JPWO2020188641A1 - - Google Patents
Info
- Publication number
- JPWO2020188641A1 JPWO2020188641A1 JP2021506805A JP2021506805A JPWO2020188641A1 JP WO2020188641 A1 JPWO2020188641 A1 JP WO2020188641A1 JP 2021506805 A JP2021506805 A JP 2021506805A JP 2021506805 A JP2021506805 A JP 2021506805A JP WO2020188641 A1 JPWO2020188641 A1 JP WO2020188641A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/010896 WO2020188641A1 (ja) | 2019-03-15 | 2019-03-15 | エポキシ樹脂組成物、電子部品装置及び電子部品装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020188641A1 true JPWO2020188641A1 (ja) | 2020-09-24 |
Family
ID=72519248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021506805A Pending JPWO2020188641A1 (ja) | 2019-03-15 | 2019-03-15 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2020188641A1 (ja) |
WO (1) | WO2020188641A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03229717A (ja) * | 1990-02-02 | 1991-10-11 | Shin Etsu Chem Co Ltd | プロペニル基含有フェノール樹脂 |
JPH04314723A (ja) * | 1991-04-15 | 1992-11-05 | Fujitsu Ltd | エポキシ樹脂組成物 |
JPH07138201A (ja) * | 1993-11-17 | 1995-05-30 | Dai Ichi Kogyo Seiyaku Co Ltd | モノアリルナフトール化合物、該化合物を含有するエポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2009235165A (ja) * | 2008-03-26 | 2009-10-15 | Dic Corp | エポキシ樹脂組成物、及びその硬化物 |
JP2010077310A (ja) * | 2008-09-26 | 2010-04-08 | Sumitomo Bakelite Co Ltd | 回路基板用樹脂組成物、プリプレグおよび積層板 |
WO2016125664A1 (ja) * | 2015-02-05 | 2016-08-11 | 味の素株式会社 | 樹脂組成物 |
-
2019
- 2019-03-15 WO PCT/JP2019/010896 patent/WO2020188641A1/ja active Application Filing
- 2019-03-15 JP JP2021506805A patent/JPWO2020188641A1/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03229717A (ja) * | 1990-02-02 | 1991-10-11 | Shin Etsu Chem Co Ltd | プロペニル基含有フェノール樹脂 |
JPH04314723A (ja) * | 1991-04-15 | 1992-11-05 | Fujitsu Ltd | エポキシ樹脂組成物 |
JPH07138201A (ja) * | 1993-11-17 | 1995-05-30 | Dai Ichi Kogyo Seiyaku Co Ltd | モノアリルナフトール化合物、該化合物を含有するエポキシ樹脂用硬化剤およびエポキシ樹脂組成物 |
JP2009235165A (ja) * | 2008-03-26 | 2009-10-15 | Dic Corp | エポキシ樹脂組成物、及びその硬化物 |
JP2010077310A (ja) * | 2008-09-26 | 2010-04-08 | Sumitomo Bakelite Co Ltd | 回路基板用樹脂組成物、プリプレグおよび積層板 |
WO2016125664A1 (ja) * | 2015-02-05 | 2016-08-11 | 味の素株式会社 | 樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
WO2020188641A1 (ja) | 2020-09-24 |
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