JPWO2020189115A1 - - Google Patents

Info

Publication number
JPWO2020189115A1
JPWO2020189115A1 JP2021506240A JP2021506240A JPWO2020189115A1 JP WO2020189115 A1 JPWO2020189115 A1 JP WO2020189115A1 JP 2021506240 A JP2021506240 A JP 2021506240A JP 2021506240 A JP2021506240 A JP 2021506240A JP WO2020189115 A1 JPWO2020189115 A1 JP WO2020189115A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021506240A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020189115A1 publication Critical patent/JPWO2020189115A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02551—Characteristics of substrate, e.g. cutting angles of quartz substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021506240A 2019-03-15 2020-02-14 Pending JPWO2020189115A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019048335 2019-03-15
PCT/JP2020/005744 WO2020189115A1 (ja) 2019-03-15 2020-02-14 複合基板、電子デバイス、複合基板の製造方法及び電子デバイスの製造方法

Publications (1)

Publication Number Publication Date
JPWO2020189115A1 true JPWO2020189115A1 (ja) 2020-09-24

Family

ID=72520126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021506240A Pending JPWO2020189115A1 (ja) 2019-03-15 2020-02-14

Country Status (2)

Country Link
JP (1) JPWO2020189115A1 (ja)
WO (1) WO2020189115A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115943565A (zh) * 2021-06-09 2023-04-07 日本碍子株式会社 复合基板及复合基板的制造方法
WO2023189103A1 (ja) * 2022-03-28 2023-10-05 日本碍子株式会社 複合基板、弾性表面波素子および複合基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001052334A (ja) * 1999-08-04 2001-02-23 Okamoto Glass Co Ltd 磁気ディスク用基板素材およびその製造法
JP5039362B2 (ja) * 2006-11-07 2012-10-03 太陽誘電株式会社 弾性波デバイス
WO2011065317A1 (ja) * 2009-11-26 2011-06-03 株式会社村田製作所 圧電デバイス及び圧電デバイスの製造方法
WO2013018603A1 (ja) * 2011-07-29 2013-02-07 株式会社村田製作所 弾性波デバイスの製造方法
WO2016017435A1 (ja) * 2014-07-30 2016-02-04 日本電気硝子株式会社 結晶化ガラス
JP2016074598A (ja) * 2015-11-18 2016-05-12 日本電気硝子株式会社 珪酸塩ガラスの製造方法
JP2018093329A (ja) * 2016-12-01 2018-06-14 日本碍子株式会社 弾性波素子
JP7224094B2 (ja) * 2017-06-26 2023-02-17 太陽誘電株式会社 弾性波共振器、フィルタおよびマルチプレクサ
JP2019029941A (ja) * 2017-08-02 2019-02-21 株式会社ディスコ 弾性波デバイス用基板の製造方法

Also Published As

Publication number Publication date
WO2020189115A1 (ja) 2020-09-24

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