the inlet 110 _IN of the through hole 110, a recess 330 may be formed in the layer 310 of the resin composition. The recess 330 can be formed, for example, by excessively pushing the resin composition into the through hole 110 by the first squeegee 400, or by scraping a part of the resin composition by the first squeegee 400. Therefore, in the printing method according to the present embodiment, the second printing step is performed after the first printing step.

[6. Second printing process]
FIG. 7 is a cross-sectional view schematically showing a cross section of the support substrate 100 and the mask 200 in the second printing step of the printing method according to the present embodiment. As shown in FIG. 7, in the printing method according to the present embodiment, after the first printing step, the second squeegee 500 is relatively moved along the surface 200U of the mask 200 on the surface 200U. , A second printing step of applying the resin composition onto the resin composition filled in the through holes 110 is performed.

As the second squeegee 500, the same squeegee as the first squeegee 400 may be used, or a squeegee different from the first squeegee 400 may be used. Further, the moving direction of the second squeegee 500 may be the same as or different from the moving direction of the first squeegee 400. In the present embodiment, similarly to the first squeegee 400, an example in which a rectangular plate-shaped squeegee extending in the direction Y (see FIG. 2) and movably provided in the moving direction X is used as the second squeegee 500 is shown. explain.

In the second printing step, the second squeegee 500 is arranged near the end of the mask 200 so that the liquid pool 300 of the resin composition is located between the second squeegee 500 and the opening 210. At this time, from the viewpoint of achieving proper coating of the resin composition, the second squeegee 500 comes into contact with the surface 200U in a state of being inclined so as to form a predetermined attack angle θ ₅₀₀ with the surface 200U of the mask 200. Can be arranged to do so. Here, the attack angle θ ₅₀₀ represents an angle formed by the second squeegee 500 in front of the moving direction X with the surface 200U of the mask 200. The tip of the second squeegee 500 may bend due to friction between the support substrate 100, the mask 200, or the resin composition. In this case, the attack angle θ ₅₀₀ bends the second squeegee 500. It represents the angle formed between the portion other than the tip portion and the surface 200U of the mask 200. Further, the second squeegee 500 can be arranged in a state of being pressed against the mask 200 with a predetermined printing pressure. Here, the printing pressure of the second squeegee 500 represents the pressure at which the second squeegee 500 is pressed against the mask 200.

The second squeegee 500 is moved relatively on the surface 200U of the mask 200 in the moving direction X along the surface 200U while maintaining the attack angle θ ₅₀₀ and the printing pressure. In order to realize the relative movement, the second squeegee 500 may be moved, the support substrate 100 and the mask 200 may be moved, or all of them may be moved. In the present embodiment, an example of moving the second squeegee 500 in the direction parallel to and opposite to the moving direction of the first squeegee 400 will be described.

The movement of the second squeegee 500 is performed so that the second squeegee 500 crosses the opening 210 of the mask 200. Since it is pushed by the moving second squeegee 500, the liquid pool 300 of the resin composition also moves in the moving direction X. Then, when the second squeegee 500 crosses the opening 210, the resin composition is further applied onto the resin composition in the through hole 110 of the support substrate 100 through the opening 210. As a result, the resin composition layer 340 is further formed on the resin composition layer 310 in the through hole 110. Therefore, since the dent 330 can be filled, the dent 330 can be made smaller, and preferably the dent can be eliminated.

In the application of the resin composition in the second printing step, the surface 340U of the layer 340 of the resin composition is at the same position as or higher than the front surface 100U of the support substrate 100 in the thickness direction Z (that is, the support). It is preferable to perform the operation so as to come to a position far from the substrate 100). Further, the application of the resin composition in the second printing step is performed so that the surface 340U of the layer 340 of the resin composition is located at an upper position in the drawing with respect to the front surface 100U of the support substrate 100 in the thickness direction Z. Is preferable. In this case, a part or all of the resin composition applied in the second printing step can be left at the position 350 on the mask 200 side of the through hole 110. Therefore, since the resin composition can be deposited on the entrance 110 _IN of the through hole 110, the dent 330 can be effectively filled, and thus the dent can be eliminated.

The movement of the second squeegee 500 in the second printing step is performed by maintaining the state in which the support substrate 100 and the second squeegee 500 appearing in the opening 210 of the mask 200 are separated from each other so that the support substrate 100 and the second squeegee 500 are separated from each other. It is preferable to carry out so as not to come into contact with. In this case, there is a gap between the second squeegee 500 and the support substrate 100 so that the resin composition can enter. Therefore, it is possible to prevent the resin composition from being excessively pushed into the through hole 110 by the second squeegee 500, or to prevent a part of the resin composition from being scraped off by the second squeegee 500. Therefore, the depression 330 can be eliminated more effectively. Further, in this case, since the resin composition can enter the gap, the resin composition is usually placed on the support substrate 100 not only in the area where the through hole 110 is formed but also in the area other than the through hole 110. Layer 340 is formed.

It can be realized by various methods that the moving second squeegee 500 does not come into contact with the support substrate 100 appearing in the opening 210 of the mask 200.

As a method of preventing the second squeegee 500 from coming into contact with the support substrate 100, for example, a method of using a squeegee having low flexibility as the second squeegee 500 can be mentioned. Since the squeegee having low flexibility is not easily deformed even when subjected to pressure, it is difficult to enter the opening 210 of the mask 200, and thus the state of being separated from the support substrate 100 can be maintained. Specifically, it is preferable to use a second squeegee 500 having an elastic modulus larger than that of the first squeegee 400. In this case, usually, a material having a large elastic modulus is used as the material of the second squeegee 500. As the material having a large elastic modulus, a rigid material having a higher elastic modulus than the elastic material of the material of the first squeegee 400 is preferable, and examples thereof include a metal material. Therefore, as the second squeegee 500, a metal squeegee is preferable.

As another method of preventing the second squeegee 500 from coming into contact with the support substrate 100, for example, a method of reducing the printing pressure of the second squeegee 500 can be mentioned. When the printing pressure of the second squeegee 500 is small, the deformation of the second squeegee 500 can be reduced, so that the mask 200 can be suppressed from entering the opening 210 so as not to come into contact with the support substrate 100. Therefore, from the viewpoint of facilitating the separation of the second squeegee 500 from the support substrate 100, the printing pressure of the second squeegee 500 is preferably smaller than the printing pressure of the first squeegee 400.

As yet another method of preventing the second squeegee 500 from coming into contact with the support substrate 100, for example, a method of increasing the attack angle θ ₅₀₀ of the second squeegee 500 can be mentioned. When the attack angle θ ₅₀₀ of the second squeegee 500 is large, the second squeegee 500 receives only a small stress in the thickness direction of the second squeegee 500, so that the deformation can be reduced. Therefore, it is possible to prevent the second squeegee 500 from entering the opening 210 of the mask 200 so that it does not come into contact with the support substrate 100.

The attack angle θ ₅₀₀ of the second squeegee 500 can be arbitrarily set within a range in which the second squeegee 500 does not come into contact with the support substrate 100. As an example of a specific range, the attack angle θ ₅₀₀ is preferably 5 ° or more, more preferably 7 ° or more, particularly preferably 10 ° or more, preferably 90 ° or less, more preferably 80 ° or less. , Especially preferably 70 ° or less.

Further, from the viewpoint of facilitating the separation of the second squeegee 500 from the support substrate 100, the attack angle θ ₅₀₀ of the second squeegee 500 may be larger than the attack angle θ ₄₀₀ of the first squeegee 400.

As yet another method for preventing the second squeegee 500 from contacting the support substrate 100, for example, a method of increasing the printing speed as a relative moving speed of the second squeegee 500 with respect to the support substrate 100 and the mask 200 is used. Can be mentioned. When the printing speed of the second squeegee 500 is high, the resistance of the resin composition can be increased, so that the second squeegee 500 is prevented from coming into contact with the support substrate 100 by being hindered by the resin composition.

The printing speed of the second squeegee 500 can be arbitrarily set as long as the second squeegee 500 does not come into contact with the support substrate 100. As an example of a specific range, the printing speed of the second squeegee 500 is preferably 3 mm / sec or more, more preferably 5 mm / sec or more, and particularly preferably 15 mm / sec or more. The upper limit is not particularly limited and may be, for example, 100 mm / sec or less.

Further, from the viewpoint of facilitating the separation of the second squeegee 500 from the support substrate 100, the printing speed of the second squeegee 500 in the second printing step is preferably faster than the printing speed of the first squeegee 400 in the first printing step. .. In this case, the difference between the printing speed of the first squeegee 400 and the printing speed of the second squeegee 500 is preferably 0 mm / sec or more, more preferably 10 mm / sec or more, and particularly preferably 20 mm / sec or more. The upper limit is not particularly limited and may be, for example, 100 mm / sec or less.

The above-mentioned method exemplified as a method for preventing the second squeegee 500 from coming into contact with the support substrate 100 may be carried out in any combination.

The second printing step may be performed only once, or may be performed twice or more under the same or different conditions.

FIG. 8 is a cross-sectional view schematically showing a cross section of the support substrate 100 and the mask 200 immediately after the second printing step of the printing method according to the present embodiment. As shown in FIG. 8, when the resin composition is applied in the second printing step, the resin composition layer 340 is further formed on the resin composition layer 310 formed in the through holes 110. , The depression 330 is filled. Therefore, the depression 330 can be suppressed.

In a preferred embodiment, since the resin composition is applied to the entire area of the support substrate 100 appearing in the opening 210 of the mask 200, the front surface 100U of the support substrate 100 including the position 350 on the mask 200 side of the through hole 110 is wide. A layer 340 of the resin composition is formed in the range. The thickness T ₃₄₀ of the layer 340 of the resin composition formed on the front surface 100U of the support substrate 100 is preferably 10 μm or more, more preferably 20 μm or more, particularly preferably 30 μm or more, preferably 500 μm or less, more preferably. It is 400 μm or less, particularly preferably 300 μm or less. When the thickness T ₃₄₀ of the layer 340 of the resin composition is in the above range, the depression 330 can be eliminated with particularly high certainty. Here, the thickness T ₃₄₀ of the layer 340 of the resin composition means the distance from the front surface 100U of the support substrate 100 to the surface of the layer 340 of the resin composition (the surface farther from the support substrate 100) 340U. Further, if the thickness _{T 340} of the layer 340 of the resin composition is not uniform, it is preferable that the thickness _{T 340} at the position 350 of the mask 200 side of at least the through-hole 110 is within the range of the.

According to the printing method according to the present embodiment, the filled substrate 600 is obtained as a substrate having the support substrate 100 and the layer 360 of the resin composition that fills the through holes 110 of the support substrate 100. The layer 360 of the resin composition filling the through hole 110 is usually a part of the layer 310 of the resin composition formed in the first printing step and the layer 340 of the resin composition formed in the second printing step, or Including all. Further, in the filled substrate 600, the

layers

320 and 340 of the resin composition may be formed not only in the through hole 110 but also on one or both of the front surface 100U and the back surface 100D of the support substrate 100. .. In the filling substrate 600, the layer 360 of the resin composition is formed up to the outlet 110 _OUT of the through hole 110, and good filling property is achieved. Further, in the filling substrate 600, the recess of the resin composition layer 360 at the inlet 110 _IN of the through hole 110 (see the recess 330 in FIG. 7) can be reduced, and the recess can be preferably eliminated. Further, in the printing method for obtaining such a filled substrate 600, the accuracy of alignment when the mask 200 is installed on the support substrate 100 can be lowered, so that the labor for precise alignment can be omitted. Easy to operate. Therefore, according to the printing method described above, the resin composition can be easily and easily filled in the plurality of through holes 110 of the support substrate 100 with good filling property, and further, the layer 360 of the resin composition filled in the through holes 110 can be filled. The dent can be suppressed.

[7. Any step that may be included in the printing method]
The printing method according to the embodiment of the present invention may further include an arbitrary step in combination with the above-mentioned steps.
For example, the printing method is a resin on the mask 200 during the first printing process, between the first printing process and the second printing process, and at one or more times during the second printing process. It may include a step of supplying the composition.

Further, for example, the printing method may include a step of installing a frame material (not shown) such as a frame material surrounding the mask 200 and a frame material surrounding the opening 210 of the mask 200 on the mask 200. Good. By providing such a frame material, it is possible to prevent the resin composition from flowing out of the mask 200 in the supply step, the first printing step, and the second printing step.

Further, for example, the printing method may include a step of adjusting the printing environment such as temperature and atmospheric pressure in the first printing step and the second printing step. To give a specific example, a step of setting the printing environment in which the first printing step and the second printing step are performed to a vacuum environment may be included. Such adjustment of the printing environment can be performed using, for example, an appropriate printing apparatus.

Further, for example, the printing method may include a step of removing the mask 200 from the support substrate 100.

[8. How to manufacture a hole-filling board]
According to the printing method described above, a filled substrate having a support substrate on which through holes are formed and a layer of a resin composition that fills the through holes can be obtained. Therefore, by using the above-mentioned printing method, it is possible to provide a method for manufacturing a hole-filling substrate including a support substrate having through holes formed therein and a packed layer formed of a cured product of a resin composition in the through holes. Hereinafter, a method for manufacturing a hole-filling substrate according to an embodiment will be described.

The method for manufacturing the hole-filling substrate according to the present embodiment is as follows.
A step of printing a resin composition on a support substrate having a plurality of through holes formed by the above-mentioned printing method;
Includes a step of curing the resin composition and;

The step of printing the resin composition on the support substrate can be carried out by the above-mentioned printing method. By this printing, as shown in FIG. 8, a filled substrate 600 having a support substrate 100 and a layer 360 of a resin composition that fills the through holes 110 of the support substrate 100 is obtained.

As a method for manufacturing a hole-filling substrate, a step of removing the mask 200 may be performed, if necessary, after obtaining the filling substrate 600 by the above-mentioned printing.

FIG. 9 is a cross-sectional view schematically showing the hole-filling substrate 700 obtained immediately after the resin composition is cured in the method for manufacturing the hole-filling substrate 700 according to the present embodiment. As shown in FIG. 9, in the method for manufacturing the hole-filling substrate 700 according to the present embodiment, the resin composition is printed on the support substrate 100, and if necessary, the mask 200 is removed, and then the resin composition is cured. Perform the process. By curing the resin composition, a hole-filling substrate 700 including the support substrate 100 and the filling layer 710 formed of the cured product of the resin composition in the through holes 110 of the support substrate 100 can be obtained.

In the step of curing the resin composition, the resin composition is usually heat-treated. Since the resin composition contains a thermosetting resin, the resin composition can be cured by heat treatment to obtain a cured product thereof. The thermosetting conditions vary depending on the composition and type of the resin composition, but the curing temperature is preferably 60 ° C. or higher, more preferably 80 ° C. or higher, further preferably 100 ° C. or higher, preferably 240 ° C. or lower, more preferably. Is 220 ° C. or lower, more preferably 200 ° C. or lower. The curing time is preferably 5 minutes or more, more preferably 10 minutes or more, still more preferably 15 minutes or more, preferably 120 minutes or less, more preferably 100 minutes or less, still more preferably 90 minutes or less.

However, as shown in FIG. 8, in the filling substrate 600 obtained by printing the resin composition on the support substrate 100 by the above-mentioned printing method, the resin composition is also formed on the front surface 100U and the back surface 100D of the support substrate 100.

Layers

320 and 340 can be formed. Therefore, the hole-filling substrate 700 obtained by curing the resin composition supports the cured

product layers

720 and 730 formed of the cured product of the resin composition as a surplus filling layer formed outside the through holes 110. It can be prepared for 100 front surface 100U and back surface 100D. It is desirable to remove these cured

product layers

720 and 730. Therefore, the method for manufacturing the hole-filling substrate 700 may include a step of removing the cured

product layers

720 and 730 formed on the front surface 100U and the back surface 100D of the support substrate 100 by polishing. The polishing method is arbitrary, and examples thereof include buffing and belt polishing. Further, at the time of polishing, not only the cured

product layers

720 and 730 but also a part of the filling layer 710 and the support substrate 100 in the through hole 110 may be polished.

FIG. 10 is a cross-sectional view schematically showing the hole-filling substrate 700 after removing the surplus cured product layers 720 and 730 (see FIG. 9) by polishing in the method for manufacturing the hole-filling substrate 700 according to the present embodiment. As shown in FIG. 10, according to polishing, the surface 710U of the filling layer 710 and the front surface 100U of the support substrate 100 are flush with each other on the front surface 700U of the hole filling substrate 700, or the back surface of the hole filling substrate 700 is made flush with each other. At 700D, the surface 710D of the packing layer 710 and the back surface 100D of the support substrate 100 can be flush with each other. Here, the term "plane" means that the faces are in the same plane.

Further, the method for manufacturing the hole-filling substrate 700 according to the present embodiment may further include an arbitrary step in combination with the above-mentioned steps. For example, in the method for manufacturing the hole-filling substrate 700, a preheating step of heating the resin composition at a temperature lower than the curing temperature may be performed before the resin composition is cured. The time of the preheating step is preferably 5 minutes or more, more preferably 15 minutes or more, preferably 150 minutes or less, and more preferably 120 minutes or less.

[9. Circuit board manufacturing method]
By utilizing the above-described method for manufacturing a hole-filling substrate, it is possible to provide a method for manufacturing a circuit board such as an inductor substrate. Here, the inductor board represents the circuit board in which the inductor is provided inside the circuit board. For example, the method for manufacturing a circuit board according to an embodiment of the present invention is as follows.
With the process of manufacturing a hole-filling substrate by the manufacturing method described above;
A step of forming a conductor layer on the hole-filling substrate;

The process of manufacturing the hole-filling substrate can be carried out by the manufacturing method described above. By this manufacturing method, a hole-filling substrate including a support substrate and a filling layer can be obtained. In particular, when it is desired to manufacture an inductor substrate as a circuit board, it is desirable to manufacture a hole-filling substrate using a magnetic paste containing the magnetic powder as a resin composition so that a packed layer containing the magnetic powder can be obtained.

After the process of manufacturing the hole-filling substrate, the process of forming a conductor layer on the hole-filling substrate is performed. The conductor layer to be formed is usually formed in a predetermined wiring pattern so as to function as wiring. For example, when it is desired to manufacture an inductor substrate as a circuit board, the conductor layer may be formed so as to have a spiral wiring pattern. The conductor layer may be formed on the support substrate or the packed bed.

Examples of the method for forming the conductor layer include a plating method, a sputtering method, and a vapor deposition method. Of these, the plating method is preferable. Preferable embodiments include a semi-additive method, a full-additive method, and the like.

Materials for the conductor layer include, for example, single metals such as gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium; gold, platinum, palladium and silver. , Alloys of two or more metals selected from the group consisting of copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium; Above all, from the viewpoint of versatility, cost, ease of patterning, etc., use chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or nickel-chromium alloy, copper nickel alloy, copper titanium alloy. Is preferable. Further, it is more preferable to use chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel-chromium alloy. In particular, it is more preferable to use copper.

Hereinafter, a specific example of the method for forming the conductor layer will be described. A plating seed layer is formed on the surface of the hole-filling substrate by electroless plating. Next, an electrolytic plating layer is formed by electrolytic plating on the formed plating seed layer. Then, if necessary, the unnecessary plating seed layer can be removed by a treatment such as etching to form a conductor layer having a desired wiring pattern. Further, after forming the conductor layer, if necessary, annealing treatment may be performed for the purpose of improving the adhesion strength between the conductor layer and the hole filling substrate. The annealing treatment can be performed, for example, by heating the substrate at 150 ° C. to 200 ° C. for 20 minutes to 90 minutes.

From the viewpoint of thinning, the thickness of the conductor layer is preferably 70 μm or less, more preferably 60 μm or less, still more preferably 50 μm or less, still more preferably 40 μm or less, particularly preferably 30 μm or less, 20 μm or less, 15 μm. It is less than or equal to 10 μm or less. The lower limit is preferably 1 μm or more, more preferably 3 μm or more, still more preferably 5 μm or more.

The circuit board manufacturing method may further include an arbitrary step in combination with the above-mentioned steps. For example, the method for manufacturing a circuit board may further include a step of forming an insulating layer on the conductor layer. Further, for example, in the method of manufacturing a circuit board, a multi-layer printed wiring board may be manufactured as a circuit board by repeating a step of forming a conductor layer and a step of forming an insulating layer.

The circuit board obtained by the above-mentioned manufacturing method can be used as a circuit board for mounting electronic components such as semiconductor chips, and can also be used as a printed wiring board using such a circuit board as an inner layer board. Further, the circuit board can be used as an individualized chip inductor component, or the chip inductor component can be used as a surface-mounted circuit board. Above all, the circuit board is preferably an inductor substrate including an inductor element.

The circuit board can be applied to various types of semiconductor devices. A semiconductor device including such a circuit board is suitably used for, for example, electrical products (for example, computers, mobile phones, digital cameras, televisions, etc.) and vehicles (for example, motorcycles, automobiles, trains, ships, aircraft, etc.). Can be done.

[10. Resin composition]
The resin composition that can be used in the printing method described above includes an inorganic filler and a thermosetting resin. This resin composition may be in the form of a paste in the first printing step and the second printing step in the printing method.

The inorganic filler preferably contains magnetic powder. Examples of the magnetic powder include pure iron powder; Mg-Zn-based ferrite, Fe-Mn-based ferrite, Mn-Zn-based ferrite, Mn-Mg-based ferrite, Cu-Zn-based ferrite, Mg-Mn-Sr-based ferrite, and the like. Ni-Zn-based ferrite, Ba-Zn-based ferrite, Ba-Mg-based ferrite, Ba-Ni-based ferrite, Ba-Co-based ferrite, Ba-Ni-Co-based ferrite, Y-based ferrite, iron oxide powder (III), 4 Iron oxide powder such as triiron oxide; Fe—Si alloy powder, Fe—Si—Al alloy powder, Fe—Cr alloy powder, Fe—Cr—Si alloy powder, Fe—Ni—Cr alloy powder, Fe—Cr—Al alloy powder, Fe—Ni alloy powder, Fe—Ni—Mo alloy powder, Fe—Ni—Mo—Cu alloy powder, Fe—Co alloy powder, or Fe—Ni—Co system Iron alloy-based metal powders such as alloy powders; amorphous alloys such as Co-based amorphous materials; can be mentioned.

Among them, the magnetic powder preferably contains at least one type selected from the group consisting of iron oxide powder and iron alloy-based metal powder. Further, as the iron oxide powder, ferrite containing at least one selected from the group consisting of Ni, Cu, Mn, and Zn is preferable. Further, as the iron alloy-based metal powder, an iron alloy-based metal powder containing at least one selected from the group consisting of Si, Cr, Al, Ni, and Co is preferable.

As the magnetic powder, a commercially available magnetic powder can be used. Specific examples of commercially available magnetic powders that can be used include "M05S" manufactured by Powder Tech Co., Ltd .; "PST-S" manufactured by Sanyo Special Steel Co., Ltd .; "AW2-08" and "AW2-08PF20F" manufactured by Epson Atmix Co., Ltd. "AW2-08PF10F", "AW2-08PF3F", "Fe-3.5Si-4.5CrPF20F", "Fe-50NiPF20F", "Fe-80Ni-4MoPF20F"; "LD-M", "LD" manufactured by JFE Chemical Co., Ltd. -MH "," KNI-106 "," KNI-106GSM "," KNI-106GS "," KNI-109 "," KNI-109GSM "," KNI-109GS ";" KNS-415 "manufactured by Toda Kogyo Co., Ltd., "BSF-547", "BSF-029", "BSN-125", "BSN-125", "BSN-714", "BSN-828", "S-1281", "S-1641", "S" -1651 "," S-1470 "," S-1511 "," S-2430 ";" JR09P2 "manufactured by Nippon Heavy Chemical Industries, Ltd .;" Nanotek "manufactured by CIK Nanotech Co., Ltd .;" JEMK-S "," JEMK-S "manufactured by Kinsei Matec Co., Ltd. "JEMK-H": "Ytrium iron oxide" manufactured by ALDRICH and the like can be mentioned. One type of magnetic powder may be used alone, or two or more types may be used in combination.

The magnetic powder is not particularly limited, but is preferably spherical. The value (aspect ratio) obtained by dividing the length of the major axis of the magnetic powder by the length of the minor axis is preferably 2 or less, more preferably 1.5 or less, and further preferably 1.2 or less. In general, it is easier to improve the relative magnetic permeability when the magnetic powder has a flat shape that is not spherical. However, it is usually possible to reduce the magnetic loss and obtain a paste having a preferable viscosity by using a spherical magnetic powder in particular.

The average particle size of the magnetic powder is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.5 μm or more, still more preferably, from the viewpoint of obtaining a paste having a low magnetic loss and a preferable viscosity. It is 1 μm or more. Further, it is preferably 10 μm or less, more preferably 9 μm or less, and further preferably 8 μm or less. Further, when a magnetic powder having an average particle size as described above is used, problems of filling property and plate release property have been liable to occur in the past, and therefore, from the viewpoint of effectively utilizing the effect of the present invention, magnetism is also required. It is preferable that the average particle size of the powder falls within the above range.

The average particle size of the magnetic powder can be measured by the laser diffraction / scattering method based on the Mie scattering theory. Specifically, it can be measured by creating a particle size distribution of magnetic powder on a volume basis with a laser diffraction / scattering type particle size distribution measuring device and using the median diameter as the average particle size. As the measurement sample, a magnetic powder dispersed in methyl ethyl ketone by ultrasonic waves can be preferably used. As the laser diffraction / scattering type particle size distribution measuring device, "LA-500" manufactured by HORIBA, Ltd., "SALD-2200" manufactured by Shimadzu Corporation, or the like can be used.

The amount (% by volume) of the magnetic powder is preferably 10% by volume or more, more preferably 20% by volume or more, and further, with respect to 100% by volume of the non-volatile component in the resin composition, from the viewpoint of improving the specific magnetic permeability. It is preferably 30% by volume or more, preferably 85% by volume or less, more preferably 80% by volume or less, and further preferably 75% by volume or less.

The amount (mass%) of the magnetic powder is preferably 80% by mass or more, more preferably 82% by mass or more, and further, with respect to 100% by mass of the non-volatile component in the resin composition, from the viewpoint of improving the relative magnetic permeability. It is preferably 84% by mass or more, preferably 98% by mass or less, more preferably 96% by mass or less, and further preferably 94% by mass or less.

Further, when the above-mentioned amount of magnetic powder is used, problems of filling property and plate release property are liable to occur in the past. Therefore, from the viewpoint of effectively utilizing the effect of the present invention, the magnetic powder can be used. It is preferable that the amount falls within the above range.

The resin composition may contain an inorganic filler other than the magnetic powder. Examples of such an inorganic filler include organic layered silicate minerals.

The total amount of the inorganic filler containing the magnetic powder or the like is preferably 80% by mass or more, more preferably 82% by mass or more, still more preferably 85% by mass or more, based on 100% by mass of the non-volatile component in the resin composition. Yes, preferably 99% by mass or less, more preferably 97% by mass or less, still more preferably 95% by mass or less.

Examples of the thermosetting resin contained in the resin composition include epoxy resin, phenol resin, naphthol resin, benzoxazine resin, active ester resin, cyanate ester resin, carbodiimide resin, amine resin, and acid anhydride. Examples include physical resins. One type of thermosetting resin may be used alone, or two or more types may be used in combination. Above all, the resin composition preferably contains an epoxy resin as a thermosetting resin. Further, in the following description, epoxy resins such as phenol-based resins, naphthol-based resins, benzoxazine-based resins, active ester-based resins, cyanate ester-based resins, carbodiimide-based resins, amine-based resins, and acid anhydride-based resins The components that can cure the resin composition by reacting with the above may be collectively referred to as a "curing agent".

Examples of the epoxy resin include glycyrrole type epoxy resin; bisphenol A type epoxy resin; bisphenol F type epoxy resin; bisphenol S type epoxy resin; bisphenol AF type epoxy resin; dicyclopentadiene type epoxy resin; trisphenol type epoxy resin; phenol. Novolak type epoxy resin; tert-butyl-catechol type epoxy resin; naphthol novolac type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin and other epoxy resins having a fused ring structure; glycidylamine type epoxy resin; Glycidyl ester type epoxy resin; Cresol novolac type epoxy resin; Biphenyl type epoxy resin; Linear aliphatic epoxy resin; Epoxy resin having a butadiene structure; Oil ring type epoxy resin; Heterocyclic epoxy resin; Spiro ring-containing epoxy resin; Cyclohexane Dimethanol type epoxy resin; trimethylol type epoxy resin; tetraphenylethane type epoxy resin and the like can be mentioned. One type of epoxy resin may be used alone, or two or more types may be used in combination. The epoxy resin is preferably one or more selected from the group consisting of bisphenol A type epoxy resin and bisphenol F type epoxy resin.

The epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. Further, the epoxy resin preferably has an aromatic structure, and when two or more kinds of epoxy resins are used, it is more preferable that at least one of them has an aromatic structure. The aromatic structure is a chemical structure generally defined as aromatic, and also includes polycyclic aromatics and aromatic heterocycles. The ratio of the epoxy resin having two or more epoxy groups in one molecule to 100% by mass of the non-volatile component of the epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass. % Or more.

The epoxy resin may be a liquid epoxy resin at a temperature of 25 ° C. (hereinafter sometimes referred to as “liquid epoxy resin”) or a solid epoxy resin at a temperature of 25 ° C. (hereinafter referred to as “solid epoxy resin”). ). As the epoxy resin, only the liquid epoxy resin may be used, only the solid epoxy resin may be used, or the liquid epoxy resin and the solid epoxy resin may be used in combination. Above all, from the viewpoint of reducing the viscosity of the resin composition, it is preferable to use only the liquid epoxy resin.

Examples of the liquid epoxy resin include glycyrrole type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, and phenol novolac type epoxy. A resin, an alicyclic epoxy resin having an ester skeleton, a cyclohexanedimethanol type epoxy resin, and an epoxy resin having a butadiene structure are preferable, and a glycylol type epoxy resin, a bisphenol A type epoxy resin, and a bisphenol F type epoxy resin are more preferable.

Specific examples of the liquid epoxy resin include "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resin) manufactured by DIC; "828US" and "jER828EL" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd. , "JER807" (bisphenol F type epoxy resin), "jER152" (phenol novolac type epoxy resin); "630", "630LSD" manufactured by Mitsubishi Chemical Co., Ltd., "ED-523T" (glycylol type epoxy resin) manufactured by ADEKA. (Adecaglycyrol)), "EP-3980S" (glycidylamine type epoxy resin), "EP-4088S" (dicyclopentadiene type epoxy resin); "ZX1059" (bisphenol A type epoxy resin) manufactured by Nippon Steel & Sumitomo Metal Corporation (Mixed product of bisphenol F type epoxy resin); "EX-721" (glycidyl ester type epoxy resin) manufactured by Nagase ChemteX Co., Ltd .; "Selokiside 2021P" (alicyclic epoxy resin having an ester skeleton) manufactured by Daicel Co. "PB-3600" (epoxy resin having a butadiene structure); "ZX1658", "ZX1658GS" (liquid 1,4-glycidylcyclohexane) manufactured by Nippon Steel Chemical Co., Ltd. and the like can be mentioned. These may be used alone or in combination of two or more.

Examples of the solid epoxy resin include naphthalene type tetrafunctional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, and naphthylene ether type epoxy resin. Anthracene type epoxy resin, bisphenol A type epoxy resin, and tetraphenylethane type epoxy resin are preferable, and naphthalene type tetrafunctional epoxy resin, naphthol type epoxy resin, and biphenyl type epoxy resin are more preferable.

Specific examples of the solid epoxy resin include "HP4032H" (naphthalene type epoxy resin), "HP-4700", "HP-4710" (naphthalene type tetrafunctional epoxy resin), and "N-690" manufactured by DIC. Cresol novolac type epoxy resin), "N-695" (cresol novolac type epoxy resin), "HP-7200", "HP-7200HH", "HP-7200H" (dicyclopentadiene type epoxy resin), "EXA-7311" , "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" manufactured by Nippon Kayakusha. Trisphenol type epoxy resin), "NC7000L" (naphthol novolac type epoxy resin), "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl type epoxy resin); "ESN475V" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd. Naphthalene type epoxy resin), "ESN485" (naphthol novolac type epoxy resin); "YX4000H", "YL6121" (biphenyl type epoxy resin), "YX4000HK" (bixilenol type epoxy resin), "YX8800" manufactured by Mitsubishi Chemical Co., Ltd. (Anthracene type epoxy resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemical Co., Ltd., "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd., "YL7800" (fluorene type epoxy resin) , "JER1010" (solid bisphenol A type epoxy resin), "jER1031S" (tetraphenylethane type epoxy resin) and the like. One of these may be used alone, or two or more thereof may be used in combination.

When a liquid epoxy resin and a solid epoxy resin are used in combination, their quantity ratio (liquid epoxy resin: solid epoxy resin) is preferably 1: 0.1 to 1: 4, more preferably 1: 0.1 to 1: 4, in terms of mass ratio. It is 1: 0.3 to 1: 3.5, more preferably 1: 0.6 to 1: 3.

The epoxy equivalent of the epoxy resin is preferably 50 to 5000, more preferably 50 to 3000, still more preferably 80 to 2000, and even more preferably 110 to 1000. Within this range, the crosslink density of the cured product becomes sufficient, and a magnetic layer having a small surface roughness can be provided. The epoxy equivalent can be measured according to JIS K7236, and is the mass of the resin containing 1 equivalent of the epoxy group.

The weight average molecular weight of the epoxy resin is preferably 100 to 5000, more preferably 250 to 3000, and even more preferably 400 to 1500. Here, the weight average molecular weight of the epoxy resin is a polystyrene-equivalent weight average molecular weight measured by a gel permeation chromatography (GPC) method.

As the active ester resin, a resin having one or more active ester groups in one molecule can be used. Among them, the active ester-based resin has two or more ester groups with high reactive activity such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds in one molecule. Resin is preferred. The active ester resin is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester resin obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester resin obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable.

Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-. Cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenol, trihydroxybenzophenol, tetrahydroxybenzophenone, fluoroglusin, Examples thereof include benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolac. Here, the "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing two phenol molecules with one dicyclopentadiene molecule.

Preferred specific examples of the active ester-based resin include an active ester-based resin containing a dicyclopentadiene-type diphenol structure, an active ester-based resin containing a naphthalene structure, an active ester-based resin containing an acetylated product of phenol novolac, and a benzoyl of phenol novolac. Examples thereof include active ester-based resins containing compounds. Of these, an active ester resin containing a naphthalene structure and an active ester resin containing a dicyclopentadiene diphenol structure are more preferable. The "dicyclopentadiene-type diphenol structure" represents a divalent structural unit composed of phenylene-dicyclopentylene-phenylene.

Commercially available products of the active ester resin include "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T", and "HPC-8000H-" as active ester resins containing a dicyclopentadiene type diphenol structure. "65TM", "EXB-8000L-65TM" (manufactured by DIC); "EXB9416-70BK", "EXB-8150-65T" (manufactured by DIC) as an active ester resin containing a naphthalene structure; acetylated phenol novolac As an active ester resin containing "DC808" (manufactured by Mitsubishi Chemical Co., Ltd.); "YLH1026" (manufactured by Mitsubishi Chemical Co., Ltd.) as an active ester resin containing a benzoylate of phenol novolac; as an active ester resin which is an acetylated product of phenol novolac. "DC808" (manufactured by Mitsubishi Chemical); "YLH1026" (manufactured by Mitsubishi Chemical), "YLH1030" (manufactured by Mitsubishi Chemical), "YLH1048" (manufactured by Mitsubishi Chemical) as active ester-based resins that are benzoylates of phenol novolac. ); Etc. can be mentioned.

As the phenolic resin and the naphthol resin, those having a novolak structure are preferable from the viewpoint of heat resistance and water resistance. Further, from the viewpoint of adhesion between the conductor layer and the packing layer, a nitrogen-containing phenol-based curing agent is preferable, and a triazine skeleton-containing phenol-based resin is more preferable.

Specific examples of the phenolic resin and the naphthol resin include "MEH-7700", "MEH-7810", "MEH-7851" manufactured by Meiwa Kasei Co., Ltd., and "NHN" and "CBN" manufactured by Nippon Kayaku Co., Ltd. , "GPH", "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V", "SN375", "SN395", DIC manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. Examples thereof include "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA-3018-50P", and "EXB-9500" manufactured by the same company.

Specific examples of the benzoxazine-based resin include "JBZ-OD100" (benzoxazine ring equivalent 218), "JBZ-OP100D" (benzoxazine ring equivalent 218), and "ODA-BOZ" (benzoxazine ring) manufactured by JFE Chemical Co., Ltd. Equivalent 218); "Pd" (benzoxazine ring equivalent 217), "Fa" (benzoxazine ring equivalent 217) manufactured by Shikoku Kasei Kogyo Co., Ltd .; "HFB2006M" (benzoxazine ring equivalent) manufactured by Showa Polymer Co., Ltd. 432) and the like.

Examples of the cyanate ester-based resin include bisphenol A disicianate, polyphenol cyanate, oligo (3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis (2,6-dimethylphenylcyanate), and 4,4'. -Etilidendiphenyl disianate, hexafluorobisphenol A disyanate, 2,2-bis (4-cyanate) phenylpropane, 1,1-bis (4-cyanate phenylmethane), bis (4-cyanate-3,5-dimethylphenyl) ) Bifunctional cyanate resins such as methane, 1,3-bis (4-cyanatephenyl-1- (methylethylidene)) benzene, bis (4-cyanatephenyl) thioether, and bis (4-cyanatephenyl) ether; phenol Examples thereof include polyfunctional cyanate resins derived from novolak and cresol novolak; prepolymers in which these cyanate resins are partially triazined. Specific examples of the cyanate ester resin include "PT30" and "PT60" (phenol novolac type polyfunctional cyanate ester resin), "ULL-950S" (polyfunctional cyanate ester resin), and "BA230" manufactured by Ronza Japan. Examples thereof include "BA230S75" (a prepolymer in which part or all of bisphenol A disyanate is triazined to form a trimer).

Specific examples of the carbodiimide-based resin include carbodilite (registered trademark) V-03 (carbodiimide group equivalent: 216, V-05 (carbodiimide group equivalent: 262), V-07 (carbodiimide group equivalent: 200)) manufactured by Nisshinbo Chemical Co., Ltd. V-09 (carbodiimide group equivalent: 200); Stavaxol® P (carbodiimide group equivalent: 302) manufactured by Rheinchemy.

Examples of the amine-based resin include resins having one or more amino groups in one molecule. Specific examples thereof include aliphatic amines, polyether amines, alicyclic amines, aromatic amines, and the like, and among them, aromatic amines are preferable. The amine-based resin is preferably a primary amine or a secondary amine, more preferably a primary amine. Specific examples of amine-based curing agents include 4,4'-methylenebis (2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'. -Diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl- 4,4'-Diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis (3-amino-4-hydroxyphenyl) propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane Diamine, 2,2-bis (4-aminophenyl) propane, 2,2-bis (4- (4-aminophenoxy) phenyl) propane, 1,3-bis (3-aminophenoxy) benzene, 1,3- Bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 4,4'-bis (4-aminophenoxy) biphenyl, bis (4- (4-aminophenoxy) phenyl) sulfone, Examples thereof include bis (4- (3-aminophenoxy) phenyl) sulfone. Commercially available products may be used as the amine resin, for example, "KAYABOND C-200S", "KAYABOND C-100", "Kayahard AA", "Kayahard AB", "Kayahard" manufactured by Nippon Kayaku Corporation. Examples include "AS" and "Epicure W" manufactured by Mitsubishi Chemical Corporation.

Examples of the acid anhydride-based resin include resins having one or more acid anhydride groups in one molecule. Specific examples of the acid anhydride-based resin include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, and methylnadic hydride anhydride. Trialkyltetrahydrophthalic anhydride, succinic anhydride, 5- (2,5-dioxotetrahydro-3-furanyl) -3-methyl-3-cyclohexene-1,2-dicarboxylic acid anhydride, trimerit anhydride Acid, pyromellitic anhydride, benzophenone tetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, oxydiphthalic acid dianhydride, 3,3'-4,4'-diphenyl Sulphontetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5- (tetrahydro-2,5-dioxo-3-furanyl) -naphtho [1,2-C] furan-1, Examples thereof include 3-dione, ethylene glycol bis (anhydrotrimeritate), and polymer-type acid anhydrides such as styrene / maleic acid resin in which styrene and maleic acid are copolymerized.

When an epoxy resin and a curing agent are used in combination as a thermosetting resin, the amount ratio of the epoxy resin to all the curing agents is [total number of epoxy groups in the epoxy resin]: [total number of reactive groups in the curing agent]. The ratio is preferably in the range of 1: 0.01 to 1: 5, more preferably 1: 0.5 to 1: 3, and even more preferably 1: 1 to 1: 2. Here, the "number of epoxy groups in the epoxy resin" is a total value obtained by dividing the mass of the non-volatile component of the epoxy resin present in the resin composition by the epoxy equivalent. The "number of active groups of the curing agent" is a total value obtained by dividing the mass of the non-volatile component of the curing agent present in the resin composition by the active group equivalent.

The amount of the thermosetting resin is preferably 1% by mass or more, more preferably 3% by mass or more, still more preferably 5% by mass or more, and preferably 30% by mass, based on 100% by mass of the non-volatile component in the resin composition. It is mass% or less, more preferably 25 mass% or less, still more preferably 20 mass% or less. When the amount of the thermosetting resin is within the above range, problems of filling property and plate release property have been liable to occur in the past. Therefore, from the viewpoint of effectively utilizing the effect of the present invention, the amount of the thermosetting resin is described above. It is preferable that it falls within the range.

The amount of the thermosetting resin with respect to 100% by mass of the inorganic filler is preferably 1% by mass or more, more preferably 3% by mass or more, still more preferably 5% by mass or more, preferably 30% by mass or less, more preferably. It is 25% by mass or less, more preferably 20% by mass or less. When the amount of the thermosetting resin is within the above range, problems of filling property and plate release property have been liable to occur in the past. Therefore, from the viewpoint of effectively utilizing the effect of the present invention, the amount of the thermosetting resin is described above. It is preferable that it falls within the range.

The resin composition may further contain a curing accelerator as an arbitrary component. Examples of the curing accelerator include amine-based curing accelerators, imidazole-based curing accelerators, phosphorus-based curing accelerators, guanidine-based curing accelerators, and metal-based curing accelerators. As the curing accelerator, an amine-based curing accelerator and an imidazole-based curing accelerator are preferable from the viewpoint of reducing the viscosity of the resin composition. One type of curing accelerator may be used alone, or two or more types may be used in combination.

Examples of the amine-based curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6, -tris (dimethylaminomethyl) phenol, and 1,8-diazabicyclo. Examples thereof include (5,4,0) -undecene, and 4-dimethylaminopyridine and 1,8-diazabicyclo (5,4,5) -undecene are preferable. As the amine-based curing accelerator, a commercially available product may be used, and examples thereof include "PN-50", "PN-23", and "MY-25" manufactured by Ajinomoto Fine-Techno.

Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-undecyl imidazole, 2-heptadecyl imidazole, 1,2-dimethyl imidazole, 2-ethyl-4-methyl imidazole, 1,2-dimethyl imidazole, and the like. 2-Ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-Cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl- 2-Phenylimidazolium trimerite, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecyl Imidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4- Diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2- Phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline , 2-Phenylimidazoline and other imidazole compounds and adducts of the imidazole compound and an epoxy resin are mentioned, with 2-phenyl-4-methylimidazole being preferred. As the imidazole-based curing accelerator, a commercially available product may be used, and examples thereof include "2P4MZ" and "2PHZ-PW" manufactured by Shikoku Chemicals Corporation; "P200-H50" manufactured by Mitsubishi Chemical Corporation.

Examples of the phosphorus-based curing accelerator include triphenylphosphine, phosphonium borate compound, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, and (4-methylphenyl) triphenylphosphonium thiocyanate. , Tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate and the like, and triphenylphosphine and tetrabutylphosphonium decanoate are preferable.

Examples of the guanidine-based curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, diphenylguanidine, and trimethylguanidine. Tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] deca-5-ene, 7-methyl-1,5,7-triazabicyclo [4.4.0] Deca-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadesylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1 Examples thereof include allylbiguanide, 1-phenylbiguanide, 1- (o-tolyl) biganide, and dicyandiamide, 1,5,7-triazabicyclo [4.4.0] deca-5-ene is preferable.

Examples of the metal-based curing accelerator include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of the organic metal complex include an organic cobalt complex such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, an organic copper complex such as copper (II) acetylacetonate, and zinc (II) acetylacetonate. Examples thereof include organic zinc complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, and organic manganese complexes such as manganese (II) acetylacetonate. Examples of the organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate and the like.

The amount of the curing accelerator is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, based on 100% by mass of the non-volatile component in the resin composition from the viewpoint of lowering the viscosity of the resin composition. It is more preferably 0.5% by mass or more, preferably 5% by mass or less, more preferably 3% by mass or less, still more preferably 1% by mass or less.

The resin composition may contain a dispersant as an arbitrary component. Examples of the dispersant include phosphate ester dispersants such as polyoxyethylene alkyl ether phosphoric acid; anionic dispersants such as sodium dodecylbenzel sulfonate, sodium laurate, and ammonium salts of polyoxyethylene alkyl ether sulfate; Non-ions such as organosiloxane dispersants, acetylene glycols, polyoxyethylene alkyl ethers, polyoxyethylene alkyl esters, polyoxyethylene sorbitan fatty acid esters, polyoxyethylene alkyl phenyl ethers, polyoxyethylene alkyl amines, and polyoxyethylene alkyl amides. Examples include sex dispersants. Of these, anionic dispersants are preferred. One type of dispersant may be used alone, or two or more types may be used in combination.

A commercially available product can be used as the phosphoric acid ester-based dispersant. Examples of commercially available products include "RS-410", "RS-610", "RS-710" and the like of the "Phosphanol" series manufactured by Toho Chemical Industry Co., Ltd.

Examples of commercially available organosiloxane-based dispersants include "BYK347" and "BYK348" manufactured by Big Chemie.

Commercially available polyoxyalkylene dispersants include, for example, "AKM-0531", "AFB-1521", "SC-0505K", "SC-1015F" and "SC-1015F" of the "Marialim" series manufactured by NOF CORPORATION. "SC-0708A", "HKM-50A" and the like can be mentioned.

As the acetylene glycol, as a commercially available product, for example, Air Products and Chemicals Inc. Examples thereof include "82", "104", "440", "465" and "485", and "Olefin Y" of the "Surfinol" series manufactured by Japan.

The amount of the dispersant is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, still more preferably 0.5% by mass or more, based on 100% by mass of the non-volatile component in the resin composition. It is preferably 5% by mass or less, more preferably 3% by mass or less, and further preferably 1% by mass or less.

The resin composition may contain, for example, a thermosetting resin; a curing retardant such as triethyl borate for improving pot life; a flame retardant; an organic filler; an organic copper compound, an organic zinc compound and an organic cobalt compound. And the like; an organometallic compound; a thickener; an antifoaming agent; a leveling agent; an adhesion imparting agent; a coloring agent; may be contained.

The resin composition may contain a solvent. However, the amount of the solvent in the resin composition is preferably small. Furthermore, it is particularly preferable that the resin composition does not contain a solvent. Specifically, the amount of the solvent in the resin composition is preferably less than 1.0% by mass, more preferably 0.8% by mass or less, still more preferably, based on 100% by mass of the total mass of the resin composition. It is 0.5% by mass or less, particularly preferably 0.1% by mass or less. The lower limit is 0.001% by mass or more, or no content, without particular limitation. Since the amount of the solvent in the resin composition is small, it is possible to suppress the generation of voids due to the volatilization of the solvent, and it is also possible to adapt to vacuum printing.

The resin composition may be in the form of a paste in the first printing step and the second printing step described above. The viscosity of the paste-like resin composition in the first printing step and the second printing step is preferably 50 Pa · s or more, more preferably 60 Pa · s or more, and further preferably 70 Pa · s or more. When the viscosity of the resin composition is high as described above, problems of filling property and plate release property have been liable to occur in the past. Therefore, from the viewpoint of effectively utilizing the effects of the present invention, the first printing step and the second printing step It is preferable that the viscosity of the resin composition in the above range is within the above range. The upper limit of the viscosity is preferably 200 Pa · s or less, more preferably 190 Pa · s or less, still more preferably 180 Pa · s or less, from the viewpoint of easy removal of air bubbles during printing. The viscosity of the resin composition in the first printing step and the viscosity of the resin composition in the second printing step may be the same or different. The viscosity can also be measured using an E-type viscometer.

The resin composition can be produced, for example, by a method of stirring each component of the resin composition using a stirring device such as a three-roll or rotary mixer.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples. In the following description, "parts" and "%" mean "parts by mass" and "% by mass", respectively, unless otherwise specified.

Further, in the following description, the rubber hardness represents a value measured by a durometer (type A).

[Manufacturing Example 1: Production of magnetic paste for filling holes]
Epoxy resin ("ZX-1059", a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin, manufactured by Nippon Steel & Sumitomo Metal Corporation) 10 parts by mass, epoxy resin ("ED-523T", low viscosity epoxy resin, ADEKA) 5 parts, dispersant ("RS-710", polymer anionic dispersant, manufactured by Toho Kagaku Co., Ltd.), 1 part by mass, curing accelerator ("2P4MZ", imidazole-based curing accelerator, manufactured by Shikoku Kasei Co., Ltd.) 1 Parts by mass, magnetic powder ("M05S", Fe-Mn-based ferrite, average particle size 3 μm, manufactured by Powder Tech) 100 parts by mass, and organicized smectite ("Smecton STN", trioctylmethylammonium-treated epoxy) Wright, manufactured by Kunimine Kogyo Co., Ltd.) 2 parts by mass were mixed and uniformly dispersed by 3 rolls to prepare a magnetic paste as a resin composition.

Keep the temperature of the magnetic paste at 25 ° C, which is the same as the first printing step and the second printing step in Examples and Comparative Examples described later, and use an E-type viscometer (“RE-80U” manufactured by Toki Sangyo Co., Ltd., 3 ° C. The viscosity was measured using a × R9.7 cone (rotation speed is 5 rpm). As a result of the measurement, the viscosity was 170 Pa · s.

In addition, the specific magnetic permeability and magnetic loss of the cured product of the magnetic paste were measured by the following methods.
As a support, a polyethylene terephthalate (PET) film (“PET501010” manufactured by Lintec Corporation, thickness 50 μm) treated with a silicon-based release agent was prepared. The magnetic paste was uniformly applied on the release surface of the PET film with a doctor blade so that the thickness of the paste layer after drying was 100 μm to obtain a resin sheet. The obtained resin sheet was heated at 130 ° C. for 30 minutes to thermally cure the paste layer, and the support was peeled off to obtain a sheet-like cured product. The obtained cured product was cut into test pieces having a width of 5 mm and a length of 18 mm to prepare an evaluation sample. Using Agilent Technologies (manufactured by Agilent Technologies, "HP8362B"), this evaluation sample was measured at a measurement frequency of 100 MHz by a 3-turn coil method, and the specific magnetic permeability (μ') and magnetic loss (μ') were set at room temperature of 23 ° C. '') Was measured. As a result of the measurement, the relative permeability was 7.5 and the magnetic loss was 0.1.

[Example 1]
(1-1. Preparation of support board)
A support substrate (a substrate obtained by impregnating and curing a glass cloth with an epoxy resin, having a thickness of 700 μm) having a plurality of through holes uniformly formed was prepared. The through holes were cylindrical holes, the diameter thereof (see diameter W _{110 in} FIG. 1) was 350 μm, and the distance between the through holes (see distance P _{110 in} FIG. 1) was 100 μm.

(1-2. Preparation of mask)
As a mask, a metal mask in which an opening as a hollow hole was formed on a metal flat plate having a thickness of 50 μm was prepared. The planar shape of the opening was a 20 mm square.

(1-3. Printing of magnetic paste)
Using the above mask, the magnetic paste was printed on the support substrate in the following manner. The printing was performed using a vacuum high-precision screen printing machine (“LS-100VC” manufactured by Neurongue Precision Industry Co., Ltd.).

(1-3-1. Installation process)
A mask was installed on one side of the support substrate. At this time, the mask was installed so that one opening of the mask communicated with a plurality of through holes of the support substrate.

(1-3-2. Supply process)
Then, the magnetic paste was supplied to the surface of the mask opposite to the support substrate.

(1-3-3. First printing process)
After that, a rubber squeegee (“SVFSQ” manufactured by Neurongue Precision Industries, thickness 9 mm, rubber hardness 90 degrees) formed of rubber as an elastic material is moved along the surface of the mask. The resin composition was printed. The attack angle of the first squeegee was 20 °, the printing pressure was 4.4 MPa, and the printing speed was 5 mm / sec. The first squeegee moved across the opening of the mask while maintaining a paste pool of magnetic paste in front of the first squeegee in the direction of movement. By this operation, the magnetic paste was swept by the first squeegee, and the through holes were filled with the magnetic paste.

When observing the support substrate after the first printing process, there was a place where the magnetic paste did not adhere to the area including the through hole on the surface of the support substrate that appeared in the opening of the mask. Therefore, it was confirmed that when the first squeegee crossed the opening in the first printing step, a part of the first squeegee was pushed into the opening and was in contact with the support substrate.

(1-3-4. Second printing process)
Then, the same rubber squeegee as the first squeegee was used as the second squeegee to print the remaining magnetic paste that was not filled in the through holes in the first printing step. Specifically, the same operation as in the first printing step was performed except that the printing speed was changed to 100 mm / sec. The second squeegee moved across the opening of the mask while maintaining a paste pool of magnetic paste in front of the second squeegee in the direction of movement. By this operation, the magnetic paste was swept by the second squeegee, and the resin composition was further applied onto the resin composition filled in the through holes.

When observing the support substrate after the second printing process, the magnetic paste was attached to the entire support substrate that appeared in the opening of the mask. Therefore, when the second squeegee crosses the opening in the second printing process, the second squeegee does not contact the support substrate, and there is a gap between the second squeegee and the support substrate so that the magnetic paste can enter. Was confirmed.

(1-4. Curing of magnetic paste)
By the above printing, a filled substrate provided with a support substrate and a resin composition layer was obtained. The filled substrate was heated at 130 ° C. for 30 minutes. By this heating, the resin composition layer was thermoset to form a packed layer, thereby obtaining a hole-filling substrate.

[Example 2]
The first printing step was repeated three times. Further, the printing speed of the second squeegee in the second printing step was changed to 60 mm / sec.
Except for the above items, the same operation as in Example 1 was performed to obtain a hole-filling substrate.

In the second embodiment as well, similarly to the first embodiment, when the first squeegee crosses the opening in the first printing process, a part of the first squeegee is pushed into the opening and is in contact with the support substrate. In the second printing process, it was confirmed that the second squeegee moved so as not to touch the support substrate when the second squeegee crossed the opening.

[Example 3]
The printing speed of the first squeegee in the first printing step was changed to 3 mm / sec. Further, the printing speed of the second squeegee in the second printing step was changed to 75 mm / sec.
Except for the above items, the same operation as in Example 1 was performed to obtain a hole-filling substrate.

In the third embodiment as well, similarly to the first embodiment, when the first squeegee crosses the opening in the first printing process, a part of the first squeegee is pushed into the opening and is in contact with the support substrate. In the second printing process, it was confirmed that the second squeegee moved so as not to touch the support substrate when the second squeegee crossed the opening.

[Example 4]
The second squeegee was changed to a metal squeegee made of metal as a rigid material having a high elastic modulus. Further, the printing speed of the second squeegee in the second printing step was changed to 5 mm / sec.
Except for the above items, the same operation as in Example 1 was performed to obtain a hole-filling substrate.

In the fourth embodiment as well, similarly to the first embodiment, when the first squeegee crosses the opening in the first printing process, a part of the first squeegee is pushed into the opening and is in contact with the support substrate. In the second printing process, it was confirmed that the second squeegee moved so as not to touch the support substrate when the second squeegee crossed the opening.

[Comparative Example 1]
The same operation as in Example 1 was performed except that the second printing step was not performed, to obtain a hole-filling substrate.

[Comparative Example 2]
A screen mask having a plate thickness (thickness of the mask portion) of 138 μm and a mesh count of # 120 was prepared. Here, the mesh count represents the number of wire rods per inch (that is, the wire rods forming the mesh). This screen mask had a mask portion provided with an emulsion layer that did not allow the magnetic paste to permeate, and a mesh portion in which the mesh was exposed without the emulsion layer. The magnetic paste was able to pass through the mesh portion through the opening of the mesh, and its planar shape was a square of 20 mm square.

As a mask to be installed on one side of the support substrate, the above-mentioned screen mask was used instead of the metal mask. The screen mask was installed so that one mesh portion of the screen mask communicated with a plurality of through holes of the support substrate. When such a screen mask is used, the mesh of the mesh portion becomes an obstacle, and the first squeegee and the second squeegee cannot contact the support substrate.
Moreover, the second printing process was not carried out.
Except for the above items, the same operation as in Example 1 was performed to obtain a hole-filling substrate.

[Comparative Example 3]
The first squeegee and the second squeegee were changed to metal squeegees made of metal as a rigid material having a high elastic modulus. Since this metal squeegee has a small elastic deformation, a part of the first squeegee cannot be pushed into the opening when the first squeegee crosses the opening in the first printing process. Further, the printing speed of the second squeegee in the second printing step was changed to 5 mm / sec.
Except for the above items, the same operation as in Example 1 was performed to obtain a hole-filling substrate.

[Evaluation]
The shape of the hole-filling substrate obtained in the above-mentioned Examples and Comparative Examples was measured using a laser microscope. From the measurement results, the filling property of the resin composition and the depression of the layer of the resin composition were evaluated according to the following criteria.

Evaluation criteria for filling property:
"Good": There are no through holes recessed from the support substrate on the back surface of the hole-filling substrate.
"Defective": On the back surface of the hole-filling substrate, there is one or more through holes recessed from the support substrate.
Here, "a through hole recessed from the back surface of the hole-filling substrate" means a through hole in which the filling layer filled in the through hole is recessed from the back surface of the support substrate. That is, "a through hole recessed from the support substrate on the back surface of the hole-filling substrate" means that the position of the surface of the filling layer filled in the through hole on the opposite side of the mask is larger than the back surface of the support substrate. , Represents a through hole close to the mask in the thickness direction.

Evaluation criteria for dents:
"Good": There are no through holes recessed from the support substrate on the front surface of the hole-filling substrate.
"Defective": There is one or more through holes recessed from the support substrate on the front surface of the hole-filling substrate.
Here, "a through hole recessed from the front surface of the hole-filling substrate" means a through hole in which the filling layer filled in the through hole is recessed from the front surface of the support substrate. That is, "through holes recessed from the support substrate on the front surface of the hole-filling substrate" means that the position of the mask-side surface of the filling layer filled in the through holes is in the thickness direction of the front surface of the support substrate. Represents a through hole far from the mask.

[result]
The results of the above-mentioned Examples and Comparative Examples are shown in the table below.

[Consideration]
As shown in Comparative Example 2, when the screen mask was used, the evaluation of the dent was poor. Specifically, when the screen mask is peeled off, a part of the magnetic paste adheres to the mesh portion, and a portion without the magnetic paste is generated at the entrance of the through hole by the amount of the adhered magnetic paste, and this portion becomes a dent. Was there. Further, in Comparative Example 2, the magnetic paste moved along the front surface of the support substrate in the mesh portion, and the pressure applied to the magnetic paste became weaker in the central portion of the mesh portion, so that the through holes were not sufficiently filled. there were. Specifically, the filling was insufficient near the center of the mesh portion.

As shown in Comparative Example 3, when a metal squeegee was used as the first squeegee, when the metal squeegee moved across the opening of the mask, it could not be pushed into the opening of the mask. Therefore, since the magnetic paste could not be pushed into the through hole with sufficient pressure, a through hole in which the magnetic paste could not be filled to the back was generated near the center of the opening, resulting in poor filling property.

In Comparative Example 1, when the rubber squeegee as the first squeegee moves across the opening of the mask, it can be pushed into the inside of the opening and come into contact with the support substrate. Therefore, since the first squeegee can move so as to close the through hole, the magnetic paste does not move in the in-plane direction, and as a result, the magnetic paste can be pushed into the through hole with sufficient pressure. Therefore, the magnetic paste can be filled deeply in any of the through holes, and the filling property can be improved.
However, the first squeegee as a rubber squeegee is elastically deformed and partially invades the through hole. Then, as much as the first squeegee entered, a portion without magnetic paste was generated at the entrance of the through hole, and this portion became a dent.

On the other hand, in the embodiment, the second printing step of filling the dent at the entrance of the through hole was performed, so that the dent could be eliminated. Further, in the example, the filling property was good as in the comparative example 1. Further, in the above embodiment, since the mask is installed on the support substrate so that one opening communicates with two or more through holes, precise alignment is not required. Therefore, the operation can be simplified because the precise position adjustment can be omitted. Therefore, from the results of these examples, the printing method of the present invention can easily and easily fill the plurality of through holes of the support substrate with the resin composition with good filling properties, and further, the resin composition filled in the through holes. It was confirmed that the dents in the plastic can be suppressed.

100 Support substrate 100U Front surface 110D Back surface 110 Through hole 110 _IN Through hole entrance 110 _OUT Through hole exit 200 Mask 200U Mask surface 210 Opening 300 Resin composition liquid pool 310 Resin composition layer 320 Resin composition Layer 330 Depression 340 Resin composition layer 340U Resin composition layer surface 350 Through-hole mask side position 360 Resin composition layer 400 First squeegee 500 Second squeegee 600 Filling substrate 700 Filling substrate 700U Filling substrate Front surface 700D Back surface of hole-filling substrate 710 Filling layer 710U Filling layer surface 710D Filling layer surface 720 Hardened layer 730 Hardened layer 900 Screen mask 910 Mesh part 920 Mesh

Claims

An installation step of installing a mask having hollow openings formed on a support substrate having a plurality of through holes so that one opening communicates with two or more through holes.
A supply step of supplying a resin composition containing an inorganic filler and a thermosetting resin to a surface of the mask opposite to the support substrate.
The first squeegee is moved relatively along the surface of the mask so that a part of the first squeegee is pushed into the opening, and the resin is inserted into the through hole. The first printing step of filling the composition and
A second squeegee that is the same as or different from the first squeegee is moved relative to the surface of the mask along the surface, and the resin composition is placed on the resin composition filled in the through holes. A printing method comprising a second printing step of applying an object.
The printing according to claim 1, wherein in the first printing step, the first squeegee is relatively moved on the surface of the mask so that the part of the first squeegee is in contact with the support substrate. Method.
The printing method according to claim 1 or 2, wherein the elastic modulus of the second squeegee is larger than the elastic modulus of the first squeegee.
The relative moving speed of the second squeegee in the second printing step is faster than the relative moving speed of the first squeegee in the first printing step, according to any one of claims 1 to 3. The printing method described.
The printing method according to any one of claims 1 to 4, wherein the resin composition applied in the second printing step remains at a position on the mask side of the through hole.
The printing method according to any one of claims 1 to 5, wherein the mask is a metal mask.
The printing method according to any one of claims 1 to 6, wherein the inorganic filler contains magnetic powder.
The printing method according to claim 7, wherein the magnetic powder contains at least one type selected from the group consisting of iron oxide powder and iron alloy-based metal powder.
The printing method according to any one of claims 1 to 8, wherein the viscosity of the resin composition in the first printing step and the second printing step is 50 Pa · s or more.
A method for manufacturing a hole-filling substrate including a support substrate having a plurality of through holes formed therein and a filling layer formed of a cured product of a resin composition in the through holes.
A step of printing the resin composition on the support substrate by the printing method according to any one of claims 1 to 9.
A method for manufacturing a fill-in-the-blank substrate, which comprises a step of curing a resin composition.
The method for manufacturing a hole-filling substrate according to claim 10, which includes a step of polishing the packed bed.
A step of manufacturing a hole-filling substrate by the manufacturing method according to claim 10 or 11.
A method for manufacturing a circuit board, which comprises a step of forming a conductor layer on the hole-filling board.