JPWO2020196601A5 - - Google Patents

Claims (14)

Polysiloxane (A1) having a structure represented by the following general formulas (1) and (2), a naphthoquinone diazide compound (B), and a photoradical generator (C1) having a maximum absorption wavelength of 200 to 360 nm and/or A positive photosensitive resin composition comprising a photoacid generator (C1′).

(R ¹ is a hydrogen atom or a methyl group, R ² and R ³ are a single bond or a substituted or unsubstituted hydrocarbon group having 1 to 8 carbon atoms. The asterisk is directly linked to a silicon atom.) The maximum absorption coefficient at 200 to 360 nm of the photo-radical generator (C1) or photo-acid generator (C1′), or the photo-radical generator (C2) or photo-acid generator (C2′) is 360 nm. 2. The positive photosensitive resin composition according to claim 1 , which is 4 times or more the maximum absorption coefficient at ~450 nm. The maximum absorption coefficient at 300 nm to 360 nm of the photo-radical generator (C1) or photo-acid generator (C1′), or the photo-radical generator (C2) or photo-acid generator (C2′) is 3000 mL. /g·cm or more, the positive photosensitive resin composition according to claim 1 or 2 . The maximum value of the absorption coefficient at 360 nm to 450 nm of the photo-radical generator (C1) or photo-acid generator (C1′), or the photo-radical generator (C2) or photo-acid generator (C2′) is 500 mL. /g·cm, the positive photosensitive resin composition according to any one of claims 1 to 3 . The positive photosensitive resin composition according to any one of claims 1 to 4 , wherein said polysiloxane (A1) or said polysiloxane (A2) further has a structure represented by the following general formula (3).

(R ⁴ is a single bond or a substituted or unsubstituted divalent hydrocarbon group having 1 to 6 carbon atoms, which may have a substituent.) The positive photosensitive resin composition according to any one of claims 1 to 5 , wherein the polysiloxane (A1) or the polysiloxane (A2) has an organic group having a carboxyl group or a carboxylic anhydride. The total amount of the structures represented by the general formulas (1) and (2) is 30 to 60 mol% with respect to the total amount of silicon atoms in the polysiloxane (A1) or the polysiloxane (A2). The positive photosensitive resin composition according to any one of claims 1 to 6 , wherein The positive photosensitive resin composition according to any one of claims 1 to 7 , further comprising a compound (D) having an acid anhydride group. The positive photosensitive resin composition according to any one of claims 1 to 8 , further comprising a polyfunctional monomer (E) having two or more unsaturated double bonds. Claims 1 to 3, wherein the photoradical generator (C1) or photoacid generator (C1') or the photoradical generator (C2) or photoacid generator (C2') has a maximum absorption wavelength of 300 nm to 360 nm. 9. The positive photosensitive resin composition according to any one of 9 . A method for producing a cured film in which the following steps are performed in this order.
(i) A step of applying the positive photosensitive resin composition according to any one of claims 1 to 10 onto a substrate to form a coating film.
(ii) The coating film is coated so that the total exposure to light of 365 nm, 405 nm, or 436 nm is 10 mJ/ ^m2 or more, and the total exposure to light with a wavelength of less than 350 nm is 1 mJ/m2 ^or less. A step of removing the exposed portion of the coating film by developing with a developer after pattern exposure.
(iii) After the development, the remaining coating film is treated with the photoradical generator (C1) and/or the acid generator (C1′), or the photoradical generator (C2) and/or the acid generator (C2′). ), the step of exposing so that the total exposure amount at a wavelength of 200 to 350 nm is 10 mJ/m ² or more.
(iv) a step of heating the coating film after the exposure; A cured film of the positive photosensitive resin composition according to any one of claims 1 to 10 . An optical device or electronic material comprising the cured film according to claim 12 . An optical device or electronic material comprising at least one selected from the group consisting of an optical waveguide, a planarizing film, a protective film, and an interlayer insulating film, comprising the cured film according to claim 12 .