JPWO2020196370A1 - - Google Patents

Info

Publication number
JPWO2020196370A1
JPWO2020196370A1 JP2021509369A JP2021509369A JPWO2020196370A1 JP WO2020196370 A1 JPWO2020196370 A1 JP WO2020196370A1 JP 2021509369 A JP2021509369 A JP 2021509369A JP 2021509369 A JP2021509369 A JP 2021509369A JP WO2020196370 A1 JPWO2020196370 A1 JP WO2020196370A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021509369A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196370A1 publication Critical patent/JPWO2020196370A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2021509369A 2019-03-26 2020-03-23 Pending JPWO2020196370A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019058621 2019-03-26
PCT/JP2020/012623 WO2020196370A1 (ja) 2019-03-26 2020-03-23 研磨用組成物

Publications (1)

Publication Number Publication Date
JPWO2020196370A1 true JPWO2020196370A1 (zh) 2020-10-01

Family

ID=72611033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509369A Pending JPWO2020196370A1 (zh) 2019-03-26 2020-03-23

Country Status (3)

Country Link
JP (1) JPWO2020196370A1 (zh)
TW (1) TW202100710A (zh)
WO (1) WO2020196370A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023063027A1 (ja) * 2021-10-12 2023-04-20 株式会社フジミインコーポレーテッド 研磨用組成物
WO2023189812A1 (ja) * 2022-03-31 2023-10-05 株式会社フジミインコーポレーテッド 研磨用組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4372237B2 (ja) * 1997-12-24 2009-11-25 花王株式会社 磁気記録媒体用基板の研磨方法
TWI563073B (en) * 2014-06-03 2016-12-21 Cabot Microelectronics Corp Cmp compositions and methods for polishing rigid disk surfaces
US9481811B2 (en) * 2015-02-20 2016-11-01 Cabot Microelectronics Corporation Composition and method for polishing memory hard disks exhibiting reduced edge roll-off
US20190300821A1 (en) * 2016-09-28 2019-10-03 Fujimi Incorporated Surface treatment composition
JP7208019B2 (ja) * 2017-02-17 2023-01-18 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法および研磨用組成物を用いた研磨方法

Also Published As

Publication number Publication date
TW202100710A (zh) 2021-01-01
WO2020196370A1 (ja) 2020-10-01

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