JPWO2020196130A1 - - Google Patents
Info
- Publication number
- JPWO2020196130A1 JPWO2020196130A1 JP2021509242A JP2021509242A JPWO2020196130A1 JP WO2020196130 A1 JPWO2020196130 A1 JP WO2020196130A1 JP 2021509242 A JP2021509242 A JP 2021509242A JP 2021509242 A JP2021509242 A JP 2021509242A JP WO2020196130 A1 JPWO2020196130 A1 JP WO2020196130A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019054996 | 2019-03-22 | ||
| PCT/JP2020/011877 WO2020196130A1 (ja) | 2019-03-22 | 2020-03-18 | フィルム状接着剤及び半導体加工用シート |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2020196130A1 true JPWO2020196130A1 (de) | 2020-10-01 |
Family
ID=72610148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021509242A Pending JPWO2020196130A1 (de) | 2019-03-22 | 2020-03-18 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2020196130A1 (de) |
| WO (1) | WO2020196130A1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022152297A (ja) | 2021-03-29 | 2022-10-12 | リンテック株式会社 | 支持シート、樹脂膜形成用複合シート、キット、及び、樹脂膜付きチップの製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2877309B2 (ja) * | 1988-01-06 | 1999-03-31 | 株式会社東芝 | ゴム変性フェノール樹脂の製造方法 |
| JP5727811B2 (ja) * | 2011-02-10 | 2015-06-03 | リンテック株式会社 | 半導体チップのピックアップ方法および半導体装置の製造方法 |
| KR102221484B1 (ko) * | 2014-03-24 | 2021-02-26 | 린텍 가부시키가이샤 | 보호막 형성 필름, 보호막 형성용 시트 및 가공물의 제조 방법 |
| WO2015146254A1 (ja) * | 2014-03-26 | 2015-10-01 | リンテック株式会社 | 樹脂膜形成用シート積層体 |
| JP7282076B2 (ja) * | 2018-03-23 | 2023-05-26 | リンテック株式会社 | フィルム状接着剤及び半導体加工用シート |
-
2020
- 2020-03-18 JP JP2021509242A patent/JPWO2020196130A1/ja active Pending
- 2020-03-18 WO PCT/JP2020/011877 patent/WO2020196130A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020196130A1 (ja) | 2020-10-01 |
| TW202101607A (zh) | 2021-01-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221226 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240109 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240308 |