JPWO2020195636A1 - - Google Patents

Info

Publication number
JPWO2020195636A1
JPWO2020195636A1 JP2021508909A JP2021508909A JPWO2020195636A1 JP WO2020195636 A1 JPWO2020195636 A1 JP WO2020195636A1 JP 2021508909 A JP2021508909 A JP 2021508909A JP 2021508909 A JP2021508909 A JP 2021508909A JP WO2020195636 A1 JPWO2020195636 A1 JP WO2020195636A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021508909A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020195636A1 publication Critical patent/JPWO2020195636A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021508909A 2019-03-22 2020-03-04 Pending JPWO2020195636A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019054928 2019-03-22
PCT/JP2020/009111 WO2020195636A1 (fr) 2019-03-22 2020-03-04 Structure et dispositif de montage de tranche et structure de substrat

Publications (1)

Publication Number Publication Date
JPWO2020195636A1 true JPWO2020195636A1 (fr) 2020-10-01

Family

ID=72608608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508909A Pending JPWO2020195636A1 (fr) 2019-03-22 2020-03-04

Country Status (2)

Country Link
JP (1) JPWO2020195636A1 (fr)
WO (1) WO2020195636A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213455A (ja) * 1996-02-05 1997-08-15 Kyocera Corp ウエハ保持装置の給電構造
JPH1174336A (ja) * 1997-08-29 1999-03-16 Kyocera Corp ウエハ支持部材
JP2001007190A (ja) * 1999-02-17 2001-01-12 Applied Materials Inc 多層電極を有する薄板状セラミック及び製造方法
JP2012129356A (ja) * 2010-12-15 2012-07-05 Tokyo Electron Ltd プラズマ処理装置、プラズマ処理方法、および記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213455A (ja) * 1996-02-05 1997-08-15 Kyocera Corp ウエハ保持装置の給電構造
JPH1174336A (ja) * 1997-08-29 1999-03-16 Kyocera Corp ウエハ支持部材
JP2001007190A (ja) * 1999-02-17 2001-01-12 Applied Materials Inc 多層電極を有する薄板状セラミック及び製造方法
JP2012129356A (ja) * 2010-12-15 2012-07-05 Tokyo Electron Ltd プラズマ処理装置、プラズマ処理方法、および記憶媒体

Also Published As

Publication number Publication date
WO2020195636A1 (fr) 2020-10-01

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