JPWO2020188780A1 - - Google Patents

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Publication number
JPWO2020188780A1
JPWO2020188780A1 JP2021506917A JP2021506917A JPWO2020188780A1 JP WO2020188780 A1 JPWO2020188780 A1 JP WO2020188780A1 JP 2021506917 A JP2021506917 A JP 2021506917A JP 2021506917 A JP2021506917 A JP 2021506917A JP WO2020188780 A1 JPWO2020188780 A1 JP WO2020188780A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021506917A
Other languages
Japanese (ja)
Other versions
JP7224437B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2020188780A1 publication Critical patent/JPWO2020188780A1/ja
Application granted granted Critical
Publication of JP7224437B2 publication Critical patent/JP7224437B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2021506917A 2019-03-19 2019-03-19 レーザー転写装置、及び、レーザー転写方法 Active JP7224437B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/011611 WO2020188780A1 (ja) 2019-03-19 2019-03-19 レーザー転写装置、及び、レーザー転写方法

Publications (2)

Publication Number Publication Date
JPWO2020188780A1 true JPWO2020188780A1 (zh) 2020-09-24
JP7224437B2 JP7224437B2 (ja) 2023-02-17

Family

ID=72519812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021506917A Active JP7224437B2 (ja) 2019-03-19 2019-03-19 レーザー転写装置、及び、レーザー転写方法

Country Status (3)

Country Link
JP (1) JP7224437B2 (zh)
TW (1) TWI802665B (zh)
WO (1) WO2020188780A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202213480A (zh) * 2020-09-29 2022-04-01 日商信越化學工業股份有限公司 元件的移載方法、元件移載機、對象物的移載方法以及對象物的移載機
WO2022230184A1 (ja) * 2021-04-30 2022-11-03 信越エンジニアリング株式会社 転写装置及び転写方法
JP2022187380A (ja) * 2021-06-07 2022-12-19 株式会社ジャパンディスプレイ 表示装置の製造方法
EP4375002A1 (en) * 2021-07-20 2024-05-29 Shin-Etsu Chemical Co., Ltd. Scanning-type reduction projection optical system and laser machining apparatus using same
TWI787933B (zh) 2021-08-02 2022-12-21 錼創顯示科技股份有限公司 巨量轉移設備
CN113594308A (zh) * 2021-08-02 2021-11-02 錼创显示科技股份有限公司 巨量转移设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006041500A (ja) * 2004-06-23 2006-02-09 Sony Corp 素子の転写方法、素子の間引き方法及び素子の転写装置
JP2010245557A (ja) * 2003-10-22 2010-10-28 Oki Data Corp 半導体装置の製造方法
JP2010251360A (ja) * 2009-04-10 2010-11-04 Sony Corp 表示装置の製造方法および表示装置
JP2014183109A (ja) * 2013-03-18 2014-09-29 Nichia Chem Ind Ltd 発光素子保持構造体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010245557A (ja) * 2003-10-22 2010-10-28 Oki Data Corp 半導体装置の製造方法
JP2006041500A (ja) * 2004-06-23 2006-02-09 Sony Corp 素子の転写方法、素子の間引き方法及び素子の転写装置
JP2010251360A (ja) * 2009-04-10 2010-11-04 Sony Corp 表示装置の製造方法および表示装置
JP2014183109A (ja) * 2013-03-18 2014-09-29 Nichia Chem Ind Ltd 発光素子保持構造体

Also Published As

Publication number Publication date
TW202036927A (zh) 2020-10-01
JP7224437B2 (ja) 2023-02-17
WO2020188780A1 (ja) 2020-09-24
TWI802665B (zh) 2023-05-21

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