JPWO2020188641A1 - - Google Patents

Info

Publication number
JPWO2020188641A1
JPWO2020188641A1 JP2021506805A JP2021506805A JPWO2020188641A1 JP WO2020188641 A1 JPWO2020188641 A1 JP WO2020188641A1 JP 2021506805 A JP2021506805 A JP 2021506805A JP 2021506805 A JP2021506805 A JP 2021506805A JP WO2020188641 A1 JPWO2020188641 A1 JP WO2020188641A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021506805A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020188641A1 publication Critical patent/JPWO2020188641A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021506805A 2019-03-15 2019-03-15 Pending JPWO2020188641A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/010896 WO2020188641A1 (ja) 2019-03-15 2019-03-15 エポキシ樹脂組成物、電子部品装置及び電子部品装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2020188641A1 true JPWO2020188641A1 (ja) 2020-09-24

Family

ID=72519248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021506805A Pending JPWO2020188641A1 (ja) 2019-03-15 2019-03-15

Country Status (2)

Country Link
JP (1) JPWO2020188641A1 (ja)
WO (1) WO2020188641A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03229717A (ja) * 1990-02-02 1991-10-11 Shin Etsu Chem Co Ltd プロペニル基含有フェノール樹脂
JPH04314723A (ja) * 1991-04-15 1992-11-05 Fujitsu Ltd エポキシ樹脂組成物
JPH07138201A (ja) * 1993-11-17 1995-05-30 Dai Ichi Kogyo Seiyaku Co Ltd モノアリルナフトール化合物、該化合物を含有するエポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2009235165A (ja) * 2008-03-26 2009-10-15 Dic Corp エポキシ樹脂組成物、及びその硬化物
JP2010077310A (ja) * 2008-09-26 2010-04-08 Sumitomo Bakelite Co Ltd 回路基板用樹脂組成物、プリプレグおよび積層板
WO2016125664A1 (ja) * 2015-02-05 2016-08-11 味の素株式会社 樹脂組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03229717A (ja) * 1990-02-02 1991-10-11 Shin Etsu Chem Co Ltd プロペニル基含有フェノール樹脂
JPH04314723A (ja) * 1991-04-15 1992-11-05 Fujitsu Ltd エポキシ樹脂組成物
JPH07138201A (ja) * 1993-11-17 1995-05-30 Dai Ichi Kogyo Seiyaku Co Ltd モノアリルナフトール化合物、該化合物を含有するエポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP2009235165A (ja) * 2008-03-26 2009-10-15 Dic Corp エポキシ樹脂組成物、及びその硬化物
JP2010077310A (ja) * 2008-09-26 2010-04-08 Sumitomo Bakelite Co Ltd 回路基板用樹脂組成物、プリプレグおよび積層板
WO2016125664A1 (ja) * 2015-02-05 2016-08-11 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
WO2020188641A1 (ja) 2020-09-24

Similar Documents

Publication Publication Date Title
BR112019017762A2 (ja)
BR112021017339A2 (ja)
BR112021013854A2 (ja)
BR112021018450A2 (ja)
BR112021017939A2 (ja)
BR112021017892A2 (ja)
BR112019016141A2 (ja)
AU2020104490A4 (ja)
BR112021017738A2 (ja)
BR112021017782A2 (ja)
BR112019016138A2 (ja)
BR112019016142A2 (ja)
BR112021018168A2 (ja)
BR112021017728A2 (ja)
BR112021008711A2 (ja)
BR112021017234A2 (ja)
BR112021017355A2 (ja)
BR112021017173A2 (ja)
BR112021018102A2 (ja)
BR112021017083A2 (ja)
BR112021017637A2 (ja)
BR112021018452A2 (ja)
BR112021012348A2 (ja)
BR112021018250A2 (ja)
BR112021018093A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220131

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221206

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230404

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230718

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230914

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20231128